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ADSP-BF504BCPZ-3F

Analog Devices

ADSP-BF504BCPZ-3F by Analog Devices

ADSP-BF504BCPZ-3F by Analog Devices is a 32-bit DSP with max clock freq of 50 MHz. Operating temp range -40 to 85 °C, low power mode available. Ideal for industrial applications requiring high-speed signal processing in compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,109 parts In-Stock

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Digiode

USA . 374 parts In-Stock

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Native Components

USA . 909 parts In-Stock

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$1.876

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Northwest PG Solutions

USA . 1,315 parts In-Stock

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$2.064

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AZTECH Wire

Italy . 732 parts In-Stock

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One Stop Electronics

USA . 1,419 parts In-Stock

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$13.000

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Semicontronic

India . 395 parts In-Stock

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$28.000

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$27.300

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$27.160

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Corohmni

South Africa . 255 parts In-Stock

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$29.065

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Parana Technologies

USA . 3,852 parts In-Stock

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$36.420

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$33.870

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IDEA Electronic Components Group

UK . 549 parts In-Stock

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$39.161

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$37.203

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Advanced Electronics

New Zealand . 800 parts In-Stock

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$51.988

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$51.468

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$49.389

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DigiPath Technology Company

USA . 3,852 parts In-Stock

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$61.091

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$58.648

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Component Stockers USA

USA . 322 parts In-Stock

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Microchip USA

USA . 4,630 parts In-Stock

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Vigor

Singapore . 2,684 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Unlock the power of seamless digital signal processing with the Analog Devices ADSP-BF504BCPZ-3F. Known for their exceptional quality and innovative technology, Analog Devices brings you a cutting-edge DSP that is perfect for a wide range of applications. With its low power mode, barrel shifter, and maximum clock frequency of 50 MHz, this product offers unmatched value and performance. Whether you're in the industrial sector or working on a specialized project, the ADSP-BF504BCPZ-3F is the solution you've been searching for. Elevate your work to new heights with Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient mounting on circuit boards, saving space and enabling efficient production processes.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, making the product versatile and flexible in various applications.

Package Shape: SQUARE

The square package shape is often more compact and space-efficient, allowing for denser integration and placement of components on a board.

Bit Size: 32

The 32-bit size allows for high precision and performance in processing digital signals, making this DSP suitable for demanding signal processing tasks.

Power Supplies (V): 1.3,1.8/3.3

The availability of multiple power supply options (1.3V, 1.8V, 3.3V) provides flexibility in choosing the appropriate voltage levels based on the specific requirements of the application.

No. of Terminals: 88

With a high number of terminals, the DSP can accommodate complex connections and interfaces, enabling it to interact with multiple external components efficiently.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offers different options for thermal management, space constraints, and application-specific requirements, enhancing the product's adaptability.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage allows for operation in energy-efficient and low-power scenarios, making the product suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the DSP's reliability and stability even in demanding environmental conditions, enhancing its longevity and performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the DSP to function reliably in cold environments, expanding its usability in a wide range of applications.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-BF504BCPZ-3F attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-XQCC-N88

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

88

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC88,.47SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.85 mm

Speed:

300 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADSP-BF504BCPZ-3F Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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