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F3L25R12W1T4B27BOMA1

Infineon Technologies

F3L25R12W1T4B27BOMA1 by Infineon Technologies

Infineon's F3L25R12W1T4B27BOMA1 IGBT features 1200V VCEsat, 375ns toff, and 215W power dissipation. Ideal for power control applications with N-CHANNEL polarity, it offers fast switching and high current handling capabilities in a complex configuration.

Median Price

$34.240

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 17 parts In-Stock

1+ parts

$9.260

100+ parts

-

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17

$9.260

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-

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Farnell

UK . 23 parts In-Stock

1+ parts

$28.530

100+ parts

$18.390

1k+ parts

-

10k+ parts

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23

$28.530

$18.390

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-

Chip1Stop

Japan . 24 parts In-Stock

1+ parts

$33.000

100+ parts

-

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24

$33.000

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-

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Mouser Electronics

USA . 275 parts In-Stock

1+ parts

$35.480

100+ parts

-

1k+ parts

$25.130

10k+ parts

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275

$35.480

-

$25.130

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RS (Exports)

UK . 24 parts In-Stock

1+ parts

$39.516

100+ parts

$32.007

1k+ parts

-

10k+ parts

-

24

$39.516

$32.007

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-

Element14

Singapore . 23 parts In-Stock

1+ parts

$47.920

100+ parts

$32.070

1k+ parts

-

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23

$47.920

$32.070

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Verical

USA . 17 parts In-Stock

1+ parts

-

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17

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 315 parts In-Stock

1+ parts

$22.410

100+ parts

-

1k+ parts

-

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315

$22.410

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Vyrian

USA . 4,641 parts In-Stock

1+ parts

-

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4,641

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 22,553 parts In-Stock

1+ parts

$0.650

100+ parts

$0.624

1k+ parts

$0.598

10k+ parts

-

22,553

$0.650

$0.624

$0.598

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Ampacity Inc.

Singapore . 64 parts In-Stock

1+ parts

$19.900

100+ parts

-

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64

$19.900

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-

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Corphita

USA . 965 parts In-Stock

1+ parts

$21.231

100+ parts

-

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965

$21.231

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Continental Prestige Electronics

USA . 45 parts In-Stock

1+ parts

$29.170

100+ parts

$25.320

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-

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45

$29.170

$25.320

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Microchip USA

USA . 5,222 parts In-Stock

1+ parts

$87.101

100+ parts

-

1k+ parts

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10k+ parts

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5,222

$87.101

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

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1,500

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

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100

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Overview

Unleash the power of the F3L25R12W1T4B27BOMA1 by Infineon Technologies, a high-quality Insulated Gate Bipolar Transistor perfect for power control applications. With its N-CHANNEL polarity and complex configuration, this transistor offers unrivaled performance and reliability. Boasting a maximum VCEsat of 2.25V and maximum collector-emitter voltage of 1200V, this product delivers outstanding efficiency and durability. Whether you're working on industrial machinery or renewable energy systems, the F3L25R12W1T4B27BOMA1 is the ultimate solution for your power management needs. Experience the Infineon advantage today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making this product a good choice for power control applications.

Maximum VCEsat: 2.25 V

Low VCEsat results in lower power losses and higher efficiency, making this IGBT suitable for power control with minimal heat generation.

Maximum Power Dissipation (Abs): 215 W

With a high power dissipation rating, this IGBT can handle high-power applications without overheating, ensuring reliability and durability.

Maximum Collector-Emitter Voltage: 1200 V

The high VCE rating allows this IGBT to be used in high voltage applications, providing flexibility and versatility for power control needs.

Maximum Collector Current (IC): 45 A

A high collector current rating makes this IGBT suitable for applications that require high current handling capabilities, ensuring robust performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) F3L25R12W1T4B27BOMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X19

No. of Elements:

4

No. of Terminals:

19

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

375 ns

Nominal Turn On Time (ton):

54 ns

Maximum VCEsat:

2.25 V

Trade Compliance

F3L25R12W1T4B27BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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