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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC3S1400AN-4FG676C by Xilinx

XC3S1400AN-4FG676C

Xilinx

Xilinx XC3S1400AN-4FG676C FPGA features 25344 logic cells, 2816 CLBs, and 1400000 gates. With a max clock frequency of 667 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

25344

502

408

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S1400AN-4FGG676C by Xilinx

XC3S1400AN-4FGG676C

Xilinx

Xilinx XC3S1400AN-4FGG676C FPGA offers 25344 logic cells, 2816 CLBs, and 1400000 gates. Ideal for applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Package style: grid array, surface mountable in plastic/epoxy material.

FPGA

25344

502

408

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S1400AN-5FGG676C by Xilinx

XC3S1400AN-5FGG676C

Xilinx

The Xilinx XC3S1400AN-5FGG676C is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 equivalent gates. It operates at a max frequency of 770 MHz and has 502 inputs and 408 outputs. Ideal for applications requiring high-speed processing and complex logic functions in electronic systems.

FPGA

25344

502

408

2816

1400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S200AN-4FT256C by Xilinx

XC3S200AN-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S200AN-5FT256C by Xilinx

XC3S200AN-5FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S200AN-5FTG256C by Xilinx

XC3S200AN-5FTG256C

Xilinx

The Xilinx XC3S200AN-5FTG256C is a FPGA with 4032 logic cells, 448 CLBs, and 195 inputs. It operates at max frequency of 770 MHz and has 160 outputs. Ideal for applications requiring high-speed processing in fields like telecommunications and industrial automation.

FPGA

4032

195

160

448

200000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S400AN-4FG400C by Xilinx

XC3S400AN-4FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S400AN-5FGG400C by Xilinx

XC3S400AN-5FGG400C

Xilinx

Xilinx XC3S400AN-5FGG400C is a FPGA with 8064 logic cells, 896 CLBs, and 400000 gates. It operates at max frequency of 770 MHz and has 311 inputs and 248 outputs. Ideal for high-performance applications requiring fast processing speeds in electronics and telecommunications industries.

FPGA

8064

311

248

896

400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S50AN-5TQG144C by Xilinx

XC3S50AN-5TQG144C

Xilinx

XC3S50AN-5TQG144C by Xilinx is a FPGA with 1584 logic cells, 176 CLBs, and 50000 gates. It operates at a max frequency of 770 MHz and has 108 inputs and 101 outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications due to its advanced CMOS technology.

FPGA

1584

108

101

176

50000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC3S700AN-4FG484C by Xilinx

XC3S700AN-4FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S700AN-4FGG484C by Xilinx

XC3S700AN-4FGG484C

Xilinx

Xilinx XC3S700AN-4FGG484C FPGA features 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. It operates at a max frequency of 667 MHz with a combinatorial delay of 0.71 ns per CLB. Ideal for high-performance applications requiring fast processing speeds in telecommunications, aerospace, and industrial automation.

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S700AN-5FGG484C by Xilinx

XC3S700AN-5FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC4VLX25-10FFG676C by Xilinx

XC4VLX25-10FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

448

448

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC4VLX25-12FFG676C by Xilinx

XC4VLX25-12FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

448

448

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX110-3FFG1153C by Xilinx

XC5VLX110-3FFG1153C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.67 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1153

S-PBGA-B1153

e1

No

XC5VLX110-3FFG676C by Xilinx

XC5VLX110-3FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

440

440

8640

0.67 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX110T-3FFG1136C by Xilinx

XC5VLX110T-3FFG1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

640

640

8640

0.67 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VLX30-3FF324C by Xilinx

XC5VLX30-3FF324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

220

220

2400

0.67 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Lead

1 mm

324

S-PBGA-B324

e0

No

XC5VLX30-3FFG324C by Xilinx

XC5VLX30-3FFG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

220

220

2400

0.67 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

XC5VLX30-3FFG676C by Xilinx

XC5VLX30-3FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

400

400

2400

0.67 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX30T-3FFG665C by Xilinx

XC5VLX30T-3FFG665C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

360

360

2400

1412 MHz

CMOS

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VLX50-3FF324C by Xilinx

XC5VLX50-3FF324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

220

220

3600

0.67 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Lead

1 mm

324

S-PBGA-B324

e0

No

XC5VLX50-3FF676C by Xilinx

XC5VLX50-3FF676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

440

440

3600

0.67 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX50-3FFG1153C by Xilinx

XC5VLX50-3FFG1153C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

560

560

3600

0.67 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1153

S-PBGA-B1153

e1

No

XC5VLX50T-3FFG1136C by Xilinx

XC5VLX50T-3FFG1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

480

480

3600

0.67 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

10.5 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VLX85-3FFG1153C by Xilinx

XC5VLX85-3FFG1153C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

82944

560

560

6480

0.67 ns

Field Programmable Gate Arrays

6480 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1153

S-PBGA-B1153

e1

No

XC5VLX85-3FFG676C by Xilinx

XC5VLX85-3FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

82944

440

440

6480

0.67 ns

Field Programmable Gate Arrays

6480 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX85T-3FF1136C by Xilinx

XC5VLX85T-3FF1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

82944

480

480

6480

0.67 ns

Field Programmable Gate Arrays

6480 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VSX35T-3FFG665C by Xilinx

XC5VSX35T-3FFG665C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

34816

360

360

2720

0.67 ns

CMOS

Field Programmable Gate Arrays

2720 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VSX50T-3FFG665C by Xilinx

XC5VSX50T-3FFG665C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

52224

360

360

4080

0.67 ns

CMOS

Field Programmable Gate Arrays

4080 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC6VHX250T-1FFG1154C by Xilinx

XC6VHX250T-1FFG1154C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1154; Package Code: BGA; Package Shape: SQUARE;

FPGA

251904

320

320

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1154,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1154

S-PBGA-B1154

e1

No

XC6VHX250T-2FFG1154C by Xilinx

XC6VHX250T-2FFG1154C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1154; Package Code: BGA; Package Shape: SQUARE;

FPGA

251904

320

320

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1154,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1154

S-PBGA-B1154

e1

No

XC6VHX255T-2FFG1923C by Xilinx

XC6VHX255T-2FFG1923C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1923; Package Code: BGA; Package Shape: SQUARE;

FPGA

253440

480

480

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1923,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1923

S-PBGA-B1923

e1

No

XC6VHX380T-1FFG1923C by Xilinx

XC6VHX380T-1FFG1923C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1923; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

720

720

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1923,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1923

S-PBGA-B1923

e1

No

XC6VHX380T-1FFG1924C by Xilinx

XC6VHX380T-1FFG1924C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

640

640

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1924,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1924

S-PBGA-B1924

e1

No

XC6VHX380T-2FFG1154C by Xilinx

XC6VHX380T-2FFG1154C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1154; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

320

320

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1154,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1154

S-PBGA-B1154

e1

No

XC6VHX380T-2FFG1155C by Xilinx

XC6VHX380T-2FFG1155C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

440

440

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1155,34X34,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1155

S-PBGA-B1155

e1

No

XC6VHX380T-2FFG1923C by Xilinx

XC6VHX380T-2FFG1923C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1923; Package Code: BGA; Package Shape: SQUARE;

FPGA

382464

720

720

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.85 mm

BGA1923,44X44,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1923

S-PBGA-B1923

e1

No

XC6VLX130T-1FF1156C by Xilinx

XC6VLX130T-1FF1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VLX130T-1FF784C by Xilinx

XC6VLX130T-1FF784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX130T-1FFG1156C by Xilinx

XC6VLX130T-1FFG1156C

Xilinx

Xilinx XC6VLX130T-1FFG1156C is a FPGA with 128K logic cells, 600 inputs/outputs, and max clock frequency of 1098 MHz. It operates at 0-85°C, uses CMOS technology, and has a grid array package style. Ideal for high-performance computing applications requiring fast processing speeds in compact designs.

FPGA

128000

600

600

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VLX130T-1FFG484C by Xilinx

XC6VLX130T-1FFG484C

Xilinx

Xilinx XC6VLX130T-1FFG484C FPGA features 128000 logic cells, 240 inputs/outputs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

128000

240

240

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX130T-1FFG784C by Xilinx

XC6VLX130T-1FFG784C

Xilinx

The Xilinx XC6VLX130T-1FFG784C is a FPGA with 128,000 logic cells and 400 inputs/outputs. Operating at a max frequency of 1098 MHz, it uses CMOS technology and has a max supply voltage of 1.05 V. Ideal for applications requiring high-speed processing and programmable ICs in various industries.

FPGA

128000

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX130T-2FF1156C by Xilinx

XC6VLX130T-2FF1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

600

600

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XC6VLX130T-2FFG1156C by Xilinx

XC6VLX130T-2FFG1156C

Xilinx

Xilinx XC6VLX130T-2FFG1156C is a FPGA with 128K logic cells, 600 inputs/outputs, and max clock frequency of 1.286 GHz. It operates at 0-85°C, suitable for high-speed applications like telecommunications and networking due to its advanced CMOS technology.

FPGA

128000

600

600

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VLX130T-2FFG484C by Xilinx

XC6VLX130T-2FFG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

240

240

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX130T-2FFG784C by Xilinx

XC6VLX130T-2FFG784C

Xilinx

Xilinx XC6VLX130T-2FFG784C is a 128000 logic cell FPGA with 400 inputs/outputs, operating at max frequency of 1286 MHz. It uses CMOS technology with supply voltage range of 0.95V to 1.2/2.5V. Ideal for applications requiring high-speed processing and programmable ICs in compact form factor.

FPGA

128000

400

400

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX130T-L1FFG1156C by Xilinx

XC6VLX130T-L1FFG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

600

600

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No