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AD9861BCPZRL-80

Analog Devices

AD9861BCPZRL-80 by Analog Devices

AD9861BCPZRL-80 by Analog Devices is a 64-terminal telecom IC with a nominal voltage of 3.3V and operating temperature range from -40 to 85 °C. It features a square package shape, matte tin terminal finish, and is suitable for industrial applications requiring very thin profile ICs.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 3,082 parts In-Stock

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Digiode

USA . 117 parts In-Stock

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Native Components

USA . 332 parts In-Stock

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$5.396

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Parana Technologies

USA . 878 parts In-Stock

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$10.931

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IDEA Electronic Components Group

UK . 1,410 parts In-Stock

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$11.754

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AZTECH Wire

Italy . 203 parts In-Stock

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DigiPath Technology Company

USA . 1,410 parts In-Stock

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$18.336

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$17.603

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Semicontronic

India . 169 parts In-Stock

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$354.000

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$345.150

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$343.380

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Component Stockers USA

USA . 299 parts In-Stock

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One Stop Electronics

USA . 1,233 parts In-Stock

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Northwest PG Solutions

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Corphita

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Overview

Elevate your telecom interface systems with the AD9861BCPZRL-80 by Analog Devices. Renowned for their top-quality manufacturing, Analog Devices delivers cutting-edge solutions for various industrial applications. This versatile product boasts a square package shape with 64 terminals and a maximum operating temperature of 85 °C, making it ideal for demanding environments. With a nominal supply voltage of 3.3V, this telecom circuit IC offers exceptional value, reliability, and performance to meet all your connectivity needs. Upgrade your systems today with Analog Devices!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Package Shape: SQUARE

Square package shape provides better space utilization on the PCB, making the overall design more compact.

No. of Terminals: 64

Having 64 terminals allows for a wide range of connections, making the interface IC versatile and suitable for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures efficient heat dissipation and compact design, ideal for telecom applications where space and thermal management are crucial.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding operating conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function reliably in extreme cold environments, increasing its versatility.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and corrosion resistance, ensuring long-term reliability of the connections.

Terminal Position: QUAD

Quad terminal position offers secure and stable connections, reducing the risk of signal loss or interference.

Maximum Seated Height: 1 mm

Low seated height helps in achieving a slim and compact design, crucial for space-constrained applications.

Width: 9 mm

Narrow width makes the IC suitable for designs where space is limited, offering flexibility in PCB layout.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering during assembly, ensuring a strong and durable connection.

Length: 9 mm

Compact length contributes to a space-saving design, enabling efficient placement on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can operate within a wide temperature range, suitable for industrial applications with varying environmental conditions.

Terminal Form: NO LEAD

No-lead terminal form is environmentally friendly and compliant with RoHS regulations, making the IC a sustainable choice.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC offers optimized performance and compatibility in telecommunications systems.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a common standard in many applications, allowing for easy integration into existing systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density packaging, facilitating miniaturization of the overall system.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, making the IC suitable for standard manufacturing processes and storage conditions.

Technical Specifications

Other Function Telecom Interface ICs AD9861BCPZRL-80 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

AD9861BCPZRL-80 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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