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FB10R06KL4GB1BOMA1

Infineon Technologies

FB10R06KL4GB1BOMA1 by Infineon Technologies

Infineon Technologies' FB10R06KL4GB1BOMA1 is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 15A max collector current, and 260ns nominal turn-off time. It has a complex configuration with 7 elements in a rectangular package style for flange mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,906 parts In-Stock

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Digiode

USA . 363 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Modulus Dynamics

Lithuania . 11,802 parts In-Stock

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$0.459

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$0.441

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$0.422

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AZTECH Wire

Italy . 340 parts In-Stock

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$10.542

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Semicontronic

India . 1,021 parts In-Stock

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$16.050

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$15.649

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$15.568

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Microchip USA

USA . 164 parts In-Stock

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$23.789

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Ampacity Inc.

Singapore . 1,554 parts In-Stock

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$44.050

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Continental Prestige Electronics

USA . 5,083 parts In-Stock

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Argo Parts USA

USA . 2,033 parts In-Stock

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Corphita

USA . 892 parts In-Stock

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Aranea Global

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Overview

Unleash the power of cutting-edge technology with the FB10R06KL4GB1BOMA1 by Infineon Technologies. As a leader in the industry, Infineon Technologies delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. This N-CHANNEL transistor boasts a complex configuration and 7 elements, providing unparalleled performance and reliability. Whether you're in automotive, industrial, or renewable energy applications, this product offers unmatched value with its fast turn-off time and high voltage capacity. Elevate your projects with the FB10R06KL4GB1BOMA1 and experience the difference today.

Feature Benefit Bullets

Polarity or Channel Type N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching characteristics, making them suitable for a wide range of applications.

Configuration COMPLEX

Complex configuration allows for better control and optimization of the device, leading to improved performance in demanding applications.

Package Shape RECTANGULAR

Rectangular package shape provides ease of mounting and efficient use of space in electronic circuits.

Nominal Turn Off Time (toff) 260 ns

Fast turn-off time of 260 ns allows for quick switching operations, reducing power losses and improving efficiency.

No. of Terminals 22

Higher number of terminals provide more connection options for integration into complex systems.

Maximum Collector-Emitter Voltage 600 V

Higher maximum collector-emitter voltage rating of 600 V allows for operation in high voltage applications.

Transistor Element Material SILICON

Silicon material provides good thermal conductivity and reliability, ensuring long-term performance and stability.

Maximum Collector Current (IC) 15 A

Higher maximum collector current rating of 15 A allows for handling higher power levels without overheating.

Terminal Position UPPER

Upper terminal position simplifies the layout and connection of the device in circuits.

Case Connection ISOLATED

Isolated case connection ensures safety and protection against electrical shocks or short circuits.

Nominal Turn On Time (ton) 58 ns

Fast turn-on time of 58 ns enables quick response and efficient switching, enhancing overall performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FB10R06KL4GB1BOMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

JESD-30 Code:

R-XUFM-X22

No. of Elements:

7

No. of Terminals:

22

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

260 ns

Nominal Turn On Time (ton):

58 ns

Trade Compliance

FB10R06KL4GB1BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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