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BASEBAND CIRCUIT Cellphone ICs 66

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
ADF4360-1BCPZ by Analog Devices

ADF4360-1BCPZ

Analog Devices

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-2BCPZ by Analog Devices

ADF4360-2BCPZ

Analog Devices

Analog Devices' ADF4360-2BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial telecom settings.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-3BCPZ by Analog Devices

ADF4360-3BCPZ

Analog Devices

ADF4360-3BCPZ by Analog Devices is a cellphone IC with a square package shape and 24 terminals. It operates at temperatures ranging from -40 to 85 °C and has a nominal voltage of 3.3 V. This IC is commonly used in baseband circuit applications.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-3BCPZRL by Analog Devices

ADF4360-3BCPZRL

Analog Devices

Analog Devices ADF4360-3BCPZRL is a 24-terminal cellphone IC with 3.3V power supply, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in industrial telecom applications due to its compact square chip carrier package style.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-3BCPZRL7 by Analog Devices

ADF4360-3BCPZRL7

Analog Devices

Analog Devices' ADF4360-3BCPZRL7 is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, -40 to 85°C temperature range, and matte tin finish. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-4BCPZ by Analog Devices

ADF4360-4BCPZ

Analog Devices

Analog Devices' ADF4360-4BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial settings.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-4BCPZRL by Analog Devices

ADF4360-4BCPZRL

Analog Devices

Analog Devices' ADF4360-4BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, quad terminal position, and matte tin finish. Ideal for baseband circuits in telecom applications, it has a compact square package with a very thin profile and can withstand industrial temperatures from -40 to 85°C.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-5BCPZ by Analog Devices

ADF4360-5BCPZ

Analog Devices

Analog Devices' ADF4360-5BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, BICMOS technology, and -40 to 85 °C operating temperature range. It features a square package shape, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-6BCPZ by Analog Devices

ADF4360-6BCPZ

Analog Devices

Analog Devices' ADF4360-6BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85 °C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial telecom settings.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-6BCPZRL7 by Analog Devices

ADF4360-6BCPZRL7

Analog Devices

Analog Devices' ADF4360-6BCPZRL7 is a cellphone IC with 24 terminals, BICMOS technology, and 3.3V supply voltage. It operates b/w -40 to 85 °C, suitable for baseband circuits in industrial telecom applications due to its compact square package and low profile design.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

AD6654BBC by Analog Devices

AD6654BBC

Analog Devices

AD6654BBC by Analog Devices is a Cellphone IC with 256 terminals in a square grid array package. It operates b/w -25 °C to 85°C, with a nominal voltage of 1.8V. This BASEBAND CIRCUIT IC is designed for telecom applications, featuring surface mount capability and TIN LEAD SILVER terminal finish.

S-PBGA-B256

e0

17 mm

3

1

256

85 Cel

-25 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

240

Not Qualified

1.85 mm

1.8 V

YES

BASEBAND CIRCUIT

OTHER

TIN LEAD SILVER

BALL

1 mm

BOTTOM

17 mm

AD607ARSZ by Analog Devices

AD607ARSZ

Analog Devices

AD607ARSZ by Analog Devices is a cellphone IC with 20 terminals in a small outline package. Operating temp range -25 to 85°C, nominal voltage of 3V, and peak reflow temp of 260°C. Ideal for telecom applications as a baseband circuit due to its compact size and gull wing terminal form.

R-PDSO-G20

e3

7.2 mm

1

1

20

85 Cel

-25 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

260

Not Qualified

2 mm

3 V

YES

BASEBAND CIRCUIT

OTHER

MATTE TIN

GULL WING

.65 mm

DUAL

5.3 mm

AD6634BBCZ by Analog Devices

AD6634BBCZ

Analog Devices

AD6634BBCZ by Analog Devices is a Cellphone IC with 196 terminals in a square grid array package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. Features CMOS technology, 2.5V supply voltage, and baseband circuit for telecom applications.

S-PBGA-B196

e1

15 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

Not Qualified

2.5 V

YES

CMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

15 mm

AD607ARSZ-REEL by Analog Devices

AD607ARSZ-REEL

Analog Devices

AD607ARSZ-REEL by Analog Devices is a BASEBAND CIRCUIT for cellphones. It operates b/w -25 to 85°C with a supply voltage of 3V. This SMALL OUTLINE IC has 20 terminals, matte tin finish, and measures 7.2mm x 5.3mm in size for telecom applications.

R-PDSO-G20

e3

7.2 mm

1

1

20

85 Cel

-25 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

260

Not Qualified

2 mm

3 V

YES

BASEBAND CIRCUIT

OTHER

MATTE TIN

GULL WING

.65 mm

DUAL

5.3 mm

ADF7025BCPZ by Analog Devices

ADF7025BCPZ

Analog Devices

Analog Devices' ADF7025BCPZ is a cellphone IC with 48 terminals in a square chip carrier package. It operates at temperatures from -40 to 85 °C, with power supplies of 2.5/3.3V. Ideal for baseband circuits, it has a very thin profile and matte tin finish for industrial telecom applications.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

7 mm

BGA7204,115 by NXP Semiconductors

BGA7204,115

NXP Semiconductors

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N32

5 mm

1

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.85 mm

5 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

5 mm

BLM6G10-30G,118 by NXP Semiconductors

BLM6G10-30G,118

NXP Semiconductors

BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN;

R-PDSO-G16

e3

15.9 mm

3

1

16

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

245

3.6 mm

28 V

YES

BASEBAND CIRCUIT

TIN

GULL WING

1.37 mm

DUAL

30

11 mm

BLM6G10-30G,135 by NXP Semiconductors

BLM6G10-30G,135

NXP Semiconductors

BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 15.9 mm;

R-PDSO-G16

e3

15.9 mm

1

16

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

3.6 mm

28 V

YES

BASEBAND CIRCUIT

Tin (Sn)

GULL WING

1.37 mm

DUAL

11 mm