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AD21364WBBCZ1XX

Analog Devices

AD21364WBBCZ1XX by Analog Devices

Analog Devices' AD21364WBBCZ1XX DSP features 16-bit address and data bus width, clocking at 55.55 MHz. With a low profile grid array package, it's ideal for industrial applications requiring high-speed signal processing in a compact form factor. Operating b/w -40 to 85°C, this CMOS technology-based processor offers floating-point format and boundary scan capability.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,559 parts In-Stock

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Digiode

USA . 820 parts In-Stock

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820

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Native Components

USA . 15 parts In-Stock

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$1.488

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15

$1.488

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Northwest PG Solutions

USA . 578 parts In-Stock

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$1.637

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AZTECH Wire

Italy . 397 parts In-Stock

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$12.314

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One Stop Electronics

USA . 242 parts In-Stock

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$15.000

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Semicontronic

India . 1,531 parts In-Stock

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$35.000

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$34.125

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$33.950

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Parana Technologies

USA . 520 parts In-Stock

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$47.087

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$43.791

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IDEA Electronic Components Group

UK . 1,488 parts In-Stock

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$50.631

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$48.099

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Corohmni

South Africa . 2 parts In-Stock

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$59.358

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DigiPath Technology Company

USA . 1,528 parts In-Stock

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$78.984

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$75.825

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Corphita

USA . 163 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the AD21364WBBCZ1XX by Analog Devices. As a leader in digital signal processors, Analog Devices delivers unparalleled quality and reliability in every product. Perfect for industrial applications, this DSP offers seamless performance and precision, making it an essential component for your next project. Experience the innovation and efficiency that Analog Devices brings to the table with the AD21364WBBCZ1XX. Elevate your work to new heights with this exceptional DSP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the DSP, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly, saving time and resources.

Maximum Supply Voltage: 1.26 V

With a relatively low maximum supply voltage, this DSP is energy-efficient and can help reduce power consumption.

Address Bus Width: 16

A wide address bus width allows for efficient data handling and processing, making the DSP suitable for high-performance applications.

Package Shape: SQUARE

Square package shape helps optimize PCB layout and space utilization, making it easier to integrate the DSP into electronic systems.

No. of Terminals: 136

Having a high number of terminals allows for more connectivity options and flexibility in system design.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design ensures efficient signal transmission and heat dissipation, enhancing overall performance.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage helps in reducing power consumption and heat generation, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the DSP to withstand harsh environmental conditions and extended use without overheating.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature enables the DSP to function reliably in extreme cold environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering during assembly, ensuring proper connectivity.

Maximum Seated Height: 1.7 mm

Low maximum seated height helps in compact PCB designs and enables easy integration into space-constrained electronic devices.

Width: 12 mm

Compact width allows for efficient PCB layout and space-saving design, ideal for applications with size constraints.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during manufacturing and operation, ensuring reliability.

External Data Bus Width: 16

Wide external data bus width allows for high-speed data transfer and processing, enhancing overall system performance.

Maximum Clock Frequency: 55.55 MHz

High maximum clock frequency enables fast execution of instructions and real-time processing of data, ideal for time-sensitive applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture supports parallel processing and efficient data flow within the DSP, maximizing performance.

Length: 12 mm

Compact length helps in space-efficient PCB design and integration, suitable for applications with size limitations.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Peripheral IC type specifies the DSP's primary function and compatibility with other digital signal processing components, ensuring seamless integration.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making the DSP energy-efficient and versatile.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable solder joints, ensuring stable electrical connections for optimal performance.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and efficient power usage, contributing to overall reliability and longevity.

Terminal Pitch: 0.8 mm

With a small terminal pitch, the DSP allows for high-density packaging, enabling compact PCB designs and efficient use of space.

Format: FLOATING POINT

Floating-point format enables high precision and accuracy in numerical calculations, making the DSP suitable for applications requiring complex mathematical operations.

Barrel Shifter: YES

Barrel shifter feature enhances data manipulation and processing capabilities, improving efficiency and performance in DSP operations.

Technical Specifications

Digital Signal Processors (DSPs) AD21364WBBCZ1XX attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

55.55 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B136

Length:

12 mm

Low Power Mode:

NO

No. of Terminals:

136

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

AD21364WBBCZ1XX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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