Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Boyd's 577202B04000G Heat Sink has a Thermal Resistance of 24.4 ohm, U Profile, and Aluminum Body Material. Ideal for applications requiring efficient heat dissipation in compact spaces like electronic devices or LED lighting systems.
Median Price
$0.790
Lifecycle Status
Suppliers In-Stock
19
In-Stock Inventory
1k+
RS (Exports)
1+ parts
$0.210
100+ parts
-
1k+ parts
10k+ parts
Heilind Electronics
$0.526
$0.433
$0.419
Interstate Connecting
Mouser Electronics
$2.690
$1.350
$1.080
Verical
Arrow
$0.988
RS Americas
$2.780
Sager
Master Electronics
$0.700
Nova Conductors
$1.171
Electro Sonic
$0.908
$0.731
$0.696
Vyrian
Diverse Electronics
IBS Electronics
$1.108
$0.982
NAC Semi
$0.717
$0.661
Bristol Electronics
Atlantic Semiconductor
Specialty Parts & Electronic Components, Inc. (S.P.E.C.)
Prism Electronics
Allen Electronics Distributors
Bastille Electronics
$1.112
$1.057
$1.042
Perfect Parts
GreenTree Electronics
Argo Parts USA
Glotronic Ltd.
Continental Prestige Electronics
Aztec Data Supply Inc.
Authorized Procurement Solutions
Low thermal resistance ensures efficient heat dissipation, making this heat sink suitable for high-performance applications.
Designed specifically as a heat sink, this product is optimized for thermal management in electronic devices.
The U profile design provides a larger surface area for heat dissipation, enhancing the cooling capabilities of the heat sink.
A compact height allows for easy integration into space-constrained environments while still providing effective cooling.
Anodized finish not only enhances the appearance but also provides improved durability and corrosion resistance for a longer lifespan.
The moderate width allows for efficient thermal conductivity while still being able to fit in a variety of applications.
The fin construction maximizes surface area, facilitating better heat transfer and overall thermal performance.
The black color not only adds a sleek look but also helps in better heat absorption, enhancing the cooling efficiency.
The transverse orientation of fins promotes cross-flow cooling, ensuring effective heat dissipation and temperature regulation.
Aluminum is known for its lightweight and high thermal conductivity properties, making it an ideal material for efficient heat sinks.
An optimal length that balances between compact design and effective heat dissipation, making it versatile for various applications.
Heat Sinks 577202B04000G attributes and parameters. Explore more Heat Sinks devices from Boyd
Construction:
Profile:
Fin Orientation:
Height:
Width:
Length:
Finish:
Body Material Composition:
Color:
Thermal Resistance:
Device Type:
Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
General Instrument
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
LM555CMX
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
1N4148
Dc Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
1N5819HW-7-F
Diodes Incorporated
1N5819HW-7-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 1A output current, and 0.75V forward voltage. It's a surface mount device in a small outline package ideal for efficiency applications at temperatures ranging from -65 to 125°C.
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
International Semiconductor
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
1N4148WT
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW080510R0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510R0FKEA is a fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V. Operating temperature range from -55 to 155 °C ensures reliability in various environments.
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
HS202DR
Sensata Technologies
HEAT SINK;
PF750G
Boyd
Boyd's PF750G Heat Sink features a Thermal Resistance of 20.3 ohm, Copper Body Material, and U Profile. Ideal for applications requiring efficient heat dissipation in compact spaces like electronic devices or industrial equipment.
577202B04000G
HS151DR
Crydom
SK52515
Fischer Elektronik & Kg
SK52515 by Fischer Elektronik & Kg is a 13.3 ohm HEAT SINK with dimensions of 28mm x 19.4mm x 15mm, ideal for TRANSISTOR applications. Constructed using EXTRUDED aluminum with LONGITUDINAL fin orientation, it efficiently dissipates heat in electronic devices.
574502B03300G
Boyd's 574502B03300G is a black anodized aluminum heat sink with dimensions of 20.57mm x 9.9mm x 19.05mm (LxWxH). It has a thermal resistance of 21.2 ohm and features a slide-on construction, making it suitable for various applications requiring efficient heat dissipation.
SK681000SA
SK681000SA by Fischer Elektronik & Kg is a heat sink with a thermal resistance of 5.85 ohm. It has a screw profile, measuring 33mm in height and 46mm in width. This extruded heat sink, with a length of 1000mm, is commonly used on transistors for effective heat dissipation.
30182
Vicor
Vicor 30182 Heat Sink, made of aluminum alloy, measures 23.1mm (H) x 56.4mm (W) x 57.9mm (L). Ideal for thermal management in electronic devices due to its extruded construction. Ensures efficient heat dissipation in compact spaces like PCBs or power supplies.
577002B00000G
Boyd 577002B00000G Heat Sink has Thermal Resistance of 32Ω, U Profile with Height 19.05mm, and Longitudinal Fin Orientation. Ideal for cooling electronic components in compact spaces due to its small dimensions and efficient heat dissipation capabilities.
7109DG/TR
Aavid Thermalloy
HEAT SINK; Body Material: COPPER; Device Used On: IC; Fin Orientation: FOLDEDBACK; Thermal Resistance: 11 ohm; Width: 19.38 mm;
PF526G
HEAT SINK; Body Material: ALUMINUM; Finish: ANODIZED; Thermal Resistance: 8.9 ohm; Color: BLACK; Height: 19 mm;
527-45AB
WAKEFIELD-VETTE INC
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Finish: ANODIZED; Height: 11.4 mm; Width: 57.9 mm;
PSD1-2CB
Cts
PSD1-2CB by Cts is a HEAT SINK with thermal resistance of 14.4Ω, ideal for TRANSISTOR cooling. With a SCREW profile and dimensions of 55.37mm x 12.7mm x 35.05mm, it efficiently dissipates heat in electronic devices.
FK237SA220H
FK237SA220H by Fischer Elektronik & Kg is a black anodized aluminum heat sink with dimensions 19.05mm x 14.5mm x 12.7mm (LxWxH). Designed for transistors, it efficiently dissipates heat in electronic devices, ensuring optimal performance and longevity.
529802B02500G
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Width: 25.4 mm; Color: BLACK;
SW25-2G
HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Color: BLACK; Length: 34.5 mm;
578622B03200G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: FIN; Fin Orientation: TRANSVERSE;
658-35AB
Ohmite Manufacturing
Ohmite Manufacturing's 658-35AB heat sink features PIN FIN ARRAY profile, 8.9mm height, and anodized finish. Ideal for applications requiring efficient thermal dissipation in compact spaces like electronic devices or LED lighting systems.
ATS-1106-C1-R0
Advanced Thermal Solutions
ATS-1039-C1-R0
ATS-1039-C1-R0 by Advanced Thermal Solutions is a 15mm high, 40mm wide, and 53mm long heat sink with pin fin array profile. Anodized in green, it features omnidirectional fin orientation for efficient thermal management. Ideal for applications requiring compact cooling solutions.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
577202B00000G
Boyd's 577202B00000G Heat Sink is 19.05mm tall with a width of 12.7mm and length of 13.21mm, made of black anodized aluminum fins for efficient heat dissipation. Ideal for applications requiring compact cooling solutions in electronic devices or industrial equipment due to its transverse fin orientation and construction design.
HEAT SINK; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Finish: ANODIZED; Height: 19.05 mm;
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Length: 13.21 mm;
577202B00300G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Height: 19.05 mm;
577202B10000G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Finish: ANODIZED;
577202B10100G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Color: BLACK;
577202B13805G
577202B30000G
577202B34000G
577202B03900G
HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Width: 12.7 mm;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved