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ADG467BRS-REEL

Analog Devices

ADG467BRS-REEL by Analog Devices

ADG467BRS-REEL by Analog Devices is a N-CHANNEL FET for SWITCHING applications. It has 20 terminals, operates in ENHANCEMENT MODE, with max ID of 0.02A and RDS(on) of 95Ω. The package is RECTANGULAR, surface mountable, with GULL WING terminals made of SILICON material.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,554 parts In-Stock

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North Shore Components

USA . 1,435 parts In-Stock

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Digiode

USA . 23 parts In-Stock

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Native Components

USA . 148 parts In-Stock

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$0.270

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$0.259

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Northwest PG Solutions

USA . 693 parts In-Stock

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$0.297

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$0.262

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Parana Technologies

USA . 21,005 parts In-Stock

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$1.287

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$1.197

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IDEA Electronic Components Group

UK . 677 parts In-Stock

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$1.384

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$1.315

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DigiPath Technology Company

USA . 1,989 parts In-Stock

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$2.159

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$2.073

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AZTECH Wire

Italy . 736 parts In-Stock

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$9.565

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One Stop Electronics

USA . 128 parts In-Stock

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$57.050

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Corphita

USA . 566 parts In-Stock

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Overview

Unlock the power of precision with the Analog Devices ADG467BRS-REEL small signal field effect transistor. Manufactured by a trusted industry leader, this N-channel transistor offers superior switching capabilities in a compact package. Ideal for a variety of applications, this enhancement mode transistor provides reliability and performance you can count on. Say goodbye to compromise and hello to seamless functionality with the ADG467BRS-REEL. Elevate your projects with ease, efficiency, and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the transistor, making it suitable for a variety of environments.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL type offers efficient switching capabilities, making the transistor ideal for use in electronic circuits that require fast response times.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can effectively control the flow of current in electronic devices, enabling smooth and reliable operation.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto printed circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard PCB layouts, making it convenient for engineers to incorporate the transistor into their designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides precise control over the transistor's conductivity, allowing for fine-tuning of its performance in various applications.

No. of Terminals: 20

Having 20 terminals offers flexibility in connecting the transistor to other components in the circuit, enabling versatile circuit design options.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high performance and reliability, making the transistor suitable for demanding applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures, ensuring stable performance in a wide range of environments.

Transistor Element Material: SILICON

Silicon material offers excellent electrical properties, contributing to the transistor's overall efficiency and reliability in electronic circuits.

Terminal Finish: TIN LEAD

Tin lead finish on terminals provides good solderability and corrosion resistance, ensuring secure connections and long-term functionality.

Maximum Drain Current (ID): 0.02 A

The maximum drain current capability of 0.02 A allows the transistor to handle moderate current loads, making it suitable for various electronic applications.

Maximum Drain-Source On Resistance: 95 ohm

Low on-resistance of 95 ohm results in decreased power loss and improved efficiency, making the transistor an energy-efficient choice for electronic circuits.

Terminal Position: DUAL

Dual terminal position provides flexibility in mounting and connecting the transistor, offering convenience and versatility in circuit board layout.

Peak Reflow Temperature °C: 240

The peak reflow temperature of 240°C ensures reliable soldering and assembly of the transistor on PCBs, contributing to the overall durability of electronic devices.

Technical Specifications

Small Signal Field Effect Transistors (FET) ADG467BRS-REEL attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Analog Devices

Specs

Maximum Drain Current (ID):

.02 A

Maximum Drain-Source On Resistance:

95 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

240

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

ADG467BRS-REEL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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