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ADSP-21160NCBZ-100

Analog Devices

ADSP-21160NCBZ-100 by Analog Devices

Analog Devices' ADSP-21160NCBZ-100 is a 32-bit DSP with 131072 RAM words, 64-bit external data bus width, and 50 MHz max clock frequency. Ideal for digital signal processing applications requiring high-speed computation in a compact GRID ARRAY package style.

Median Price

$524.810

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Verical

USA . 801 parts In-Stock

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Analog Devices Inc

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Arrow

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DigiKey

USA . 2 parts In-Stock

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Digiode

USA . 734 parts In-Stock

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Vyrian

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Chip Stock

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Native Components

USA . 413 parts In-Stock

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$0.083

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Northwest PG Solutions

USA . 2,247 parts In-Stock

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$0.092

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$0.081

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Parana Technologies

USA . 1,057 parts In-Stock

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$35.368

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$32.892

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IDEA Electronic Components Group

UK . 373 parts In-Stock

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$38.030

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Corohmni

South Africa . 205 parts In-Stock

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DigiPath Technology Company

USA . 1,119 parts In-Stock

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Vigor

Singapore . 58 parts In-Stock

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Corphita

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Semicontronic

India . 202 parts In-Stock

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Glotronic Ltd.

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Microchip USA

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Perfect Parts

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Overview

Unlock the power of advanced digital signal processing with the Analog Devices ADSP-21160NCBZ-100. Manufactured by a trusted industry leader, this DSP offers unparalleled performance and reliability for a wide range of applications. With cutting-edge technology and top-notch quality, customers can expect seamless operation and impressive results. Experience the ultimate value and benefits that this product brings to the table, making it a must-have for any project requiring high-speed data processing. Elevate your work to the next level with the ADSP-21160NCBZ-100 from Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring long-term performance.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 2 V

Suitable for a wide range of applications without risking damage to the DSP.

Address Bus Width: 32

Allows for efficient communication between the processor and memory, enabling faster data access and processing.

Package Shape: SQUARE

Optimal design for space-saving on circuit boards, making it ideal for compact electronic devices.

Bit Size: 32

High processing capabilities with 32-bit data processing, enabling complex calculations and algorithms.

Power Supplies (V): 1.9, 3.3

Versatile voltage options for flexibility in power requirements, suitable for a variety of electronic systems.

No. of Terminals: 400

Sufficient terminal connections for interfacing with other components and peripherals, enhancing functionality.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates secure and reliable connections on the circuit board for stable performance.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage for energy efficiency and reduced power consumption in operation.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish for enhanced conductivity and long-lasting performance of the DSP.

Terminal Position: BOTTOM

Bottom terminal position for easy integration with the circuit board and efficient heat dissipation.

Maximum Seated Height: 2.49 mm

Low profile design for compact installations in electronic devices with limited space.

RAM Words: 131072

Large RAM capacity for storing and processing data efficiently, supporting advanced applications and multitasking.

Width: 27 mm

Compact width for space-saving on the circuit board, suitable for various electronic system designs.

Boundary Scan: YES

Boundary scan feature for easy testing and debugging of the DSP during manufacturing and maintenance.

External Data Bus Width: 64

Wide external data bus width for faster data transfer between the processor and external memory devices.

Maximum Clock Frequency: 50 MHz

High clock frequency for rapid data processing and real-time performance in demanding applications.

Peak Reflow Temperature °C: 260

Resistant to high temperatures during reflow soldering process, ensuring reliable solder joints for long-term use.

Internal Bus Architecture: MULTIPLE

Efficient internal bus architecture for optimized data flow and parallel processing capabilities in the DSP.

Length: 27 mm

Compact length for space-efficient integration on the circuit board, suitable for small electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile DSP with various peripheral integrations for diverse applications and enhanced functionality.

Technology: CMOS

CMOS technology for low power consumption, high-speed operation, and reliable performance in the DSP.

Terminal Form: BALL

Ball terminal form for secure connections and efficient heat dissipation within the DSP package.

Nominal Supply Voltage: 1.9 V

Stable nominal supply voltage for consistent performance and protection of internal circuits in the DSP.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and reliable connections on the circuit board.

Format: FLOATING POINT

Floating-point format for accurate numerical calculations and complex algorithms in signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 for moderate sensitivity to moisture, suitable for standard assembly and storage conditions.

Barrel Shifter: YES

Barrel shifter for efficient bit manipulation and arithmetic operations, enhancing processing capabilities of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-21160NCBZ-100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA400,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

2.49 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

ADSP-21160NCBZ-100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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