Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Alliance Memory's AS6C8016-55ZIN is a 512Kx16 SRAM with 55ns access time, operating at 3V. Ideal for industrial applications, it features a small outline package and common I/O type. With a max supply voltage of 5.5V, this CMOS technology memory IC offers high performance in a compact form factor.
Median Price
$8.052
Lifecycle Status
Suppliers In-Stock
28
In-Stock Inventory
1k+
Mouser Electronics
1+ parts
$7.900
100+ parts
$6.390
1k+ parts
$5.680
10k+ parts
-
Element14
$8.205
$6.767
$6.421
Farnell
$8.690
$6.388
$6.185
DigiKey
$9.180
$8.082
$7.418
$7.230
Newark
$11.140
$7.920
$6.440
Avnet
Verical
$7.212
Future Electronics
$5.270
RS (Exports)
$5.972
Nova Conductors
$6.013
Ozdisan Elektronik
$6.990
TME
$8.800
$7.400
Chip Stock
VNN
Kruse
ARCO, INC.
Kruse Electronics AG
IBS Electronics
$6.381
Vyrian
Cyclops Electronics Ltd
Bristol Electronics
Flex Direct, LLC
NAC Semi
$28.810
Tectiva GmbH
Rutronik
$9.680
LIBRA Elektronik GmbH
ComSIT Distribution GmbH
Rebound Electronics
Aztec Data Supply Inc.
$2.270
Continental Prestige Electronics
$5.893
Component Stockers USA
$7.610
$6.140
$5.460
Perfect Parts
Argo Parts USA
Kepictronics
GreenTree Electronics
EMSNET (Excess)
Netroflash
$5.713
$5.593
Cyclops Electronics Ltd (Excess)
The plastic/epoxy material used in the package body ensures durability and protection for the internal components of the SRAM.
Being surface mountable allows for easier installation and space-saving on the circuit board.
The asynchronous operation mode provides flexibility and compatibility with various systems and applications.
Operating at a nominal supply voltage of 3V offers efficient power consumption without compromising performance.
Having 44 terminals enables seamless connectivity and communication with other components in the system.
With a high memory density, this SRAM can store a large amount of data efficiently.
The fast access time of 55 nanoseconds ensures quick retrieval of data, making it suitable for high-performance applications.
SRAM AS6C8016-55ZIN attributes and parameters. Explore more SRAM devices from Alliance Memory
Maximum Access Time:
Input/Output Type:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Power Supplies (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Minimum Standby Voltage:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
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Terminal Position:
Width:
AS6C8016-55ZIN Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
Alliance Memory is a worldwide fabless manufacturer of legacy and new technology memory products that are pin for pin drop-in replacements for SRAM, DRAM, and NOR FLASH ICs from Micron, Samsung, ISSI, Cypress, Nanya, Hynix and others. Our product portfolio includes a full range of 3.3V and 5V Asynchronous SRAMs used with mainstream digital signal processors (DSPs) and microcontrollers; and synchronous SRAMs, low-power SRAMs, Pseudo SRAMs, 3.3V synchronous DRAMs (SDR), mobile DDRs, 2.5V single (DDR1), 1.8V double (DDR2), and 1.5V and 1.35V triple rate (DDR3) 1.2V quadruple rate(DDR4) synchronous DRAMs, along with 5V Parallel NOR Flash devices. A high wafer die investment means we can minimize or eliminate die shrinks while maintaining stable pricing. Our goal is to establish long-term relationships with customers and to provide long-term support for the parts we manufacture. We deliver most of our SRAM, DRAM, and FLASH products direct from stock, with inventory held in the U.S., Shanghai and Taiwan. Our competitive pricing, quick sample turnaround, and world-class customer service and support have made Alliance Memory a trusted resource for a growing range of must-have memory ICs for the communications, computing, embedded, IoT, industrial, and consumer markets. Alliance Memory, Inc. is a privately held company with headquarters in Kirkland, Washington.
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Hy Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
International Devices
1N4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
ULN2803ADWR
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRA160T3G
Onsemi
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Transistor & Electronic
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
BAV99
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
IS66WVE4M16EALL-70BLI-TR
Integrated Silicon Solution
IS66WVE4M16EALL-70BLI-TR by Integrated Silicon Solution is a 4MX16 SRAM with 67108864-bit memory density. It operates in asynchronous mode with a max access time of 70ns. Ideal for industrial applications requiring high-speed parallel memory solutions.
CY62147EV30LL-45ZSXIT
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
CY62157EV30LL-45ZXI
Infineon's CY62157EV30LL-45ZXI is a 512Kx16 SRAM with 3.3V supply, 45ns access time, and operates in industrial temperature range. Ideal for applications requiring fast and reliable data storage in compact systems. Features include asynchronous operation, common I/O type, and 3-state output characteristics.
DS1245Y-70+
Maxim Integrated
NON-VOLATILE SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
CY7C1061G30-10BVJXI
Infineon's CY7C1061G30-10BVJXI is a 1MX16 SRAM with 10ns access time, operating at 3V. It features a very thin profile grid array package and CMOS technology. Ideal for industrial applications requiring fast parallel memory operations.
STK14C88-NF25
Force Technologies
NON-VOLATILE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
5962-8855202XA
Defense Logistics Agency
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
N64S830HAS22I
N64S830HAS22I by Onsemi is an 8KX8 SRAM with 3-STATE output, operating at 20 MHz clock frequency. It has a memory density of 65536 bit and operates at industrial temperature grade. Ideal for applications requiring fast synchronous memory access in compact designs.
IDT71V416S15PHGI
Integrated Device Technology
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Position: DUAL;
5962-8685920YA
Matra Design Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 22; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 16384 words;
IDT71V547S100PFGI8
Renesas Electronics
The Renesas Electronics IDT71V547S100PFGI8 is a 128Kx36 ZBT SRAM with synchronous operation and 10 ns access time. It operates at 3.3V, has a memory density of 4718592 bit, and is ideal for industrial applications requiring fast parallel memory access.
CY62128ELL-45ZAXIT
Infineon's CY62128ELL-45ZAXIT is a 128Kx8 SRAM with 45ns access time, operating at 5V. It features a small outline package, common I/O type, and asynchronous mode. Ideal for industrial applications requiring fast and reliable memory storage in compact spaces.
71V424S10PHGI
Renesas Electronics' 71V424S10PHGI is a 512Kx8 SRAM with 3.3V supply, operating in asynchronous mode. It features a small outline package, industrial temperature grade, and Gull Wing terminals. Ideal for applications requiring fast access times and high memory density like industrial control systems.
70V27L20PFGI8
Renesas Electronics 70V27L20PFGI8 is a 32Kx16 SRAM with 3.3V supply voltage, operating in industrial temperature range. It features asynchronous operation, 3-STATE output, and common I/O type. Ideal for applications requiring fast access time and low power consumption in compact designs.
CY62146EV30LL-45ZSXI
CY62146EV30LL-45ZSXI by Infineon Technologies is a 256Kx16 SRAM with 3.6V max supply voltage, 45ns access time, and operates in industrial temperature range. It features common I/O type, 3-state output characteristics, and parallel technology. Ideal for applications requiring fast and reliable memory storage in harsh environments.
CY14V116N-BZ30XI
Infineon's CY14V116N-BZ30XI is a 1MX16 SRAM with 3V supply, operating in industrial temperature range. It features asynchronous mode, 30ns access time, and non-volatile memory technology. Ideal for applications requiring high-speed parallel memory with low power consumption.
5962-8685904LA
Defense Logistics Agency's 5962-8685904LA SRAM features 16KX4 organization, CMOS technology, and MIL-STD-883 screening. With a memory density of 65536 bit, it operates in asynchronous mode at temperatures ranging from -55 to 125 °C. Ideal for military applications due to its MILITARY temperature grade and parallel operation with a max access time of 70 ns.
AS6C8008-55ZIN
Alliance Memory
AS6C8008-55ZIN by Alliance Memory is a 1MX8 SRAM with 55 ns access time, operating at 3V. It features a small outline package and is ideal for industrial applications requiring fast and reliable memory storage. With 8388608 bit density, this CMOS technology-based chip offers common I/O type and 3-state output characteristics.
IDT7007L20JGI8
The Renesas Electronics IDT7007L20JGI8 is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a max access time of 20ns and memory density of 262144 bits. Ideal for industrial applications requiring fast parallel memory access in a grid array package style.
R1LP0408DSP-5SI#S0
Renesas Electronics' R1LP0408DSP-5SI#S0 is a 512Kx8 SRAM with 55ns access time, operating at 5V. It features a small outline package, 3-state output, and industrial temperature grade. Ideal for applications requiring fast and reliable memory storage in industrial settings.
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AS6C62256-55SINTR
STANDARD SRAM; Moisture Sensitivity Level (MSL): 3;
AS6C62256-55SIN
Alliance Memory's AS6C62256-55SIN is a 32Kx8 SRAM with 55ns access time, operating at 3.3V. Ideal for industrial applications requiring fast and reliable asynchronous memory with common I/O type in a small outline package.
AS6C4008-55PCN
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
AS6C4008-55SINTR
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
AS6C62256-55PCN
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 3.937 mm;
AS6C1008-55PCN
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 55 ns;
AS6C4008-55SIN
Alliance Memory's AS6C4008-55SIN is a 512Kx8 SRAM with 55ns access time, operating at 3V. Ideal for industrial applications, it features a small outline package, common I/O type, and 3-state output characteristics.
AS6C1008-55SINTR
Alliance Memory's AS6C1008-55SINTR is a 128Kx8 SRAM with 55ns access time. Operating at 3V, it features asynchronous mode and common I/O type. Ideal for industrial applications requiring fast and reliable memory storage.
AS6C1008-55SIN
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Width: 11.303 mm;
AS6C4008-55STIN
Alliance Memory's AS6C4008-55STIN is a 512Kx8 SRAM with 55ns access time, operating at 3V. Ideal for industrial applications, it features a small outline package with dual terminals and common I/O type. With low standby voltage of 2V and power consumption of 60mA, it offers reliable performance in various electronic devices.
AS6C4008-55TIN
Alliance Memory's AS6C4008-55TIN is a 512Kx8 SRAM with 55ns access time, operating at 3V. Ideal for industrial applications, it features a small outline package and common I/O type. With 524288 words and parallel interface, it offers reliable memory storage in compact systems.
AS6C4008-55BIN
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 36; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 55 ns;
AS6C4008-55ZIN
Alliance Memory's AS6C4008-55ZIN is a 512Kx8 SRAM with a max access time of 55ns. It operates asynchronously and has a power supply range of 3V to 5V. This memory IC is commonly used in industrial applications requiring fast and reliable data storage.
AS6C4008-55ZINTR
Alliance Memory's AS6C4008-55ZINTR is a 512Kx8 SRAM with 55ns access time, operating at 3/5V. Ideal for industrial applications, it features a small outline package, common I/O type, and 3-state output characteristics.
AS6C4008-55PIN
STANDARD SRAM; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
AS6C3216-55TIN
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
AS6C8008-55BIN
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; Minimum Standby Voltage: 2 V;
AS6C1008-55SINL
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 1048576 bit;
AS6C8016-55TINTR
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Minimum Standby Voltage: 1.2 V;
Supply Digital Components
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12,000 In-Stock
Total price ≈ $80,197.29
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