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BCR141E6327HTSA1

Infineon Technologies

BCR141E6327HTSA1 by Infineon Technologies

Infineon's BCR141E6327HTSA1 is a NPN BJT with built-in resistor for switching applications. Features include hFE of 50, VCE of 50V, and fT of 130MHz. Its small outline package with gull wing terminals makes it suitable for surface mount designs.

Median Price

$0.133

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 8 parts In-Stock

1+ parts

$0.470

100+ parts

$0.206

1k+ parts

$0.113

10k+ parts

$0.099

8

$0.470

$0.206

$0.113

$0.099

Adafruit Industries

USA . 20 parts In-Stock

1+ parts

$1.508

100+ parts

$1.433

1k+ parts

$1.433

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20

$1.508

$1.433

$1.433

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Verical

USA . 117,000 parts In-Stock

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Chip1Stop

Japan . 33,000 parts In-Stock

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$0.133

33,000

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$0.133

Flip Electronics (Authorized)

USA . 33,000 parts In-Stock

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33,000

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Arrow

USA . 15,000 parts In-Stock

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$0.046

15,000

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$0.046

Farnell

UK . 6,002 parts In-Stock

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-

100+ parts

$0.132

1k+ parts

$0.057

10k+ parts

$0.049

6,002

-

$0.132

$0.057

$0.049

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 24 parts In-Stock

1+ parts

$0.141

100+ parts

-

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24

$0.141

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Digiode

USA . 467 parts In-Stock

1+ parts

$0.238

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467

$0.238

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TME

Poland . 5,700 parts In-Stock

1+ parts

$0.347

100+ parts

$0.130

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-

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5,700

$0.347

$0.130

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Chip Stock

USA . 162,500 parts In-Stock

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162,500

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Schukat

Germany . 39,500 parts In-Stock

1+ parts

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$0.060

10k+ parts

$0.038

39,500

-

-

$0.060

$0.038

Flip Electronics

USA . 33,000 parts In-Stock

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Vyrian

USA . 24,925 parts In-Stock

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24,925

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NAC Semi

USA . 18,000 parts In-Stock

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$0.050

18,000

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$0.050

Rutronik

Germany . 15,000 parts In-Stock

1+ parts

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$0.040

15,000

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$0.040

VNN

France . 2,150 parts In-Stock

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Bristol Electronics

USA . 146 parts In-Stock

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146

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 1,692 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

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10k+ parts

$0.070

1,692

$0.072

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-

$0.070

Ampacity Inc.

Singapore . 43,432 parts In-Stock

1+ parts

$0.073

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43,432

$0.073

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Semicontronic

India . 43,346 parts In-Stock

1+ parts

$0.073

100+ parts

$0.071

1k+ parts

$0.071

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43,346

$0.073

$0.071

$0.071

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Corphita

USA . 631 parts In-Stock

1+ parts

$0.225

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631

$0.225

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Continental Prestige Electronics

USA . 18,302 parts In-Stock

1+ parts

$0.408

100+ parts

$0.153

1k+ parts

$0.062

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18,302

$0.408

$0.153

$0.062

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Modulus Dynamics

Lithuania . 24,099 parts In-Stock

1+ parts

$1.333

100+ parts

$1.280

1k+ parts

$1.226

10k+ parts

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24,099

$1.333

$1.280

$1.226

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Corohmni

South Africa . 596 parts In-Stock

1+ parts

$1.363

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596

$1.363

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$1.508

100+ parts

$1.433

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$1.433

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20

$1.508

$1.433

$1.433

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Aztec Data Supply Inc.

USA . 191 parts In-Stock

1+ parts

$1.751

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191

$1.751

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Perfect Parts

USA . 91,408 parts In-Stock

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91,408

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BidChips

USA . 32,074 parts In-Stock

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iBuyXS LLC

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32,074

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QUARKTWIN TECHNOLOGY LTD

USA . 9,717 parts In-Stock

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Glotronic Ltd.

UK . 9,600 parts In-Stock

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Component Stockers USA

USA . 8,532 parts In-Stock

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$0.030

8,532

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$0.030

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

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8,000

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Overview

Enhance your electronic projects with the BCR141E6327HTSA1 by Infineon Technologies. Crafted with precision and expertise, this Small Signal Bipolar Junction Transistor (BJT) offers superior performance and reliability. Ideal for switching applications, this NPN transistor with a built-in resistor is designed for efficiency and convenience. The compact rectangular package with gull wing terminals makes it perfect for surface mount installations. Trust in the quality of Infineon Technologies to deliver the best value and benefits to your projects. Elevate your designs with the BCR141E6327HTSA1 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability, making it suitable for a variety of applications.

Polarity or Channel Type: NPN

NPN type transistors are commonly used in amplification and switching circuits, offering good performance and versatility.

Configuration: SINGLE WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and saves space on the PCB, making it ideal for compact electronic devices.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can efficiently control the flow of current in electronic circuits.

Surface Mount: YES

Surface mount capability enables easy and efficient automated assembly, saving time and cost during production.

Package Shape: RECTANGULAR

Rectangular packaging allows for efficient placement on the PCB, maximizing space utilization and facilitating routing of traces.

Terminal Form: GULL WING

Gull wing terminals provide secure mechanical and electrical connections, ensuring reliable performance in a variety of operating conditions.

No. of Terminals: 3

Having 3 terminals allows for easy integration into a circuit and provides flexibility in connecting to other components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is suitable for compact electronic devices with limited real estate.

Minimum DC Current Gain (hFE): 50

A minimum hFE of 50 indicates good amplification capability, ensuring stable and reliable signal amplification in electronic circuits.

Maximum Collector-Emitter Voltage: 50V

With a maximum voltage rating of 50V, this transistor can safely handle moderate voltage levels, suitable for various applications.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and efficiency, making this transistor a dependable choice for electronic circuits.

Maximum Collector Current (IC): 0.1A

With a maximum collector current of 0.1A, this transistor can handle moderate current levels, making it suitable for low-power applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, enhancing the reliability and longevity of the product.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connections, ensuring proper functioning and stability in the circuit.

Nominal Transition Frequency (fT): 130MHz

A high transition frequency of 130MHz indicates fast switching speeds and high-frequency operation, making it ideal for applications requiring rapid signal processing.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) BCR141E6327HTSA1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Additional Features:

BUILT-IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

50

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BCR141E6327HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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