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ADF7241BCPZ

Analog Devices

ADF7241BCPZ by Analog Devices

Analog Devices' ADF7241BCPZ is a telecom IC with 32 terminals, operating at -40 to 85°C. It has power supplies of 2/3.3V and a peak reflow temperature of 260°C. Ideal for telecom circuits, it comes in a square chip carrier package with matte tin finish and very thin profile.

Median Price

$4.355

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 3,423 parts In-Stock

1+ parts

$5.770

100+ parts

$4.354

1k+ parts

$2.350

10k+ parts

-

3,423

$5.770

$4.354

$2.350

-

DigiKey

USA . 514 parts In-Stock

1+ parts

$5.770

100+ parts

$4.354

1k+ parts

$3.832

10k+ parts

$3.749

514

$5.770

$4.354

$3.832

$3.749

Verical

USA . 1,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.914

10k+ parts

-

1,470

-

-

$2.914

-

Rochester

USA . 244 parts In-Stock

1+ parts

-

100+ parts

$2.940

1k+ parts

$2.630

10k+ parts

$2.470

244

-

$2.940

$2.630

$2.470

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 445 parts In-Stock

1+ parts

$2.688

100+ parts

-

1k+ parts

-

10k+ parts

-

445

$2.688

-

-

-

Bristol Electronics

USA . 68 parts In-Stock

1+ parts

$5.831

100+ parts

$2.740

1k+ parts

-

10k+ parts

-

68

$5.831

$2.740

-

-

Vyrian

USA . 8,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,975

-

-

-

-

Dan-Mar Components

USA . 68 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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68

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 934 parts In-Stock

1+ parts

$0.501

100+ parts

-

1k+ parts

-

10k+ parts

-

934

$0.501

-

-

-

Northwest PG Solutions

USA . 681 parts In-Stock

1+ parts

$0.551

100+ parts

-

1k+ parts

-

10k+ parts

$0.486

681

$0.551

-

-

$0.486

Ampacity Inc.

Singapore . 844 parts In-Stock

1+ parts

$2.410

100+ parts

-

1k+ parts

-

10k+ parts

-

844

$2.410

-

-

-

Semicontronic

India . 411 parts In-Stock

1+ parts

$2.410

100+ parts

$2.350

1k+ parts

$2.338

10k+ parts

-

411

$2.410

$2.350

$2.338

-

Corphita

USA . 743 parts In-Stock

1+ parts

$2.547

100+ parts

-

1k+ parts

-

10k+ parts

-

743

$2.547

-

-

-

Parana Technologies

USA . 1,759 parts In-Stock

1+ parts

$6.477

100+ parts

-

1k+ parts

$6.024

10k+ parts

-

1,759

$6.477

-

$6.024

-

IDEA Electronic Components Group

UK . 1,391 parts In-Stock

1+ parts

$6.965

100+ parts

-

1k+ parts

$6.617

10k+ parts

-

1,391

$6.965

-

$6.617

-

DigiPath Technology Company

USA . 861 parts In-Stock

1+ parts

$10.865

100+ parts

$10.431

1k+ parts

-

10k+ parts

$10.431

861

$10.865

$10.431

-

$10.431

Futuretech Components

Singapore . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 657 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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657

-

-

-

-

Overview

Experience superior quality and reliability with the ADF7241BCPZ by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers innovative solutions for telecommunications interface ICs. This versatile product offers a wide range of applications, providing customers with unmatched value and performance. With its advanced features and high-quality construction, the ADF7241BCPZ ensures optimal functionality and seamless integration into various systems. Upgrade your telecommunications setup today with the ADF7241BCPZ and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and cost-effectiveness for the product.

Surface Mount: YES

Surface mount technology facilitates easy and efficient PCB assembly.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages enhances compatibility with various systems.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile provides efficient thermal management and space-saving design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for operation in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides optimal solderability for the product.

Terminal Position: QUAD

Quad terminal position ensures secure and stable connection on the PCB.

Maximum Seated Height: 0.8 mm

Low maximum seated height enables compact PCB design.

Width: 5 mm

Compact 5mm width helps in space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature ensures efficient soldering process.

Peak Reflow Temperature °C: 260

High peak reflow temperature supports lead-free soldering process.

Length: 5 mm

Compact 5mm length helps in space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and ensures RoHS compliance.

Telecom IC Type: TELECOM CIRCUIT

Telecom circuit type indicates specialized functionality for telecom applications.

Terminal Pitch: 0.5 mm

Fine 0.5mm terminal pitch allows for high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the product can withstand multiple reflows without degradation.

Technical Specifications

Other Function Telecom Interface ICs ADF7241BCPZ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

ADF7241BCPZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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