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ADSP-CM403CSWZ-EF

Analog Devices

ADSP-CM403CSWZ-EF by Analog Devices

Analog Devices' ADSP-CM403CSWZ-EF microprocessor features 32-bit architecture, 60 MHz clock frequency, and 65536 RAM words. Ideal for industrial applications requiring low power consumption, with a wide operating temperature range from -40 to 105 °C. The package includes a heat sink/slug and offers boundary scan capability for efficient testing.

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Vyrian

USA . 3,277 parts In-Stock

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Digiode

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AZTECH Wire

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Semicontronic

India . 1,110 parts In-Stock

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One Stop Electronics

USA . 458 parts In-Stock

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Parana Technologies

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IDEA Electronic Components Group

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Native Components

USA . 760 parts In-Stock

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Northwest PG Solutions

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DigiPath Technology Company

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Vigor

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Microchip USA

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Overview

Upgrade your next project with the ADSP-CM403CSWZ-EF from Analog Devices, a top-tier manufacturer known for their premium quality microprocessors. Ideal for a wide range of applications, this powerful processor offers integrated cache and low power mode, ensuring optimal performance and energy efficiency. With a maximum clock frequency of 60 MHz and a maximum supply voltage of 3.47V, this product provides exceptional value and reliability to customers looking for high-speed processing capabilities. Trust Analog Devices to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Integrated cache helps improve the processor's performance by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 3.47 V

3.47 V maximum supply voltage ensures stable operation without exceeding the specified power limits.

On Chip Data RAM Width: 16

16-bit on-chip data RAM width allows the processor to handle data efficiently for smooth operation.

Address Bus Width: 5

5-bit address bus width provides enough address lines for accessing memory and peripherals efficiently.

Package Shape: SQUARE

Square package shape helps in easy mounting and placement on PCBs, optimizing space utilization.

Bit Size: 32

32-bit processing capability allows for handling large amounts of data and executing complex instructions quickly.

No. of Terminals: 120

120 terminals provide ample connectivity options for interfacing with external devices and peripherals.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Various package styles offer flexibility in design and application, ensuring compatibility with different system requirements.

Minimum Supply Voltage: 3.13 V

3.13 V minimum supply voltage allows for efficient power management and reduces energy consumption.

Maximum Operating Temperature: 105 °C

Operating at temperatures up to 105 °C ensures reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C makes the processor suitable for a wide range of temperature conditions.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connection to the PCB, ensuring a secure and stable electrical connection.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6 mm allows for slim and compact device designs.

RAM Words: 65536

With 65536 RAM words, the processor can efficiently store and access data during operation.

Width: 14 mm

Width of 14 mm enables easy integration into various electronic devices without occupying too much space.

Boundary Scan: YES

Boundary scan feature aids in testing and debugging the processor, ensuring high quality and reliability.

External Data Bus Width: 16

16-bit external data bus width enables fast data transfer between the processor and external devices.

Maximum Clock Frequency: 60 MHz

Operating at a maximum clock frequency of 60 MHz allows the processor to execute instructions quickly for smooth performance.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds at peak temperature ensures proper soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C ensures reliable soldering and component attachment.

Length: 14 mm

Length of 14 mm provides a compact form factor suitable for small electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture of the microprocessor ensures high performance and efficiency in processing instructions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the processor energy-efficient.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliability in PCB assembly and soldering processes.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V ensures stable and efficient power delivery to the processor.

No. of DMA Channels: 17

With 17 DMA channels, the processor can efficiently manage data transfer between peripherals and memory without CPU intervention.

Terminal Pitch: 0.4 mm

Terminal pitch of 0.4 mm allows for compact terminal spacing, enabling high-density PCB designs.

Format: FLOATING POINT

Support for floating-point operations enhances the processor's capability in handling complex mathematical calculations.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during manufacturing and storage.

Speed: 150 rpm

Operating at a speed of 150 rpm ensures efficient data processing and execution of instructions.

Low Power Mode: YES

Low power mode feature allows the processor to conserve energy when idle or under low processing load.

Technical Specifications

Microprocessors ADSP-CM403CSWZ-EF attributes and parameters. Explore more Microprocessors devices from Analog Devices

Specs

Address Bus Width:

5

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

17

No. of Terminals:

120

On Chip Data RAM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

65536

Maximum Seated Height:

1.6 mm

Speed:

150 rpm

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ADSP-CM403CSWZ-EF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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