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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC3S5000-5FG676C by Xilinx

XC3S5000-5FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

74880

489

489

8320

5000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

8320 CLBS, 5000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S5000-5FGG676C by Xilinx

XC3S5000-5FGG676C

Xilinx

Xilinx XC3S5000-5FGG676C FPGA features 74880 logic cells, 8320 CLBs, and 5000000 equivalent gates. With a max clock frequency of 725 MHz, it is ideal for high-performance applications requiring advanced programmable ICs in a grid array package style.

FPGA

74880

489

489

8320

5000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

8320 CLBS, 5000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

LFE2M100E-5FN900C by Lattice Semiconductor

LFE2M100E-5FN900C

Lattice Semiconductor

Lattice Semiconductor's LFE2M100E-5FN900C FPGA features 100000 logic cells, 416 inputs/outputs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

100000

416

416

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

LFE2M100E-6FN1152C by Lattice Semiconductor

LFE2M100E-6FN1152C

Lattice Semiconductor

LFE2M100E-6FN1152C by Lattice Semiconductor is a 100000 logic cell FPGA with 520 inputs/outputs, operating at 357 MHz. It has a max supply voltage of 1.26V and is suitable for applications requiring high-speed processing in industrial automation and telecommunications due to its low combinatorial delay and high clock frequency capabilities.

FPGA

100000

520

520

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1152,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1152

S-PBGA-B1152

e1

No

LFE2M20E-5FN256C by Lattice Semiconductor

LFE2M20E-5FN256C

Lattice Semiconductor

Lattice Semiconductor's LFE2M20E-5FN256C FPGA features 20000 logic cells, 2375 CLBs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact square grid array package with surface mount capability.

FPGA

20000

140

140

2375

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2M20E-6FN484C by Lattice Semiconductor

LFE2M20E-6FN484C

Lattice Semiconductor

Lattice Semiconductor's LFE2M20E-6FN484C FPGA offers 20000 logic cells, 2375 CLBs, and a max clock frequency of 357 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

20000

304

304

2375

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFE2M20SE-5FN256C by Lattice Semiconductor

LFE2M20SE-5FN256C

Lattice Semiconductor

LFE2M20SE-5FN256C by Lattice Semiconductor is a 20000 Logic Cells FPGA with 2375 CLBs, 140 Inputs/Outputs, and max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing in compact designs due to its small form factor and low power consumption.

FPGA

20000

140

140

2375

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2M20SE-7FN256C by Lattice Semiconductor

LFE2M20SE-7FN256C

Lattice Semiconductor

LFE2M20SE-7FN256C by Lattice Semiconductor is a 20000 Logic Cells FPGA with 2375 CLBs, 140 Inputs/Outputs, and 420 MHz Clock Frequency. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial automation systems.

FPGA

20000

140

140

2375

420 MHz

0.304 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2M35E-5FN256C by Lattice Semiconductor

LFE2M35E-5FN256C

Lattice Semiconductor

LFE2M35E-5FN256C by Lattice Semiconductor is a 35000 Logic Cells FPGA with 4250 CLBs and 140 Inputs/Outputs. Operating at 1.2V, it offers a max clock frequency of 311MHz. Ideal for applications requiring high-speed processing in compact designs.

FPGA

35000

140

140

4250

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2M35E-5FN672C by Lattice Semiconductor

LFE2M35E-5FN672C

Lattice Semiconductor

LFE2M35E-5FN672C by Lattice Semiconductor is a 35000 logic cell FPGA with 4250 CLBs and 410 inputs/outputs. Operating at 1.2V, it offers a max clock frequency of 311MHz. Ideal for applications requiring high-speed processing in compact designs.

FPGA

35000

410

410

4250

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA672,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

672

S-PBGA-B672

e1

No

LFE2M35E-6FN256C by Lattice Semiconductor

LFE2M35E-6FN256C

Lattice Semiconductor

LFE2M35E-6FN256C by Lattice Semiconductor is a 35000 Logic Cells FPGA with 4250 CLBs, 140 Inputs/Outputs, and 357 MHz Clock Frequency. Ideal for applications requiring high-speed processing in compact designs due to its small form factor and low power consumption.

FPGA

35000

140

140

4250

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2M35E-7FN484C by Lattice Semiconductor

LFE2M35E-7FN484C

Lattice Semiconductor

LFE2M35E-7FN484C by Lattice Semiconductor is a 35000 Logic Cells FPGA with 4250 CLBs, 303 Inputs/Outputs, and 420 MHz Clock Frequency. Ideal for applications requiring high-speed processing in compact designs due to its low power consumption and small form factor.

FPGA

35000

303

303

4250

420 MHz

0.304 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFE2M50E-6FN484C by Lattice Semiconductor

LFE2M50E-6FN484C

Lattice Semiconductor

LFE2M50E-6FN484C by Lattice Semiconductor is a 50000 Logic Cells FPGA with 6000 CLBs, 270 Inputs/Outputs, and max clock frequency of 357 MHz. Ideal for applications requiring high-speed processing in compact designs due to its low power consumption and small form factor.

FPGA

50000

270

270

6000

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFE2M70E-6FN900C by Lattice Semiconductor

LFE2M70E-6FN900C

Lattice Semiconductor

LFE2M70E-6FN900C by Lattice Semiconductor is a 70000 logic cell FPGA with 8375 CLBs and 416 inputs/outputs. Operating at max clock frequency of 357 MHz, it's ideal for high-speed applications requiring low power consumption. With a package style of grid array and moisture sensitivity level of 3, it suits various industrial needs.

FPGA

70000

416

416

8375

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

LFXP2-17E-5FN484C by Lattice Semiconductor

LFXP2-17E-5FN484C

Lattice Semiconductor

LFXP2-17E-5FN484C by Lattice Semiconductor is a 17000 logic cell FPGA with 2125 CLBs, 358 inputs/outputs, and max clock freq of 435 MHz. It operates at 1.2V, has a combinatorial delay of 0.494 ns, and uses CMOS tech. Ideal for applications requiring high-speed processing in compact designs.

FPGA

17000

358

358

2125

435 MHz

0.494 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFXP2-17E-5QN208C by Lattice Semiconductor

LFXP2-17E-5QN208C

Lattice Semiconductor

LFXP2-17E-5QN208C by Lattice Semiconductor is a 17000 logic cell FPGA with 2125 CLBs, operating at max 435 MHz. It has 146 inputs/outputs, uses CMOS tech, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like IoT devices and communication systems.

FPGA

17000

146

146

2125

435 MHz

0.494 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

208

S-PQFP-G208

e3

No

LFXP2-17E-6FT256C by Lattice Semiconductor

LFXP2-17E-6FT256C

Lattice Semiconductor

LFXP2-17E-6FT256C by Lattice Semiconductor is a 17000 logic cell FPGA with max clock freq of 435MHz. Operating at 1.2V, it has 201 inputs/outputs and combinatorial delay of 0.399ns. Ideal for applications requiring high-speed processing in compact designs like IoT devices and communication systems.

FPGA

17000

201

201

435 MHz

0.399 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

LFXP2-17E-6FTN256C by Lattice Semiconductor

LFXP2-17E-6FTN256C

Lattice Semiconductor

LFXP2-17E-6FTN256C by Lattice Semiconductor is a 17000 logic cell FPGA with 2125 CLBs, operating at max 435 MHz clock frequency. It features CMOS technology, 201 inputs/outputs, and a max supply voltage of 1.26V. Ideal for applications requiring high-speed processing in compact designs.

FPGA

17000

201

201

2125

435 MHz

0.399 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFXP2-17E-6QN208C by Lattice Semiconductor

LFXP2-17E-6QN208C

Lattice Semiconductor

LFXP2-17E-6QN208C by Lattice Semiconductor is a 17000 logic cell FPGA with 2125 CLBs, operating at max 435 MHz. It features a supply voltage of 1.26V and offers 146 inputs/outputs for various applications in electronics design requiring high-speed processing and programmable ICs.

FPGA

17000

146

146

2125

435 MHz

0.399 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

208

S-PQFP-G208

e3

No

LFXP2-17E-7FN484C by Lattice Semiconductor

LFXP2-17E-7FN484C

Lattice Semiconductor

LFXP2-17E-7FN484C by Lattice Semiconductor is a 17000 Logic Cell FPGA with 2125 CLBs, operating at max 435 MHz clock frequency. It uses CMOS technology, has 358 inputs/outputs, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like IoT devices and communication systems.

FPGA

17000

358

358

2125

435 MHz

0.304 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFXP2-17E-7FTN256C by Lattice Semiconductor

LFXP2-17E-7FTN256C

Lattice Semiconductor

LFXP2-17E-7FTN256C by Lattice Semiconductor is a 17000 logic cell FPGA with 2125 CLBs, operating at max 435 MHz clock frequency. Utilized in applications requiring high-speed processing and programmable ICs, it features a max supply voltage of 1.26 V and CMOS technology for efficient performance.

FPGA

17000

201

201

2125

435 MHz

0.304 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S1400A-4FG484C by Xilinx

XC3S1400A-4FG484C

Xilinx

Xilinx XC3S1400A-4FG484C is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 gates. It operates at max frequency of 667 MHz and has 375 inputs and 288 outputs. Ideal for applications requiring high-speed processing like telecommunications and signal processing due to its advanced CMOS technology.

FPGA

25344

375

288

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S1400A-4FG676C by Xilinx

XC3S1400A-4FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

25344

502

408

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S1400A-4FGG484C by Xilinx

XC3S1400A-4FGG484C

Xilinx

The Xilinx XC3S1400A-4FGG484C is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 equivalent gates. It operates at a max frequency of 667 MHz and has 375 inputs and 288 outputs. Ideal for applications requiring high-speed processing in fields like telecommunications and industrial automation.

FPGA

25344

375

288

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S1400A-4FGG676C by Xilinx

XC3S1400A-4FGG676C

Xilinx

Xilinx XC3S1400A-4FGG676C is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 gates. It operates at max frequency of 667 MHz and has 502 inputs and 408 outputs. Ideal for high-performance applications requiring fast processing speeds in telecommunications, networking, or industrial automation.

FPGA

25344

502

408

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S1400A-5FGG484C by Xilinx

XC3S1400A-5FGG484C

Xilinx

Xilinx XC3S1400A-5FGG484C FPGA features 25344 logic cells, 2816 CLBs, and 1400000 gates. Operating at a max frequency of 770 MHz, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a package style of grid array and surface mount compatibility, it offers versatile integration options.

FPGA

25344

375

288

2816

1400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S1400A-5FGG676C by Xilinx

XC3S1400A-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

25344

502

408

2816

1400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S200A-4FGG320C by Xilinx

XC3S200A-4FGG320C

Xilinx

XC3S200A-4FGG320C by Xilinx is a FPGA with 4032 logic cells, 448 CLBs, and 200000 equivalent gates. Operating at max frequency of 667 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a package style of grid array and dimensions of 19mm x 19mm, it offers versatile integration options in compact designs.

FPGA

4032

248

192

448

200000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

320

S-PBGA-B320

e1

No

XC3S200A-4FT256C by Xilinx

XC3S200A-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S200A-5FGG320C by Xilinx

XC3S200A-5FGG320C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE;

FPGA

4032

248

192

448

200000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

320

S-PBGA-B320

e1

No

XC3S200A-5FTG256C by Xilinx

XC3S200A-5FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S400A-4FG400C by Xilinx

XC3S400A-4FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S400A-4FGG400C by Xilinx

XC3S400A-4FGG400C

Xilinx

Xilinx XC3S400A-4FGG400C FPGA features 8064 logic cells, 896 CLBs, and 400000 equivalent gates. With a max clock frequency of 667 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. The package style is grid array with a square shape and plastic/epoxy material.

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S400A-4FT256C by Xilinx

XC3S400A-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

195

160

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S400A-5FGG320C by Xilinx

XC3S400A-5FGG320C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

251

192

896

400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

320

S-PBGA-B320

e1

No

XC3S400A-5FGG400C by Xilinx

XC3S400A-5FGG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S400A-5FTG256C by Xilinx

XC3S400A-5FTG256C

Xilinx

Xilinx XC3S400A-5FTG256C FPGA features 8064 logic cells, 896 CLBs, and 400000 gates. With a max clock frequency of 770 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

8064

195

160

896

400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S50A-4FT256C by Xilinx

XC3S50A-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1584

144

112

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S50A-4TQ144C by Xilinx

XC3S50A-4TQ144C

Xilinx

The Xilinx XC3S50A-4TQ144C is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at a max frequency of 667 MHz and has 108 inputs and 101 outputs. Ideal for applications requiring high-speed processing in compact designs.

FPGA

1584

108

101

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC3S50A-5FTG256C by Xilinx

XC3S50A-5FTG256C

Xilinx

The Xilinx XC3S50A-5FTG256C is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at a max clock frequency of 770 MHz and has a max operating temperature of 85°C. This FPGA is commonly used in applications requiring high-speed processing and programmable logic capabilities.

FPGA

1584

144

112

176

50000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S50A-5TQG144C by Xilinx

XC3S50A-5TQG144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

1584

108

101

176

50000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC3S700A-4FG400C by Xilinx

XC3S700A-4FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

311

248

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S700A-4FG484C by Xilinx

XC3S700A-4FG484C

Xilinx

The Xilinx XC3S700A-4FG484C is a FPGA with 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. It operates at a max frequency of 667 MHz and has 372 inputs and 288 outputs. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S700A-4FGG484C by Xilinx

XC3S700A-4FGG484C

Xilinx

Xilinx XC3S700A-4FGG484C FPGA features 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. With a max clock frequency of 667 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S700A-5FGG400C by Xilinx

XC3S700A-5FGG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

311

248

1472

700000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S700A-5FGG484C by Xilinx

XC3S700A-5FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VSX315T-3FFG1156C by Xilinx

XC6VSX315T-3FFG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

600

600

1412 MHz

CMOS

Field Programmable Gate Arrays

1

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B

e1

No

XC6VSX315T-3FFG1759C by Xilinx

XC6VSX315T-3FFG1759C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

720

720

1412 MHz

CMOS

Field Programmable Gate Arrays

1

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1759

S-PBGA-B

e1

No