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FD400R33KF2CNOSA1

Infineon Technologies

FD400R33KF2CNOSA1 by Infineon Technologies

Infineon's FD400R33KF2CNOSA1 is an N-CHANNEL IGBT with 3300V VCE, 660A IC, and 4800W power dissipation. Ideal for power control applications due to its 1900ns turn-off time and 480ns turn-on time. Package style is flange mount with isolated case connection.

Median Price

$1,742.125

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 115 parts In-Stock

1+ parts

$1,393.700

100+ parts

$1,310.080

1k+ parts

$1,226.460

10k+ parts

-

115

$1,393.700

$1,310.080

$1,226.460

-

Verical

USA . 49 parts In-Stock

1+ parts

$1,742.125

100+ parts

$1,637.600

1k+ parts

$1,533.075

10k+ parts

-

49

$1,742.125

$1,637.600

$1,533.075

-

DigiKey

USA . 115 parts In-Stock

1+ parts

$1,742.130

100+ parts

-

1k+ parts

-

10k+ parts

-

115

$1,742.130

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 718 parts In-Stock

1+ parts

$1,541.185

100+ parts

-

1k+ parts

-

10k+ parts

-

718

$1,541.185

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-

-

Vyrian

USA . 5,699 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,699

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 15,518 parts In-Stock

1+ parts

$1.290

100+ parts

$1.238

1k+ parts

$1.187

10k+ parts

-

15,518

$1.290

$1.238

$1.187

-

Native Components

USA . 622 parts In-Stock

1+ parts

$31.962

100+ parts

-

1k+ parts

-

10k+ parts

$30.684

622

$31.962

-

-

$30.684

Northwest PG Solutions

USA . 475 parts In-Stock

1+ parts

$35.158

100+ parts

-

1k+ parts

-

10k+ parts

-

475

$35.158

-

-

-

Corphita

USA . 700 parts In-Stock

1+ parts

$1,460.070

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$1,460.070

-

-

-

Microchip USA

USA . 3,209 parts In-Stock

1+ parts

$1,557.790

100+ parts

-

1k+ parts

-

10k+ parts

-

3,209

$1,557.790

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-

-

Overview

Unlock the power of precision with the FD400R33KF2CNOSA1 by Infineon Technologies. As a leader in insulated gate bipolar transistors, Infineon delivers unmatched quality and reliability. Ideal for power control applications, this N-channel transistor offers a single configuration with a built-in diode for seamless operation. With a maximum collector-emitter voltage of 3300V and a maximum collector current of 660A, this transistor provides unparalleled performance. Trust Infineon to provide cutting-edge technology for all your power control needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL polarity allows for efficient power control and low ON-state voltage drop, making the product suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode provides protection against reverse current flow and enhances the efficiency of power control operations, making the product reliable for various applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT offers high performance and reliability in managing power efficiently in different systems.

Maximum VCEsat: 4.25 V

Low VCEsat value indicates minimal voltage drop across collector-emitter terminals, ensuring efficient power conversion and reduced power losses in the system.

Package Shape: RECTANGULAR

Rectangular package shape offers convenient mounting and installation options, making it easier to integrate the IGBT into various electronic devices and systems.

Nominal Turn Off Time (toff): 1900 ns

Fast turn off time ensures quick switching operation, reducing transition losses and improving overall efficiency of power control in the system.

No. of Terminals: 5

Having 5 terminals allows for versatile connection options and easy integration with other electronic components, enhancing the flexibility and functionality of the product.

Maximum Power Dissipation (Abs): 4800 W

High power dissipation capability indicates the product's ability to handle large power loads without overheating, ensuring long-term reliability and performance.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure mechanical mounting and efficient heat dissipation, improving the overall reliability and longevity of the product in demanding environments.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance allows the IGBT to perform reliably in harsh environmental conditions without compromising its functionality, making it suitable for a wide range of applications.

Maximum Collector-Emitter Voltage: 3300 V

High maximum collector-emitter voltage rating enables the IGBT to handle high voltage levels, making it suitable for power control applications requiring robust voltage handling capabilities.

Transistor Element Material: SILICON

Silicon material provides excellent performance characteristics, high reliability, and durability, making the IGBT suitable for long-term operation in demanding applications.

Maximum Gate-Emitter Voltage: 20 V

Maximum gate-emitter voltage ensures reliable and efficient gate control, facilitating precise switching operation and enhancing the overall performance of the IGBT in power control applications.

Maximum Collector Current (IC): 660 A

High maximum collector current rating allows the IGBT to handle large current loads, making it suitable for high-power applications where robust current handling capabilities are required.

Terminal Position: UPPER

Upper terminal position enhances the ease of connection and integration with other components, ensuring convenient installation and maintenance of the product in various electronic systems.

Case Connection: ISOLATED

Isolated case connection provides electrical insulation and eliminates the risk of short circuits, enhancing the safety and reliability of the product in different operating environments.

Nominal Turn On Time (ton): 480 ns

Fast turn on time ensures quick response and precise control during power switching operations, improving the overall efficiency and performance of the IGBT in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FD400R33KF2CNOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

3300 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X5

No. of Elements:

1

No. of Terminals:

5

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1900 ns

Nominal Turn On Time (ton):

480 ns

Maximum VCEsat:

4.25 V

Trade Compliance

FD400R33KF2CNOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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