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CY7B923-SXC

Infineon Technologies

CY7B923-SXC by Infineon Technologies

CY7B923-SXC by Infineon Technologies is a BICMOS technology telecom IC with 28 terminals, operating at 5V. It offers a data rate of 400 Mbps and can handle a max supply current of 0.085 mA. This small outline package is ideal for telecom circuit applications requiring high-speed data transmission.

Median Price

$260.130

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,294 parts In-Stock

1+ parts

$208.100

100+ parts

$195.610

1k+ parts

$183.130

10k+ parts

-

3,294

$208.100

$195.610

$183.130

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DigiKey

USA . 10 parts In-Stock

1+ parts

$260.130

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10

$260.130

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Verical

USA . 3,294 parts In-Stock

1+ parts

-

100+ parts

$284.637

1k+ parts

$257.375

10k+ parts

-

3,294

-

$284.637

$257.375

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Distributors (In-Stock)

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$216.210

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1,000

$216.210

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Digiode

USA . 794 parts In-Stock

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$230.128

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794

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Vyrian

USA . 1,383 parts In-Stock

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1,383

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Pegasus Components GmbH

Germany . 81 parts In-Stock

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NexGen Digital

USA . 12 parts In-Stock

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DigiKey Marketplace

USA . 10 parts In-Stock

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10

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Goldney Electronics S.L.

Spain . 7 parts In-Stock

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Cyclops Electronics Ltd

UK . 3 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,276 parts In-Stock

1+ parts

$8.627

100+ parts

$8.282

1k+ parts

$7.937

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3,276

$8.627

$8.282

$7.937

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Ampacity Inc.

Singapore . 2,102 parts In-Stock

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$205.900

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2,102

$205.900

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Netroflash

USA . 100 parts In-Stock

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$216.210

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$211.886

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100

$216.210

$211.886

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Corphita

USA . 636 parts In-Stock

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$218.016

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636

$218.016

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Microchip USA

USA . 127 parts In-Stock

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$348.810

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127

$348.810

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A-Z Elektronik GmbH

Germany . 7,292 parts In-Stock

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7,292

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Alle Elektronik GmbH

Germany . 4,861 parts In-Stock

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4,861

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Kepictronics

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 170 parts In-Stock

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170

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Overview

Unlock the potential of seamless communication with the CY7B923-SXC by Infineon Technologies. Manufactured with precision and expertise, this telecom interface IC offers unparalleled reliability and performance. Ideal for various applications in the telecom industry, this product boasts a small outline package design, nickel palladium gold terminal finish, and a data rate of 400 Mbps. Experience the value and benefits of this innovative solution, designed to exceed customer expectations and elevate your communication systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes the installation process easier and more efficient, saving time and effort.

Power Supplies (V): 5

Operating at 5 volts provides a stable power supply for the device's functions.

No. of Terminals: 28

Having multiple terminals allows for versatile connectivity options and compatibility with various systems.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can perform reliably even in elevated temperature environments.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures functionality in a wide range of conditions.

Technology: BICMOS

Utilizing BICMOS technology allows for high-speed performance and efficient power consumption.

Data Rate: 400 Mbps

Supporting a high data rate of 400 Mbps enables fast and efficient data transfer for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs CY7B923-SXC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

Data Rate:

400 Mbps

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.905 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.67 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.085 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

7.505 mm

Trade Compliance

CY7B923-SXC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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