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FD1000R33HL3KBPSA1

Infineon Technologies

FD1000R33HL3KBPSA1 by Infineon Technologies

Infineon's FD1000R33HL3KBPSA1 is a N-CHANNEL IGBT with 2 elements & built-in diode. It has a max Vce of 3300V, toff of 4700ns, and ton of 1050ns. Ideal for power control applications due to its common gate configuration and isolated case connection in a rectangular package style.

Median Price

$1,964.810

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 96 parts In-Stock

1+ parts

$1,571.850

100+ parts

$1,477.540

1k+ parts

$1,383.230

10k+ parts

-

96

$1,571.850

$1,477.540

$1,383.230

-

DigiKey

USA . 96 parts In-Stock

1+ parts

$1,964.810

100+ parts

-

1k+ parts

-

10k+ parts

-

96

$1,964.810

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-

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Verical

USA . 58 parts In-Stock

1+ parts

$1,964.813

100+ parts

$1,846.925

1k+ parts

$1,729.037

10k+ parts

-

58

$1,964.813

$1,846.925

$1,729.037

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 71 parts In-Stock

1+ parts

$2,137.328

100+ parts

-

1k+ parts

-

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71

$2,137.328

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-

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Digiode

USA . 453 parts In-Stock

1+ parts

$2,177.714

100+ parts

-

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-

10k+ parts

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453

$2,177.714

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Vyrian

USA . 5,571 parts In-Stock

1+ parts

-

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5,571

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 9,323 parts In-Stock

1+ parts

$0.861

100+ parts

$0.827

1k+ parts

$0.792

10k+ parts

-

9,323

$0.861

$0.827

$0.792

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AZTECH Wire

Italy . 814 parts In-Stock

1+ parts

$13.359

100+ parts

-

1k+ parts

-

10k+ parts

-

814

$13.359

-

-

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Ampacity Inc.

Singapore . 100 parts In-Stock

1+ parts

$1,948.480

100+ parts

-

1k+ parts

-

10k+ parts

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100

$1,948.480

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-

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Corphita

USA . 2 parts In-Stock

1+ parts

$2,063.097

100+ parts

-

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-

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2

$2,063.097

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-

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2,137.328

100+ parts

$2,094.582

1k+ parts

-

10k+ parts

-

100

$2,137.328

$2,094.582

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Microchip USA

USA . 2,271 parts In-Stock

1+ parts

$2,201.060

100+ parts

-

1k+ parts

-

10k+ parts

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2,271

$2,201.060

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Component Stockers USA

USA . 36 parts In-Stock

1+ parts

$2,315.550

100+ parts

-

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36

$2,315.550

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Overview

Unleash the power of the FD1000R33HL3KBPSA1 by Infineon Technologies, a cutting-edge Insulated Gate Bipolar Transistor (IGBT) designed for high-performance power control applications. With Infineon's reputation for superior quality and reliability, this N-CHANNEL transistor offers unparalleled value and benefits. Its common gate configuration and built-in diode make it ideal for a wide range of industrial and automotive applications. Elevate your projects with the FD1000R33HL3KBPSA1 and experience next-level performance like never before.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs generally have lower forward voltage drop and higher efficiency compared to P-CHANNEL IGBTs

Configuration: COMMON GATE, 2 ELEMENTS WITH BUILT-IN DIODE

Common gate configuration allows for easier gate control and the built-in diode improves reliability in power control applications

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and efficiency

Package Shape: RECTANGULAR

Rectangular shape makes it easy to mount and integrate into various electronic devices

Nominal Turn Off Time (toff): 4700 ns

Fast turn-off time allows for efficient switching and control of power

No. of Terminals: 9

Higher number of terminals provide more connectivity options and flexibility in circuit design

Maximum Collector-Emitter Voltage: 3300 V

High maximum voltage rating allows for use in high voltage applications with reliability

Transistor Element Material: SILICON

Silicon material ensures high performance and durability in power control applications

Nominal Turn On Time (ton): 1050 ns

Fast turn-on time ensures quick response and control in power switching applications

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FD1000R33HL3KBPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

3300 V

JESD-30 Code:

R-XUFM-X9

No. of Elements:

2

No. of Terminals:

9

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

4700 ns

Nominal Turn On Time (ton):

1050 ns

Trade Compliance

FD1000R33HL3KBPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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