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XC2S200-5FG256C

Xilinx

XC2S200-5FG256C by Xilinx

XC2S200-5FG256C by Xilinx is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 gates. It operates at max frequency of 263 MHz and has 180 inputs/176 outputs. Ideal for applications requiring high-speed processing in electronics design.

Median Price

$125.440

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Mouser Electronics

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Modulus Dynamics

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MARBEL Systems

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Texas Native Microelectronics

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Overview

Unlock the power of cutting-edge technology with the Xilinx XC2S200-5FG256C Field Programmable Gate Array. Manufactured by industry leader Xilinx, this FPGA boasts 5292 logic cells and 1176 CLBs, offering a versatile solution for a wide range of applications. With a maximum clock frequency of 263 MHz and 200000 equivalent gates, this FPGA delivers high performance and reliability. Whether you're designing telecommunications systems, industrial automation, or consumer electronics, the XC2S200-5FG256C provides the flexibility and scalability you need to bring your projects to life. Experience the value and benefits of Xilinx's superior quality and innovation today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, ideal for various applications.

No. of Logic Cells: 5292

With a high number of logic cells, this FPGA can handle complex logic functions efficiently, making it suitable for advanced digital designs.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 2.625 V

The maximum supply voltage of 2.625V ensures compatibility with a wide range of power sources, increasing versatility.

No. of CLBs: 1176

The high number of Configurable Logic Blocks (CLBs) provides flexibility in designing and implementing custom logic functions.

No. of Inputs: 180

Having 180 inputs allows for a wide range of input signals to be processed, enhancing the applicability of the FPGA.

Package Shape: SQUARE

The square package shape simplifies the layout and design of the PCB, optimizing space utilization in designs.

Form Of Terminal: BALL

The use of ball terminals enables easy soldering and reliable connections, ensuring stable performance in various environments.

No. of Equivalent Gates: 200000

With a high number of equivalent gates, this FPGA can handle large-scale logic operations effectively, suitable for demanding applications.

Nominal Supply Voltage (V): 2.5

The nominal supply voltage of 2.5V provides a standard operating voltage for the FPGA, ensuring compatibility with common power sources.

Power Supplies (V): 1.5/3.3,2.5

Support for multiple power supply voltages gives flexibility in powering the FPGA, allowing for compatibility with various system configurations.

No. of Terminals: 256

Having 256 terminals enables connectivity to external components and devices, expanding the functionality of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array allows for customization and reconfiguration of logic functions, making it versatile for different applications.

Package Style (Meter): GRID ARRAY

The grid array package style simplifies the assembly process and ensures secure mounting on PCBs, enhancing reliability.

Minimum Supply Voltage: 2.375 V

The minimum supply voltage of 2.375V ensures stable operation at lower power levels, ideal for energy-efficient designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can withstand high-temperature environments, expanding its range of applications.

Pitch Of Terminal: 1 mm

Having a terminal pitch of 1mm simplifies the PCB layout and assembly process, reducing the chances of errors during installation.

Maximum Combinatorial Delay of a CLB: 0.7 ns

The low maximum combinatorial delay of 0.7ns ensures fast logic processing, making the FPGA suitable for time-critical applications.

Organization: 1176 CLBS, 200000 GATES

The organized structure of 1176 CLBs and 200,000 gates provides a systematic layout for designing complex logic functions efficiently.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C allows the FPGA to function in cold environments, increasing its usability in various conditions.

Finishing Of Terminal Used: TIN LEAD

The use of tin lead for terminal finishing enhances solderability and ensures reliable connections, improving the overall performance of the FPGA.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easy PCB mounting and integration, streamlining the assembly process.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA is less susceptible to moisture damage during storage and manufacturing, increasing its reliability.

Maximum Seated Height: 2 mm

The maximum seated height of 2mm allows for a compact design, making the FPGA suitable for space-constrained applications.

Width: 17 mm

Having a width of 17mm ensures compatibility with standard PCB dimensions, facilitating easy integration into existing designs.

Maximum Clock Frequency: 263 MHz

The high maximum clock frequency of 263MHz enables fast data processing and logic operations, making the FPGA suitable for high-speed applications.

No. of Outputs: 176

Having 176 outputs allows for a wide range of output signals to be generated, enhancing the functionality and versatility of the FPGA.

Maximum Time At Peak Reflow Temperature (s): 30

Remaining at the peak reflow temperature for 30 seconds ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 225

The peak reflow temperature of 225°C ensures secure solder joints and reliable connections, enhancing the durability of the FPGA.

Length: 17 mm

Having a length of 17mm ensures compatibility with standard PCB dimensions, simplifying the integration process in various designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC2S200-5FG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

5292

No. of Inputs:

180

No. of Outputs:

176

No. of CLBs:

1176

No. of Equivalent Gates:

200000

Maximum Clock Frequency:

263 MHz

CLB Maximum Delay:

0.7 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

1176 CLBS, 200000 Gates

Additional Features:

Maximum usable gates 200000

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies:

1.5/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC2S200-5FG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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