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S29GL01GP11FAIR10

Cypress Semiconductor

S29GL01GP11FAIR10 by Cypress Semiconductor

S29GL01GP11FAIR10 by Cypress Semiconductor is a 1Gx1 NOR flash memory with 3.3V supply, 110mA max current, and 110ns access time. It is ideal for industrial applications requiring fast data polling and asynchronous operation in a compact grid array package.

Median Price

$25.000

Lifecycle Status

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1k+

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USA . 29,387 parts In-Stock

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DigiKey

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Nova Conductors

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Continental Prestige Electronics

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RC Electronics

USA . 3,748 parts In-Stock

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Argo Parts USA

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Futuretech Components

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Component Stockers USA

USA . 369 parts In-Stock

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Overview

Unlock the power of seamless data storage with the S29GL01GP11FAIR10 by Cypress Semiconductor. As a leader in flash memory technology, Cypress delivers top-notch quality and reliability in every product. Ideal for industrial applications, this flash memory offers lightning-fast access times and low standby current, ensuring optimal performance at all times. Say goodbye to data bottlenecks and hello to smooth operations with the S29GL01GP11FAIR10. Trust Cypress Semiconductor for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, making the product long-lasting and reliable.

Operating Mode: ASYNCHRONOUS

Allows for independent operations and tasks to be performed simultaneously, increasing efficiency and performance.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage level for efficient power consumption and stable performance.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and reliability, making the product energy efficient and fast.

Memory IC Type: FLASH

Flash memory offers non-volatile storage, fast read/write speeds, and high endurance, making the product suitable for various data storage applications.

Technical Specifications

Flash Memory S29GL01GP11FAIR10 attributes and parameters. Explore more Flash Memory devices from Cypress Semiconductor

Specs

Maximum Access Time:

110 ns

Alternate Memory Width:

8

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e0

Length:

13 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Sectors/Size:

1K

No. of Terminals:

64

No. of Words:

1073741824 words

No. of Words Code:

1G

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1GX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Page Size (words):

8/16

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.4 mm

Sector Size (Words):

128K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

110 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Toggle Bit:

YES

Type:

NOR TYPE

Width:

11 mm

Trade Compliance

S29GL01GP11FAIR10 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

NSN

5962-01-653-0074, 5962016530074

NIIN

016530074

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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