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BTS141E3045A

Infineon Technologies

BTS141E3045A by Infineon Technologies

BTS141E3045A by Infineon Technologies is a MOS technology peripheral driver with built-in protections for over current, over voltage, and thermal issues. It operates at a nominal voltage of 5V and has a max output peak current limit of 35A. This small outline package is suitable for applications requiring sink output current flow direction.

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Cyclops Electronics Ltd

UK . 7,811 parts In-Stock

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Digiode

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Vyrian

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Nova Conductors

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Bristol Electronics

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Atlantic Semiconductor

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Corohmni

South Africa . 243 parts In-Stock

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$7.291

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Modulus Dynamics

Lithuania . 546 parts In-Stock

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$9.601

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$9.217

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$8.833

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Aztec Data Supply Inc.

USA . 2,706 parts In-Stock

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$12.256

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AZTECH Wire

Italy . 362 parts In-Stock

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Andel Nordic

Denmark . 5,198 parts In-Stock

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Ampacity Inc.

Singapore . 2,190 parts In-Stock

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$40.500

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Component Stockers USA

USA . 498 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Argo Parts USA

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Lixinc

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 2,343 parts In-Stock

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Alle Elektronik GmbH

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Assy Fe

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Continental Prestige Electronics

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Corphita

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Metaverse IC Inc.

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Bastille Electronics

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Perfect Parts

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Overview

Unlock the power of precision with the BTS141E3045A by Infineon Technologies. Crafted with top-notch quality and cutting-edge technology, this peripheral driver offers unrivaled protection against over current, over voltage, and thermal issues. Ideal for a wide range of applications, this product ensures seamless performance and reliability. Elevate your projects with Infineon's BTS141E3045A, delivering exceptional value and benefits to meet all your needs. Trust in the expertise of Infineon Technologies and experience the advantages of superior quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making this peripheral driver suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; THERMAL

Built-in protections ensure the safety and reliability of the connected devices by preventing damage from over current, over voltage, and thermal issues.

Power Supplies (V): 12

Operating at a power supply of 12V provides sufficient voltage for the peripheral driver to function effectively with compatible devices.

No. of Terminals: 2

Having 2 terminals simplifies the connection process and reduces the complexity of the circuit, making it user-friendly.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for applications where size constraints are a concern.

Technology: MOS

MOS technology offers higher efficiency and faster switching speeds, improving the overall performance of the peripheral driver.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with a wide range of devices that require lower voltage levels.

Nominal Output Peak Current Limit: 35 A

The high output peak current limit of 35A allows the peripheral driver to handle heavy loads and sudden spikes in current without malfunctioning.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type offers flexibility in driving various types of peripherals, making this peripheral driver a versatile choice.

Technical Specifications

Peripheral Drivers BTS141E3045A attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PSSO-G2

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

35 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.55TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

225

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

4.5 mm

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Turn-off Time:

170 us

Turn-on Time:

100 us

Width:

9.2 mm

Trade Compliance

BTS141E3045A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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