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FD1000R33HE3KBPSA1

Infineon Technologies

FD1000R33HE3KBPSA1 by Infineon Technologies

Infineon's FD1000R33HE3KBPSA1 is a N-CHANNEL IGBT with 2 elements & built-in diode. It has a max collector-emitter voltage of 3300V, collector current of 1000A, and turn-off time of 3550ns. Ideal for power control applications due to its common gate configuration and silicon material.

Median Price

$1,672.270

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$1,672.270

100+ parts

$1,672.270

1k+ parts

$1,672.270

10k+ parts

$1,672.270

1

$1,672.270

$1,672.270

$1,672.270

$1,672.270

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 637 parts In-Stock

1+ parts

$1,588.656

100+ parts

-

1k+ parts

-

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637

$1,588.656

-

-

-

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

$2,211.066

100+ parts

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54

$2,211.066

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Vyrian

USA . 4,849 parts In-Stock

1+ parts

-

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4,849

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 700 parts In-Stock

1+ parts

$0.872

100+ parts

-

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700

$0.872

-

-

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Corohmni

South Africa . 511 parts In-Stock

1+ parts

$1.428

100+ parts

-

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511

$1.428

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Modulus Dynamics

Lithuania . 16,439 parts In-Stock

1+ parts

$1.731

100+ parts

$1.662

1k+ parts

$1.593

10k+ parts

-

16,439

$1.731

$1.662

$1.593

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AZTECH Wire

Italy . 671 parts In-Stock

1+ parts

$18.177

100+ parts

-

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10k+ parts

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671

$18.177

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Ampacity Inc.

Singapore . 1 parts In-Stock

1+ parts

$1,421.430

100+ parts

-

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1

$1,421.430

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Corphita

USA . 957 parts In-Stock

1+ parts

$1,505.043

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-

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957

$1,505.043

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Microchip USA

USA . 336 parts In-Stock

1+ parts

$1,735.030

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336

$1,735.030

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2,211.066

100+ parts

-

1k+ parts

$2,100.513

10k+ parts

$2,056.291

2,000

$2,211.066

-

$2,100.513

$2,056.291

Continental Prestige Electronics

USA . 4,041 parts In-Stock

1+ parts

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100+ parts

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4,041

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Argo Parts USA

USA . 381 parts In-Stock

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381

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Overview

Unlock the power of cutting-edge technology with the FD1000R33HE3KBPSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. Ideal for power control applications, this N-CHANNEL transistor boasts a COMMON GATE configuration with 2 elements and a built-in diode. With a maximum collector-emitter voltage of 3300V and a staggering maximum collector current of 1000A, this component is designed to handle even the most demanding tasks with ease. Experience unparalleled performance and reliability with the FD1000R33HE3KBPSA1 - your ultimate solution for all power control needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower ON-resistance and higher current-carrying capability, making them suitable for high-power applications.

Configuration: COMMON GATE, 2 ELEMENTS WITH BUILT-IN DIODE

Common gate configuration allows for easy paralleling of multiple IGBTs, providing higher current capability and improved thermal management. The built-in diode simplifies circuit design and protects against reverse current flow.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for handling high currents and voltages efficiently.

Maximum Collector-Emitter Voltage: 3300 V

With a high maximum voltage rating, this IGBT can handle high voltage spikes and surges, making it suitable for applications requiring robust over-voltage protection.

Maximum Collector Current (IC): 1000 A

Capable of handling high currents up to 1000A, this IGBT is suitable for high-power applications such as motor drives, power supplies, and inverters.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FD1000R33HE3KBPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

3300 V

JESD-30 Code:

R-XUFM-X9

No. of Elements:

2

No. of Terminals:

9

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

3550 ns

Nominal Turn On Time (ton):

1150 ns

Trade Compliance

FD1000R33HE3KBPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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