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F4-100R12KS4

Infineon Technologies

F4-100R12KS4 by Infineon Technologies

F4-100R12KS4 by Infineon Technologies is an N-CHANNEL IGBT with 4 elements in a bridge configuration. It features a max VCEsat of 3.75V, 130A IC, and 660W power dissipation. Ideal for applications requiring high power handling capabilities such as industrial motor drives and renewable energy systems.

Median Price

$159.715

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 337 parts In-Stock

1+ parts

$155.620

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337

$155.620

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Vyrian

USA . 336 parts In-Stock

1+ parts

$163.810

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336

$163.810

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ACDS - Activité Composants Distribution Service

France . 133 parts In-Stock

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133

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Nova Conductors

Japan . 16 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 11,614 parts In-Stock

1+ parts

$0.538

100+ parts

$0.516

1k+ parts

$0.495

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11,614

$0.538

$0.516

$0.495

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Andel Nordic

Denmark . 875 parts In-Stock

1+ parts

$52.880

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$37.015

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$37.015

875

$52.880

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$37.015

$37.015

Corphita

USA . 634 parts In-Stock

1+ parts

$147.429

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634

$147.429

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Perfect Parts

USA . 1,239 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the F4-100R12KS4 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors that are designed for maximum efficiency and reliability. The F4-100R12KS4 boasts a unique configuration with built-in diodes and thermistors, making it a versatile choice for a wide range of applications. Experience the value and benefits of this innovative product, from its high power dissipation capabilities to its fast turn on/off times. Elevate your projects with the F4-100R12KS4 and discover a new level of performance and precision.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them ideal for high power applications.

Configuration: BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration provides a convenient setup for bridge topology applications, and the built-in diode and thermistor offer added functionality and protection.

Maximum VCEsat: 3.75 V

The low VCEsat value indicates minimal voltage drop across the collector-emitter junction, leading to reduced power losses and increased efficiency.

Maximum Power Dissipation (Abs): 660 W

With a high maximum power dissipation rating, this IGBT can handle heavy loads and high power levels without overheating.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating allows for use in applications that require high voltage handling capabilities.

Maximum Collector Current (IC): 130 A

The high collector current rating makes this IGBT suitable for applications with high current demands.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) F4-100R12KS4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X26

No. of Elements:

4

No. of Terminals:

26

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

390 ns

Nominal Turn On Time (ton):

190 ns

Maximum VCEsat:

3.75 V

Trade Compliance

F4-100R12KS4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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