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AD21364WBBCZ105

Analog Devices

AD21364WBBCZ105 by Analog Devices

Analog Devices' AD21364WBBCZ105 is a 32-bit DSP with 16-bit address and data bus width, operating at up to 16.67 MHz clock frequency. Suitable for industrial applications, it features a low-profile grid array package with 136 terminals and operates b/w -40°C to 85°C temperature range.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,447 parts In-Stock

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Digiode

USA . 764 parts In-Stock

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764

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Distributors (Availability)

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Native Components

USA . 131 parts In-Stock

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$0.652

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131

$0.652

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Northwest PG Solutions

USA . 464 parts In-Stock

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$0.717

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AZTECH Wire

Italy . 708 parts In-Stock

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$16.516

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One Stop Electronics

USA . 506 parts In-Stock

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$25.000

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Semicontronic

India . 1,558 parts In-Stock

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$31.000

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$30.225

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$30.070

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Parana Technologies

USA . 85 parts In-Stock

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$35.996

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$33.476

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IDEA Electronic Components Group

UK . 444 parts In-Stock

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$38.705

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$36.770

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DigiPath Technology Company

USA . 2,175 parts In-Stock

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$60.380

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$57.965

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$57.965

Corohmni

South Africa . 985 parts In-Stock

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$62.871

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Corphita

USA . 206 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the AD21364WBBCZ105 by Analog Devices. This cutting-edge DSP offers unmatched quality and reliability, thanks to Analog Devices' reputation as a leading manufacturer in the industry. Ideal for a wide range of applications, this DSP delivers exceptional performance and efficiency that will take your projects to the next level. Experience seamless integration and superior functionality with the AD21364WBBCZ105, providing tremendous value and benefits to customers seeking top-notch solutions for their digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and labor costs during assembly.

Maximum Supply Voltage: 1.26 V

Optimal maximum supply voltage for efficient performance while also ensuring safety of the device.

Address Bus Width: 16

Wide address bus width allows for efficient data processing and handling of complex algorithms.

Package Shape: SQUARE

Square package shape provides a compact form factor, saving space on the PCB and improving overall design aesthetics.

Bit Size: 32

Large bit size allows for high precision calculations and efficient processing of digital signals.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for flexibility in different operating environments and power requirements.

No. of Terminals: 136

Provides ample connectivity options for interfacing with other electronic components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch leads to improved signal integrity and thermal performance.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures energy efficiency and helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operational reliability even in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and robust terminal connections for enhanced durability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and soldering, simplifying the assembly process.

Maximum Seated Height: 1.7 mm

Low seated height allows for compact PCB design and efficient utilization of space.

RAM Words: 98304

Large RAM capacity allows for storage and retrieval of a vast amount of data during signal processing operations.

Width: 12 mm

Compact width dimensions enable space-saving integration in electronic devices with limited PCB real estate.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, enhancing overall system reliability.

External Data Bus Width: 16

Wide external data bus width facilitates rapid data transfer and processing between the DSP and external devices.

Maximum Clock Frequency: 16.67 MHz

High maximum clock frequency enables fast execution of instructions and efficient operation of the DSP.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and internal communication for optimized performance.

Length: 12 mm

Compact length dimensions enable space-efficient integration in electronic devices and PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Mixed peripheral IC type allows for versatile operation and compatibility with a wide range of digital signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital signal processing algorithms.

Terminal Form: BALL

Ball terminal form provides robust electrical connections and facilitates easy soldering during PCB assembly.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable performance during signal processing operations.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting and efficient use of PCB space for component placement.

Format: FLOATING POINT

Floating-point format enables high-precision numerical calculations and processing of complex mathematical algorithms.

Barrel Shifter: YES

Barrel shifter functionality enhances data processing efficiency and speed by enabling rapid shifting operations within the DSP.

Technical Specifications

Digital Signal Processors (DSPs) AD21364WBBCZ105 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

16.67 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B136

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

136

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA136,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

98304

Maximum Seated Height:

1.7 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

AD21364WBBCZ105 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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