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BTS133TCXT

Infineon Technologies

BTS133TCXT by Infineon Technologies

BTS133TCXT by Infineon Technologies is a MOS technology peripheral driver with built-in protections for transient, over current, and over voltage. It has a nominal output peak current limit of 7A and turn-on time of 100us. This small outline package is ideal for applications requiring sink output current flow direction in a compact form factor.

Median Price

$2.313

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2.313

100+ parts

-

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50

$2.313

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VNN

France . 4,453 parts In-Stock

1+ parts

-

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4,453

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Vyrian

USA . 889 parts In-Stock

1+ parts

-

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889

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Digiode

USA . 689 parts In-Stock

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689

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$2.267

100+ parts

-

1k+ parts

$2.176

10k+ parts

-

1,000

$2.267

-

$2.176

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Continental Prestige Electronics

USA . 4,190 parts In-Stock

1+ parts

$2.313

100+ parts

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1k+ parts

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10k+ parts

$2.267

4,190

$2.313

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$2.267

Argo Parts USA

USA . 2,527 parts In-Stock

1+ parts

$2.313

100+ parts

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2,527

$2.313

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Corohmni

South Africa . 161 parts In-Stock

1+ parts

$9.435

100+ parts

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161

$9.435

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Modulus Dynamics

Lithuania . 4,346 parts In-Stock

1+ parts

$11.248

100+ parts

$10.798

1k+ parts

$10.348

10k+ parts

-

4,346

$11.248

$10.798

$10.348

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Aztec Data Supply Inc.

USA . 4,096 parts In-Stock

1+ parts

$12.209

100+ parts

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4,096

$12.209

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AZTECH Wire

Italy . 349 parts In-Stock

1+ parts

$17.361

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349

$17.361

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Ampacity Inc.

Singapore . 678 parts In-Stock

1+ parts

$21.500

100+ parts

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678

$21.500

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Corphita

USA . 718 parts In-Stock

1+ parts

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718

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Overview

Elevate your electronics with the BTS133TCXT by Infineon Technologies, a top-tier manufacturer known for its quality and innovation. This peripheral driver offers built-in protections against transient, over current, over voltage, and thermal issues, ensuring reliable performance. With a compact rectangular package design and Gull Wing terminal form, this product is versatile and easy to integrate into various applications. Experience seamless operation and enhanced efficiency with the BTS133TCXT, providing exceptional value and benefits to customers seeking premium solutions for their electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and low cost, making it a reliable choice for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation and compact design, saving space on a circuit board.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standard form factor that is widely compatible with various applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The multiple built-in protections ensure the safety and longevity of the connected devices.

No. of Terminals: 2

With only two terminals, this product is easy to install and minimizes the risk of wiring errors.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for efficient circuit board layout.

Terminal Position: SINGLE

The single terminal position simplifies the installation process and reduces the risk of connection issues.

Maximum Seated Height: 4.5 mm

The low seated height enables this product to be used in compact electronic devices.

Width: 9.25 mm

The narrow width makes this product suitable for applications where space is limited.

Length: 10 mm

The compact length of this product offers versatility in various circuit board designs.

Technical Specifications

Peripheral Drivers BTS133TCXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Additional Features:

SEATED HGT-NOM; SEATED HGT-CALCULATED

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

Length:

10 mm

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

4.5 mm

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Turn-off Time:

170 us

Turn-on Time:

100 us

Width:

9.25 mm

Trade Compliance

BTS133TCXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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