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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
LFXP3C-3TN144C by Lattice Semiconductor

LFXP3C-3TN144C

Lattice Semiconductor

LFXP3C-3TN144C by Lattice Semiconductor is a 384 CLB FPGA with 100 inputs/outputs, operating at max 375 MHz. Ideal for applications requiring high-speed processing in compact designs due to its low profile and fine pitch package style. With a max supply voltage of 3.465V, it offers flexibility and efficiency in various electronic systems.

FPGA

384

100

100

384

375 MHz

0.63 ns

CMOS

Field Programmable Gate Arrays

384 CLBS

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

LFXP3C-5TN144C by Lattice Semiconductor

LFXP3C-5TN144C

Lattice Semiconductor

LFXP3C-5TN144C by Lattice Semiconductor is a 384 CLB FPGA with 100 inputs/outputs, operating at max frequency of 375 MHz. It uses CMOS technology, has a supply voltage range of 1.71V to 3.465V, and is ideal for applications requiring high-speed processing in compact designs.

FPGA

384

100

100

384

375 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

384 CLBS

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

LFXP6C-5TN144C by Lattice Semiconductor

LFXP6C-5TN144C

Lattice Semiconductor

LFXP6C-5TN144C by Lattice Semiconductor is a 720 CLB FPGA with 100 inputs/outputs, operating at max frequency of 375 MHz. With a supply voltage range of 1.71V to 3.465V, it's ideal for applications requiring high-speed processing and programmable logic in compact designs. Package style: Flatpack, low profile, fine pitch.

FPGA

720

100

100

720

375 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

720 CLBS

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC3S100E-4CPG132C by Xilinx

XC3S100E-4CPG132C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

2160

83

72

240

100000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

240 CLBS, 100000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

XC5VLX110-1FF1153C by Xilinx

XC5VLX110-1FF1153C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Lead

1 mm

1153

S-PBGA-B1153

e0

No

XC5VLX110-1FF1760C by Xilinx

XC5VLX110-1FF1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX110-1FF676C by Xilinx

XC5VLX110-1FF676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

440

440

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX110-1FFG1153C by Xilinx

XC5VLX110-1FFG1153C

Xilinx

XC5VLX110-1FFG1153C by Xilinx is a FPGA with 110592 logic cells, 8640 CLBs, and 800 inputs/outputs. It operates at 1.05V max voltage, 0.95V min voltage, and has a combinatorial delay of 0.9ns per CLB. Ideal for applications requiring high-speed processing and customization in electronics design.

FPGA

110592

800

800

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1153

S-PBGA-B1153

e1

No

XC5VLX110-1FFG1760C by Xilinx

XC5VLX110-1FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin/Silver/Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX110-1FFG676C by Xilinx

XC5VLX110-1FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

440

440

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX110-2FF1153C by Xilinx

XC5VLX110-2FF1153C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.77 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Lead

1 mm

1153

S-PBGA-B1153

e0

No

XC5VLX110-2FF1760C by Xilinx

XC5VLX110-2FF1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.77 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX110-2FF676C by Xilinx

XC5VLX110-2FF676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

440

440

8640

0.77 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX110-2FFG1153C by Xilinx

XC5VLX110-2FFG1153C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.77 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1153

S-PBGA-B1153

e1

No

XC5VLX110-2FFG1760C by Xilinx

XC5VLX110-2FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.77 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin/Silver/Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX110T-1FF1136C by Xilinx

XC5VLX110T-1FF1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

640

640

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VLX110T-1FF1738C by Xilinx

XC5VLX110T-1FF1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

680

680

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VLX110T-1FFG1136C by Xilinx

XC5VLX110T-1FFG1136C

Xilinx

Xilinx XC5VLX110T-1FFG1136C is a FPGA with 110592 logic cells, 8640 CLBs, and 640 inputs/outputs. Operating at 1.05V, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

110592

640

640

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VLX110T-1FFG1738C by Xilinx

XC5VLX110T-1FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

680

680

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VLX110T-2FF1136C by Xilinx

XC5VLX110T-2FF1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

640

640

8640

0.77 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VLX110T-2FFG1136C by Xilinx

XC5VLX110T-2FFG1136C

Xilinx

The Xilinx XC5VLX110T-2FFG1136C is a FPGA with 110592 logic cells, 8640 CLBs, and 640 inputs/outputs. It operates at 1.05V, has a max combinatorial delay of 0.77ns, and supports power supplies of 1V and 2.5V. Ideal for applications requiring high-speed processing in telecommunications, aerospace, and industrial automation industries.

FPGA

110592

640

640

8640

0.77 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VLX110T-2FFG1738C by Xilinx

XC5VLX110T-2FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

680

680

8640

0.77 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VLX220-1FFG1760C by Xilinx

XC5VLX220-1FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

800

800

17280

0.9 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX220-2FFG1760C by Xilinx

XC5VLX220-2FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

800

800

17280

0.77 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX220T-1FFG1738C by Xilinx

XC5VLX220T-1FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

680

680

17280

0.9 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VLX220T-2FFG1738C by Xilinx

XC5VLX220T-2FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

680

680

17280

0.77 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VLX30-1FF676C by Xilinx

XC5VLX30-1FF676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

400

400

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX30-1FFG324C by Xilinx

XC5VLX30-1FFG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

220

220

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

XC5VLX30-1FFG676C by Xilinx

XC5VLX30-1FFG676C

Xilinx

The Xilinx XC5VLX30-1FFG676C is a FPGA with 30720 logic cells, 2400 CLBs, and 400 inputs/outputs. Operating at 1.05V, it has a max combinatorial delay of 0.9ns and can withstand temperatures up to 85°C. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.

FPGA

30720

400

400

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX30-2FF676C by Xilinx

XC5VLX30-2FF676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

400

400

2400

0.77 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX30-2FFG676C by Xilinx

XC5VLX30-2FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

400

400

2400

0.77 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX30T-1FF665C by Xilinx

XC5VLX30T-1FF665C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

360

360

2400

1098 MHz

CMOS

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Lead

1 mm

665

S-PBGA-B665

e0

No

XC5VLX30T-1FFG665C by Xilinx

XC5VLX30T-1FFG665C

Xilinx

Xilinx XC5VLX30T-1FFG665C FPGA features 30720 logic cells, 2400 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data processing units.

FPGA

30720

360

360

2400

1098 MHz

CMOS

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VLX30T-2FFG665C by Xilinx

XC5VLX30T-2FFG665C

Xilinx

Xilinx XC5VLX30T-2FFG665C FPGA features 30720 logic cells, 2400 CLBs, and a max clock frequency of 1265 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

30720

360

360

2400

1265 MHz

CMOS

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VLX330-1FFG1760C by Xilinx

XC5VLX330-1FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

1200

1200

25920

0.9 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX330-2FF1760C by Xilinx

XC5VLX330-2FF1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

1200

1200

25920

0.77 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX330T-1FFG1738C by Xilinx

XC5VLX330T-1FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

960

960

25920

0.9 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VLX330T-2FFG1738C by Xilinx

XC5VLX330T-2FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

960

960

25920

0.77 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VLX50-1FF1153C by Xilinx

XC5VLX50-1FF1153C

Xilinx

Xilinx XC5VLX50-1FF1153C FPGA features 46080 logic cells, 3600 CLBs, and 560 inputs/outputs. With a max supply voltage of 1.05V, it is ideal for applications requiring high-speed processing in industrial automation and telecommunications sectors. The package style is a grid array with a square shape and ball terminals for surface mount assembly.

FPGA

46080

560

560

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Lead

1 mm

1153

S-PBGA-B1153

e0

No

XC5VLX50-1FF324C by Xilinx

XC5VLX50-1FF324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

220

220

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Lead

1 mm

324

S-PBGA-B324

e0

No

XC5VLX50-1FF676C by Xilinx

XC5VLX50-1FF676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

440

440

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX50-1FFG1153C by Xilinx

XC5VLX50-1FFG1153C

Xilinx

The Xilinx XC5VLX50-1FFG1153C is a FPGA with 46080 logic cells, 3600 CLBs, and 560 inputs/outputs. Operating at 1.05V, it offers 0.9ns combinatorial delay per CLB. Ideal for applications requiring high-speed processing in compact form factors like telecommunications and industrial automation.

FPGA

46080

560

560

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1153

S-PBGA-B1153

e1

No

XC5VLX50-1FFG324C by Xilinx

XC5VLX50-1FFG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

220

220

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

XC5VLX50-1FFG676C by Xilinx

XC5VLX50-1FFG676C

Xilinx

The Xilinx XC5VLX50-1FFG676C is a FPGA with 46080 logic cells, 3600 CLBs, and 440 inputs/outputs. It operates at 1.05V with a max combinatorial delay of 0.9ns. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial control systems.

FPGA

46080

440

440

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX50-2FFG1153C by Xilinx

XC5VLX50-2FFG1153C

Xilinx

XC5VLX50-2FFG1153C by Xilinx is a FPGA with 46080 logic cells, 3600 CLBs, and 560 inputs/outputs. Operating at 1.05V, it has a max combinatorial delay of 0.77ns. Ideal for applications requiring high-speed processing and customization in electronics design.

FPGA

46080

560

560

3600

0.77 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1153

S-PBGA-B1153

e1

No

XC5VLX50-2FFG676C by Xilinx

XC5VLX50-2FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

440

440

3600

0.77 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX50T-1FF1136C by Xilinx

XC5VLX50T-1FF1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

480

480

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

10.5 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VLX50T-1FF665C by Xilinx

XC5VLX50T-1FF665C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

360

360

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

10.5 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Lead

1 mm

665

S-PBGA-B665

e0

No