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BSM300GA170DLCHOSA1

Infineon Technologies

BSM300GA170DLCHOSA1 by Infineon Technologies

Infineon's BSM300GA170DLCHOSA1 is an N-CHANNEL IGBT with 1700V max collector-emitter voltage and 600A max collector current. It features a single configuration with built-in diode, 930ns turn off time, and 200ns turn on time. Ideal for high-power applications requiring fast switching capabilities in isolated case connections.

Median Price

$174.252

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 838 parts In-Stock

1+ parts

$160.230

100+ parts

$150.620

1k+ parts

$141.000

10k+ parts

-

838

$160.230

$150.620

$141.000

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Verical

USA . 835 parts In-Stock

1+ parts

-

100+ parts

$188.275

1k+ parts

$176.250

10k+ parts

-

835

-

$188.275

$176.250

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 709 parts In-Stock

1+ parts

$177.184

100+ parts

-

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709

$177.184

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Vyrian

USA . 5,332 parts In-Stock

1+ parts

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5,332

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,438 parts In-Stock

1+ parts

$1.569

100+ parts

$1.506

1k+ parts

$1.443

10k+ parts

-

3,438

$1.569

$1.506

$1.443

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AZTECH Wire

Italy . 995 parts In-Stock

1+ parts

$11.370

100+ parts

-

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-

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995

$11.370

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Native Components

USA . 626 parts In-Stock

1+ parts

$47.416

100+ parts

-

1k+ parts

-

10k+ parts

$45.520

626

$47.416

-

-

$45.520

Northwest PG Solutions

USA . 1,535 parts In-Stock

1+ parts

$52.158

100+ parts

-

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1,535

$52.158

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Corphita

USA . 773 parts In-Stock

1+ parts

$167.859

100+ parts

-

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773

$167.859

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Microchip USA

USA . 311 parts In-Stock

1+ parts

$268.560

100+ parts

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311

$268.560

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

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2,500

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Overview

Discover the power of the BSM300GA170DLCHOSA1 by Infineon Technologies, a top-of-the-line Insulated Gate Bipolar Transistor (IGBT) designed for optimal performance and reliability. With its N-CHANNEL polarity and single configuration with built-in diode, this transistor is perfect for a wide range of applications. Infineon Technologies' reputation for excellence ensures that this product delivers outstanding value, benefits, and advantages to customers. From its fast turn-on and turn-off times to its high collector current and voltage capabilities, this IGBT is a game-changer in the industry. Upgrade your devices with the BSM300GA170DLCHOSA1 and experience unmatched quality and efficiency.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower on-state voltage drop and higher efficiency compared to P-CHANNEL types, making it a good choice for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for easier circuit design and helps in controlling inductive loads efficiently.

Maximum Collector Current (IC): 600 A

With a high maximum collector current rating, this IGBT can handle large amounts of current, making it suitable for high power applications.

Maximum Collector-Emitter Voltage: 1700 V

The high maximum collector-emitter voltage rating allows for its usage in high voltage applications, ensuring safety and reliability.

Nominal Turn Off Time (toff): 930 ns

The low turn off time ensures fast switching speed, reducing power losses and improving efficiency.

Nominal Turn On Time (ton): 200 ns

The low turn on time allows for quick activation, making it suitable for applications where fast switching is required.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) BSM300GA170DLCHOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

JESD-30 Code:

R-XUFM-X5

No. of Elements:

1

No. of Terminals:

5

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

930 ns

Nominal Turn On Time (ton):

200 ns

Trade Compliance

BSM300GA170DLCHOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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