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BTS142DXT

Infineon Technologies

BTS142DXT by Infineon Technologies

BTS142DXT by Infineon Technologies is a MOS technology peripheral driver with built-in protections for transient, over current, and over voltage. It has a nominal voltage of 12V and a nominal output peak current limit of 45A. This small outline package is ideal for applications requiring sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

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Vyrian

USA . 310 parts In-Stock

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310

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Digiode

USA . 132 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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VNN

France . 45 parts In-Stock

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45

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Semicontronic

India . 346 parts In-Stock

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$0.500

100+ parts

$0.488

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$0.485

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346

$0.500

$0.488

$0.485

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AZTECH Wire

Italy . 310 parts In-Stock

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$5.387

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Ampacity Inc.

Singapore . 1,341 parts In-Stock

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$6.500

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Aztec Data Supply Inc.

USA . 1,284 parts In-Stock

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$7.096

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Corohmni

South Africa . 291 parts In-Stock

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$9.671

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Modulus Dynamics

Lithuania . 3,878 parts In-Stock

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$12.612

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$12.108

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$11.603

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3,878

$12.612

$12.108

$11.603

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Continental Prestige Electronics

USA . 5,391 parts In-Stock

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Argo Parts USA

USA . 897 parts In-Stock

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Corphita

USA . 308 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the BTS142DXT by Infineon Technologies. As a leader in peripheral drivers, Infineon delivers top-notch quality and reliability. This compact rectangular package is equipped with built-in protections against transient events, over current, over voltage, and thermal issues. With a nominal supply voltage of 12V and a peak output current limit of 45A, this MOS-based device offers unmatched performance and efficiency. Whether you're working on automotive applications, industrial controls, or consumer electronics, the BTS142DXT provides the perfect solution for your needs. Experience the value and benefits of Infineon's innovative product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the peripheral driver, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and secure mounting onto circuit boards, saving time and effort during installation.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Multiple built-in protections ensure the safety of connected devices and prevent damage from unexpected electrical issues.

Nominal Supply Voltage: 12 V

Compatible with a common supply voltage, making it versatile and suitable for various applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type provides flexibility in driving external peripherals, enhancing compatibility.

Technical Specifications

Peripheral Drivers BTS142DXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

45 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.5 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

2.28 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

120 us

Turn-on Time:

120 us

Width:

6.22 mm

Trade Compliance

BTS142DXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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