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DMN2024UTS-13

Diodes Incorporated

DMN2024UTS-13 by Diodes Incorporated

DMN2024UTS-13 by Diodes Inc. is an N-channel FET with 20V DS breakdown voltage, 45A IDM, and 0.024 ohm RDS(on). Commonly used for switching applications, it features a common drain configuration with 2 elements and built-in diode in a small outline package suitable for surface mount technology.

Median Price

$0.490

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,490 parts In-Stock

1+ parts

$0.490

100+ parts

$0.293

1k+ parts

$0.186

10k+ parts

-

2,490

$0.490

$0.293

$0.186

-

Mouser Electronics

USA . 2,405 parts In-Stock

1+ parts

$0.510

100+ parts

$0.325

1k+ parts

$0.198

10k+ parts

$0.148

2,405

$0.510

$0.325

$0.198

$0.148

Verical

USA . 70,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.144

70,000

-

-

-

$0.144

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 467 parts In-Stock

1+ parts

$5.608

100+ parts

-

1k+ parts

-

10k+ parts

-

467

$5.608

-

-

-

Northwest PG Solutions

USA . 2,122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.495

10k+ parts

-

2,122

-

-

$5.495

-

Overview

Unlock the power of cutting-edge technology with the DMN2024UTS-13 by Diodes Incorporated. This high-quality Power FET transistor is designed for switching applications, offering unmatched reliability and efficiency. With a common drain configuration and built-in diode, this N-channel transistor provides seamless performance in a compact package. Perfect for a wide range of electronic devices, the DMN2024UTS-13 delivers exceptional value and performance, making it the ideal choice for your next project. Elevate your designs with Diodes Incorporated today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in applications where N-channel FETs are preferred.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE

Offers a versatile configuration with built-in diode for protection and improved functionality.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high performance in such scenarios.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 20 V

Provides a reliable breakdown voltage for protection against voltage spikes and overloads.

Operating Mode: ENHANCEMENT MODE

Enables efficient and controlled operation in enhancement mode, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 45 A

Capable of handling high pulsed drain currents, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 8 mJ

Offers protection against energy spikes and ensures reliable performance under varying conditions.

Technical Specifications

Power Field Effect Transistors (FET) DMN2024UTS-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Avalanche Energy Rating (EAS):

8 mJ

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

6.2 A

Maximum Drain-Source On Resistance:

.024 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

38 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Reference Standard:

MIL-STD-202

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN2024UTS-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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