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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2S50-5PQ208C by Xilinx

XC2S50-5PQ208C

Xilinx

The Xilinx XC2S50-5PQ208C is a FPGA with 1728 logic cells, 384 CLBs, and 144 inputs. It operates at max frequency of 263 MHz and has 50000 equivalent gates. Ideal for applications requiring high-speed processing and programmable logic capabilities in electronic systems.

FPGA

1728

144

140

384

50000

263 MHz

0.7 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

Maximum usable gates 50000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XC2S50-5TQ144C by Xilinx

XC2S50-5TQ144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

1728

96

92

384

50000

263 MHz

0.7 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

Maximum usable gates 50000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC2S50-6FG256C by Xilinx

XC2S50-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

180

176

384

50000

263 MHz

0.6 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

Maximum usable gates 50000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S50-6PQ208C by Xilinx

XC2S50-6PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

1728

144

140

384

50000

263 MHz

0.6 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

Maximum usable gates 50000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XC2S50-6TQ144C by Xilinx

XC2S50-6TQ144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

1728

96

92

384

50000

263 MHz

0.6 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

Maximum usable gates 50000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC2S200-5FG256C by Xilinx

XC2S200-5FG256C

Xilinx

XC2S200-5FG256C by Xilinx is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 gates. It operates at max frequency of 263 MHz and has 180 inputs/176 outputs. Ideal for applications requiring high-speed processing in electronics design.

FPGA

5292

180

176

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S200-5FG456C by Xilinx

XC2S200-5FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

288

284

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC2S200-5PQ208C by Xilinx

XC2S200-5PQ208C

Xilinx

The Xilinx XC2S200-5PQ208C is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. It operates at a max frequency of 263 MHz and has 144 inputs and 140 outputs. Ideal for applications requiring high-speed processing in compact designs.

FPGA

5292

144

140

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XC2S200-6FG256C by Xilinx

XC2S200-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

180

176

1176

200000

263 MHz

0.6 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S200-6FG456C by Xilinx

XC2S200-6FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

288

284

1176

200000

263 MHz

0.6 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC2S200-6PQ208C by Xilinx

XC2S200-6PQ208C

Xilinx

The Xilinx XC2S200-6PQ208C is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. It operates at a max frequency of 263 MHz and has 144 inputs and 140 outputs. Ideal for applications requiring high-speed processing in telecommunications, automotive, and industrial sectors.

FPGA

5292

144

140

1176

200000

263 MHz

0.6 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XCS10XL-4CS144C by Xilinx

XCS10XL-4CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

MAXIMUM usable gates 10000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS10XL-5CS144C by Xilinx

XCS10XL-5CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

196

112

112

196

3000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

196 CLBS, 3000 Gates

MAXIMUM usable gates 10000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS20XL-4CS144C by Xilinx

XCS20XL-4CS144C

Xilinx

Xilinx XCS20XL-4CS144C FPGA features 400 logic cells, 7000 gates, and a max clock frequency of 217 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and medical devices.

FPGA

400

160

160

400

7000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Maximum usable gates 20000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS20XL-5CS144C by Xilinx

XCS20XL-5CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Maximum usable gates 20000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XCS30XL-4CS280C by Xilinx

XCS30XL-4CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCS30XL-5CS280C by Xilinx

XCS30XL-5CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

576

192

192

576

10000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCS40XL-4CS280C by Xilinx

XCS40XL-4CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCS40XL-5CS280C by Xilinx

XCS40XL-5CS280C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

784

224

224

784

13000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

16 mm

16 mm

1.2 mm

BGA280,19X19,32

Bottom

Ball

Tin Lead

.8 mm

280

S-PBGA-B280

e0

No

XCV100E-6BG352C by Xilinx

XCV100E-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

2700

196

196

600

32400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV100E-7BG352C by Xilinx

XCV100E-7BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

2700

196

196

600

32400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200E-6BG352C by Xilinx

XCV200E-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

63504

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200E-7BG352C by Xilinx

XCV200E-7BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

63504

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV200E-8BG352C by Xilinx

XCV200E-8BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

5292

260

260

1176

63504

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV300E-6BG352C by Xilinx

XCV300E-6BG352C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;

FPGA

6912

260

260

1536

82944

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 82944 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XCV3200E-6CG1156C by Xilinx

XCV3200E-6CG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

73008

804

804

16224

876096

357.2 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

16224 CLBS, 876096 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.11 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-CBGA-B1156

e0

No

XCV3200E-7CG1156C by Xilinx

XCV3200E-7CG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

73008

804

804

16224

876096

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

16224 CLBS, 876096 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.11 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-CBGA-B1156

e0

No

LCMXO3L-2100C-5BG324C by Lattice Semiconductor

LCMXO3L-2100C-5BG324C

Lattice Semiconductor

LCMXO3L-2100C-5BG324C by Lattice Semiconductor is a 264 CLB FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid array packages in electronics industry.

FPGA

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3L-2100E-5UWG49CTR1K by Lattice Semiconductor

LCMXO3L-2100E-5UWG49CTR1K

Lattice Semiconductor

LCMXO3L-2100E-5UWG49CTR1K by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 264 CLBs, 0.4mm terminal pitch, and 1.26V max supply voltage. Ideal for applications requiring high-density programmable logic in compact form factors at temperatures ranging from 0 to 85°C.

FPGA

264

264 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.185 mm

3.106 mm

.6 mm

Bottom

Ball

Tin Silver Copper

.4 mm

49

R-PBGA-B49

e1

LCMXO3L-2100E-5UWG49CTR50 by Lattice Semiconductor

LCMXO3L-2100E-5UWG49CTR50

Lattice Semiconductor

LCMXO3L-2100E-5UWG49CTR50 by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 264 CLBs. It operates at a voltage range of 1.14V to 1.26V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring high flexibility and programmability in electronic systems.

FPGA

264

264 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.185 mm

3.106 mm

.6 mm

Bottom

Ball

Tin Silver Copper

.4 mm

49

R-PBGA-B49

e1

LCMXO3L-4300E-5UWG81CTR1K by Lattice Semiconductor

LCMXO3L-4300E-5UWG81CTR1K

Lattice Semiconductor

LCMXO3L-4300E-5UWG81CTR1K by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 540 CLBs, 0.4mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring high-density programmable logic in compact form factors.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.797 mm

3.693 mm

.567 mm

Bottom

Ball

Tin Silver Copper

.4 mm

81

R-PBGA-B81

e1

LCMXO3L-4300E-5UWG81CTR50 by Lattice Semiconductor

LCMXO3L-4300E-5UWG81CTR50

Lattice Semiconductor

LCMXO3L-4300E-5UWG81CTR50 by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 540 CLBs, 0.4mm terminal pitch, and 1.2V nominal voltage. Ideal for applications requiring high-density programmable logic solutions in compact form factors with operating temperatures ranging from 0 to 85°C.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.797 mm

3.693 mm

.567 mm

Bottom

Ball

Tin Silver Copper

.4 mm

81

R-PBGA-B81

e1

LCMXO3L-4300E-5UWG81CTR by Lattice Semiconductor

LCMXO3L-4300E-5UWG81CTR

Lattice Semiconductor

LCMXO3L-4300E-5UWG81CTR by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 1.26V, suitable for applications requiring high performance in compact form factors. Featuring a grid array package style, 0.4mm terminal pitch, and operating temperature range of 0-85°C, it is ideal for space-constrained designs needing efficient programmable ICs.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

3.797 mm

3.693 mm

.567 mm

Bottom

Ball

Tin Silver Copper

.4 mm

81

R-PBGA-B81

e1

XCV400E-6BG560C by Xilinx

XCV400E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV400E-7BG560C by Xilinx

XCV400E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-6BG560C by Xilinx

XCV600E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

404

404

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-7BG560C by Xilinx

XCV600E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

404

404

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XC3S500E-4VQG100C by Xilinx

XC3S500E-4VQG100C

Xilinx

The Xilinx XC3S500E-4VQG100C is a FPGA with 10476 logic cells, 1164 CLBs, and 500000 equivalent gates. It operates at a max frequency of 572 MHz and has a combinatorial delay of 0.76 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in electronics design.

FPGA

10476

66

59

1164

500000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

LCMXO2280C-3FTN324C by Lattice Semiconductor

LCMXO2280C-3FTN324C

Lattice Semiconductor

LCMXO2280C-3FTN324C by Lattice Semiconductor is a FPGA with 2280 logic cells, 285 CLBs, and 271 inputs/outputs. It operates at 1.8V nominal voltage and supports a max of 3.465V. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

2280

271

271

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

19 mm

19 mm

1.7 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

LCMXO2280C-5FTN324C by Lattice Semiconductor

LCMXO2280C-5FTN324C

Lattice Semiconductor

LCMXO2280C-5FTN324C by Lattice Semiconductor is a FPGA with 2280 logic cells, 285 CLBs, and 271 inputs/outputs. It operates at a max voltage of 3.465V and nominal voltage of 1.8V. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

2280

271

271

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

19 mm

19 mm

1.7 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

LFE2-12E-5FN256C by Lattice Semiconductor

LFE2-12E-5FN256C

Lattice Semiconductor

Lattice Semiconductor's LFE2-12E-5FN256C FPGA offers 12000 logic cells, 1500 CLBs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with surface mount capability.

FPGA

12000

193

193

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-12E-5FN484C by Lattice Semiconductor

LFE2-12E-5FN484C

Lattice Semiconductor

Lattice Semiconductor's LFE2-12E-5FN484C FPGA features 12000 logic cells, 1500 CLBs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with ball terminals.

FPGA

12000

297

297

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFE2-12E-5QN208C by Lattice Semiconductor

LFE2-12E-5QN208C

Lattice Semiconductor

Lattice Semiconductor's LFE2-12E-5QN208C FPGA features 12000 logic cells, 1500 CLBs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor with a square package shape.

FPGA

12000

131

131

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

208

S-PQFP-G208

e3

No

LFE2-12E-5TN144C by Lattice Semiconductor

LFE2-12E-5TN144C

Lattice Semiconductor

LFE2-12E-5TN144C by Lattice Semiconductor is a 12000 logic cell FPGA with 1500 CLBs and 93 inputs/outputs. Operating at 1.2V, it offers a max clock frequency of 311MHz, making it ideal for high-speed applications in electronics and telecommunications. With a low profile package style and fine pitch terminals, this FPGA is suitable for compact designs requiring fast processing capabilities.

FPGA

12000

93

93

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

LFE2-12E-6F484C by Lattice Semiconductor

LFE2-12E-6F484C

Lattice Semiconductor

LFE2-12E-6F484C by Lattice Semiconductor is a 12000 logic cell FPGA with a max clock frequency of 357 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities.

FPGA

12000

297

297

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

LFE2-12E-6FN256C by Lattice Semiconductor

LFE2-12E-6FN256C

Lattice Semiconductor

Lattice Semiconductor's LFE2-12E-6FN256C FPGA offers 12000 logic cells, 1500 CLBs, and a max clock frequency of 357 MHz. Ideal for applications requiring high-speed processing and complex logic functions in a compact form factor.

FPGA

12000

193

193

1500

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-12E-6QN208C by Lattice Semiconductor

LFE2-12E-6QN208C

Lattice Semiconductor

LFE2-12E-6QN208C by Lattice Semiconductor is a 12000 logic cell FPGA with a max clock frequency of 357 MHz. It has 131 inputs and outputs, and can operate in temperatures ranging from 0 to 85 °C. This FPGA is commonly used in applications requiring high-speed data processing and programmable logic control.

FPGA

12000

131

131

1500

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

208

S-PQFP-G208

e3

No

LFE2-12E-7FN256C by Lattice Semiconductor

LFE2-12E-7FN256C

Lattice Semiconductor

LFE2-12E-7FN256C by Lattice Semiconductor is a 12000 logic cell FPGA with a max clock frequency of 420 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities.

FPGA

12000

193

193

1500

420 MHz

0.304 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No