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7106D

Boyd

7106D by Boyd

Boyd's 7106D Heat Sink, made of copper alloy, measures 25.91mm in length, 14.99mm in width, and 9.52mm in height. It is designed for IC devices with a TIN LEAD finish and FOLDEDBACK fin orientation, packed in bags for easy handling and installation.

Median Price

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Lifecycle Status

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8

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Pegasus Components GmbH

Germany . 2,250 parts In-Stock

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2,250

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Bristol Electronics

USA . 1,000 parts In-Stock

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1,000

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Vyrian

USA . 616 parts In-Stock

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616

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Legend Electronics Inc.

USA . 350 parts In-Stock

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350

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Prism Electronics

USA . 83 parts In-Stock

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83

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Nova Conductors

Japan . 61 parts In-Stock

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61

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PC Components Company LLC

USA . 26 parts In-Stock

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26

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LWI Electronics Inc

India . 25 parts In-Stock

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25

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AZTECH Wire

Italy . 616 parts In-Stock

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$5.124

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616

$5.124

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Aranea Global

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 130 parts In-Stock

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130

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RTC Component Inc.

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Overview

Enhance the performance of your devices with the 7106D by Boyd. Crafted with precision and expertise, this heat sink delivers exceptional cooling capabilities to ensure optimal functioning of your electronics. Perfect for ICs, this copper alloy heat sink boasts a folded back fin orientation for efficient heat dissipation. Trust in Boyd's reputation for quality and innovation to elevate the reliability and longevity of your products. Upgrade your technology with the 7106D and experience the difference in performance and durability.

Feature Benefit Bullets

Thermal Device Type: HEAT SINK

A dedicated heat sink designed specifically for thermal dissipation, ensuring efficient cooling for the device.

Height: 9.52 mm

Compact height allows for easy installation in tight spaces while still providing sufficient thermal conductivity.

Finish: TIN LEAD

Tin lead finish provides good conductivity and corrosion resistance, enhancing the overall durability of the heat sink.

Width: 14.99 mm

Optimal width for effectively dissipating heat while maintaining a slim profile, ideal for various electronic devices.

Construction: U

U-shaped construction enhances heat dissipation capabilities, allowing for efficient cooling of the IC.

Packing Method: BAG

Comes conveniently packed in a bag for easy storage and transportation, ensuring the heat sink remains protected until installation.

Fin Orientation: FOLDEDBACK

Folded back fin orientation increases surface area for better heat dissipation, improving the overall cooling performance.

Body Material: COPPER ALLOY

Copper alloy construction offers excellent thermal conductivity, ensuring efficient heat transfer from the IC to the heat sink.

Length: 25.91 mm

Adequate length provides sufficient contact area with the IC for effective heat transfer, contributing to improved thermal management.

Device Used On: IC

Designed specifically for use on integrated circuits, ensuring targeted cooling and optimal performance of the electronic component.

Technical Specifications

Heat Sinks 7106D attributes and parameters. Explore more Heat Sinks devices from Boyd

Device Specifications

Construction:

U

Fin Orientation:

Packing Method:

Bag

Additional Features:

Low Profile

Physical Specifications

Height:

0.375 in (9.52 mm)

Width:

0.59 in (14.99 mm)

Length:

1.02 in (25.91 mm)

Material and Finish

Finish:

Tin Lead

Body Material Composition:

Usage and Compatibility

Device Type:

Compatible Device:

IC

Manufacturer Highlights

Boyd

Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.

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