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ADF7030BCPZN

Analog Devices

ADF7030BCPZN by Analog Devices

Analog Devices ADF7030BCPZN is a 40-terminal telecom IC with 2.5/3.3V power supplies, suitable for industrial applications. With a package style of CHIP CARRIER and QUAD terminal position, it operates b/w -40 to 85 °C temperatures and has a compact size of 6x6mm for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,026 parts In-Stock

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8,026

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Digiode

USA . 764 parts In-Stock

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764

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Distributors (Availability)

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Native Components

USA . 497 parts In-Stock

1+ parts

$0.770

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497

$0.770

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Northwest PG Solutions

USA . 1,431 parts In-Stock

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$0.847

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1,431

$0.847

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AZTECH Wire

Italy . 887 parts In-Stock

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$6.632

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887

$6.632

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Parana Technologies

USA . 1,994 parts In-Stock

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$7.994

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$7.435

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1,994

$7.994

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$7.435

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IDEA Electronic Components Group

UK . 681 parts In-Stock

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$8.596

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$8.166

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681

$8.596

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$8.166

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DigiPath Technology Company

USA . 980 parts In-Stock

1+ parts

$13.410

100+ parts

$12.873

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$12.873

980

$13.410

$12.873

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$12.873

One Stop Electronics

USA . 691 parts In-Stock

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$427.000

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691

$427.000

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Semicontronic

India . 766 parts In-Stock

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$981.000

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$956.475

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$951.570

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766

$981.000

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$951.570

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Corphita

USA . 800 parts In-Stock

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800

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Overview

Enhance your telecom interface systems with the ADF7030BCPZN by Analog Devices. Known for their top-quality products, Analog Devices brings you a cutting-edge solution that offers unmatched performance and reliability. This versatile IC is perfect for a wide range of applications, providing customers with exceptional value and benefits. Whether you're looking to optimize communication systems or upgrade your telecom infrastructure, the ADF7030BCPZN delivers unparalleled advantages that will take your projects to the next level. Trust Analog Devices to elevate your technology solutions with this innovative product.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making this product suitable for mass production.

Power Supplies (V): 2.5/3.3

The ability to operate with multiple power supply voltages provides flexibility in various system configurations.

Package Shape: SQUARE

The square package shape can help in optimizing space utilization on the circuit board.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is reliable in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows for use in extreme conditions with consistent performance.

Technical Specifications

Other Function Telecom Interface ICs ADF7030BCPZN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

ADF7030BCPZN Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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