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ADSP-CM402CSWZ-FF

Analog Devices

ADSP-CM402CSWZ-FF by Analog Devices

Analog Devices' ADSP-CM402CSWZ-FF is a 32-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 60 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. The package style includes flatpack, heat sink/slug, and fine pitch options, making it versatile for various design requirements.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,921 parts In-Stock

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Digiode

USA . 546 parts In-Stock

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Semicontronic

India . 713 parts In-Stock

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$13.000

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$12.675

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$12.610

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$13.000

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$12.610

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AZTECH Wire

Italy . 236 parts In-Stock

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$14.785

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One Stop Electronics

USA . 634 parts In-Stock

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Parana Technologies

USA . 1,311 parts In-Stock

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IDEA Electronic Components Group

UK . 1,994 parts In-Stock

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$60.551

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$57.523

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DigiPath Technology Company

USA . 2,367 parts In-Stock

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$94.460

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$90.681

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Vigor

Singapore . 3,095 parts In-Stock

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Northwest PG Solutions

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Corphita

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Microchip USA

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Native Components

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Overview

Unlock the full potential of your electronic devices with the ADSP-CM402CSWZ-FF microprocessor from Analog Devices. As a trusted industry leader, Analog Devices delivers top-quality products that exceed expectations in terms of performance and reliability. This microprocessor is perfect for a wide range of applications, offering seamless integration, high-speed processing, and low power consumption. Experience the difference with Analog Devices and take your projects to the next level with the ADSP-CM402CSWZ-FF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the microprocessor, ensuring reliable performance over time.

Integrated Cache: YES

Having an integrated cache reduces the need to access external memory frequently, improving overall speed and efficiency of the microprocessor.

Maximum Supply Voltage: 3.47 V

The higher maximum supply voltage allows for flexibility in power management and ensures stable operation under varying voltage conditions.

On Chip Data RAM Width: 16

With a wider on-chip data RAM width of 16, the microprocessor can handle larger amounts of data at a time, improving processing speed and performance.

Address Bus Width: 5

The 5-bit address bus width provides sufficient address space for efficient communication between components, enhancing the microprocessor's capabilities.

Package Shape: SQUARE

The square package shape allows for easy integration and placement on circuit boards, optimizing space usage and overall design efficiency.

Bit Size: 32

The 32-bit size of the microprocessor allows for processing larger chunks of data at a time, enabling faster and more complex computations.

No. of Terminals: 120

With 120 terminals, the microprocessor can interface with various external components and peripherals, expanding its connectivity and functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The diverse package styles offer flexibility in design and mounting options, allowing for customization based on specific application requirements.

Minimum Supply Voltage: 3.13 V

The lower minimum supply voltage ensures energy efficiency and reduces power consumption, making the microprocessor suitable for battery-powered devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, the microprocessor can withstand extended periods of use in demanding environments without overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 °C to 105°C enables the microprocessor to function reliably in both extreme cold and hot conditions.

Terminal Position: QUAD

The quad terminal position simplifies installation and soldering processes, ensuring secure connections and stable performance of the microprocessor.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for compact and slim designs, making the microprocessor suitable for space-constrained applications.

RAM Words: 65536

With a large RAM capacity of 65536 words, the microprocessor can store and access a significant amount of data, enhancing processing capabilities.

Width: 14 mm

The compact width of 14mm enables easy integration into circuit layouts and board designs, saving space and promoting efficient packaging.

Boundary Scan: YES

Having boundary scan capability allows for testing and diagnosing faults within the microprocessor, ensuring quality control and reliable operation.

External Data Bus Width: 16

The 16-bit external data bus width enables fast data transfer between external devices and the microprocessor, improving overall system performance.

Maximum Clock Frequency: 60 MHz

The high maximum clock frequency of 60 MHz supports fast processing speeds, enabling quick execution of instructions and tasks by the microprocessor.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for efficient soldering and assembly processes, ensuring reliable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C enables secure solder joints during assembly, contributing to the durability and longevity of the microprocessor.

Length: 14 mm

The compact length of 14mm facilitates easy placement and mounting of the microprocessor on circuit boards, optimizing layout and design efficiency.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in rugged and harsh environments, making the microprocessor suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor enables efficient and streamlined instruction processing, enhancing performance and speed of operations.

Technology: CMOS

The CMOS technology used in the microprocessor provides low power consumption, high noise immunity, and fast switching speeds, optimizing performance.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and assembly processes, ensuring secure and reliable connections for the microprocessor.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides a stable power source for the microprocessor, supporting consistent and reliable performance.

No. of DMA Channels: 17

With 17 DMA channels, the microprocessor can efficiently manage data transfers and communications with peripherals, enhancing overall system efficiency.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm allows for high-density mounting and compact layouts, maximizing space utilization on circuit boards.

Format: FLOATING POINT

Supporting floating point format enables the microprocessor to perform complex mathematical calculations with precision and efficiency, enhancing computational capabilities.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microprocessor is robust enough to withstand standard moisture exposure during handling and assembly.

Speed: 100 rpm

The speed of 100 rpm allows for efficient data processing and execution of tasks, ensuring quick response times and smooth operation of the microprocessor.

Low Power Mode: YES

The low power mode feature enables energy-efficient operation, reducing power consumption and extending battery life in portable and energy-sensitive applications.

Technical Specifications

Microprocessors ADSP-CM402CSWZ-FF attributes and parameters. Explore more Microprocessors devices from Analog Devices

Specs

Address Bus Width:

5

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

17

No. of Terminals:

120

On Chip Data RAM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

65536

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ADSP-CM402CSWZ-FF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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