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ADSP-21364YSWZ-2AA

Analog Devices

ADSP-21364YSWZ-2AA by Analog Devices

Analog Devices' ADSP-21364YSWZ-2AA is a 32-bit DSP with 16-bit address and data bus width, operating at up to 33.33 MHz clock frequency. Ideal for industrial applications, it features a low profile flatpack package with 144 terminals and operates b/w -40 to 105 °C temperature range.

Median Price

$97.590

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Analog Devices Inc

USA . 746 parts In-Stock

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$97.590

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$75.980

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Mouser Electronics

USA . 2 parts In-Stock

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$138.330

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$109.240

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Rochester

USA . 4,306 parts In-Stock

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$94.980

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$84.980

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$79.980

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$79.980

Verical

USA . 744 parts In-Stock

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Digiode

USA . 545 parts In-Stock

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$80.617

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Vyrian

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

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Parana Technologies

USA . 4,414 parts In-Stock

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$64.350

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$59.846

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4,414

$64.350

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IDEA Electronic Components Group

UK . 1,453 parts In-Stock

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$69.194

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$65.734

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Semicontronic

India . 1,402 parts In-Stock

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$72.130

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$70.327

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$69.966

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Vigor

Singapore . 2,564 parts In-Stock

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$74.470

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Corphita

USA . 984 parts In-Stock

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$76.374

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Corohmni

South Africa . 273 parts In-Stock

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$92.290

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DigiPath Technology Company

USA . 4,414 parts In-Stock

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$107.943

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$103.625

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$103.625

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$103.625

Microchip USA

USA . 4,738 parts In-Stock

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$213.302

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QUARKTWIN TECHNOLOGY LTD

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Northwest PG Solutions

USA . 2,348 parts In-Stock

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Native Components

USA . 858 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the Analog Devices ADSP-21364YSWZ-2AA. Crafted with precision by a renowned manufacturer, this DSP offers unparalleled performance and reliability. Whether you're designing cutting-edge audio systems or advanced telecommunications equipment, this product delivers exceptional value and efficiency. Unlock new possibilities and elevate your projects with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable, this product is easy to integrate into PCB designs, saving space and allowing for automated assembly processes.

Maximum Supply Voltage: 1.05 V

With a maximum supply voltage of 1.05V, this DSP offers efficient power consumption and is suitable for low-power applications.

Address Bus Width: 16

The 16-bit address bus width allows for efficient memory addressing and data manipulation, enhancing the overall performance of the DSP.

Package Shape: SQUARE

The square package shape provides uniform distribution of components and makes the product easy to handle and mount on PCBs.

Bit Size: 32

With a 32-bit architecture, this DSP can handle complex computational tasks and process large datasets efficiently.

Power Supplies (V): 1,3.3

The availability of multiple power supply options (1V and 3.3V) provides flexibility in design and allows for compatibility with different voltage requirements.

No. of Terminals: 144

Having 144 terminals allows for a wide range of connectivity options, enabling the DSP to interface with various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enables high-density mounting and efficient heat dissipation, making the product suitable for compact designs.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage of 0.95V ensures reliable operation even under low-power conditions, making the product energy-efficient.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this DSP can withstand high-temperature environments, expanding its range of applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range (-40°C to 105°C) allows the DSP to function reliably in extreme temperature conditions, making it versatile and durable.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and ensures reliable electrical connections, enhancing the longevity and performance of the product.

Terminal Position: QUAD

The quad terminal position allows for efficient signal routing and reduces signal interference, improving the overall signal integrity of the DSP.

Maximum Seated Height: 1.6 mm

With a maximum seated height of 1.6mm, this DSP has a low profile design, suitable for space-constrained applications and compact electronic devices.

RAM Words: 98304

The large RAM capacity of 98304 words allows for storing and processing a significant amount of data, enabling the DSP to handle complex algorithms and calculations.

Width: 20 mm

The compact width of 20mm makes the DSP suitable for integration into small form factor devices and electronic systems with limited space.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the DSP during the manufacturing process, ensuring product quality and reliability.

External Data Bus Width: 16

The 16-bit external data bus width facilitates fast data transfer rates between the DSP and external memory or peripherals, enhancing system performance.

Maximum Clock Frequency: 33.33 MHz

With a maximum clock frequency of 33.33 MHz, this DSP can execute instructions at high speeds, enabling real-time processing and low latency performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable solder joints during the assembly process, contributing to the overall quality and durability of the product.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture allows for parallel processing and efficient data flow within the DSP, enhancing the overall performance and responsiveness of the device.

Length: 20 mm

The compact length of 20mm complements the width and height dimensions, making the DSP suitable for compact and space-efficient electronic designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making the DSP well-suited for industrial control and automation applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

As a digital signal processor with various peripheral ICs, this product can interface with a wide range of external devices and sensors, enabling diverse application possibilities.

Technology: CMOS

The CMOS technology used in this DSP offers low power consumption, high noise immunity, and faster switching speeds, making it energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure solder joints, ensuring robust connectivity and reliability in demanding operating conditions.

Nominal Supply Voltage: 1 V

With a nominal supply voltage of 1V, this DSP offers stable and efficient power delivery, supporting consistent performance and optimal operation.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting and efficient signal routing, making the product suitable for compact and miniaturized designs.

Format: FLOATING POINT

The floating-point format enables precise and accurate numerical calculations, essential for applications that require complex mathematical operations and high computational accuracy.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this DSP is less prone to moisture-related damage during storage, handling, and assembly, ensuring long-term reliability.

Barrel Shifter: YES

The presence of a barrel shifter enhances the arithmetic and logical capabilities of the DSP, enabling efficient data manipulation and complex operations, making it a versatile processing solution.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-21364YSWZ-2AA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1,3.3

Qualification:

Not Qualified

RAM Words:

98304

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

ADSP-21364YSWZ-2AA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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