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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC3SD1800A-4CSG484C by Xilinx

XC3SD1800A-4CSG484C

Xilinx

The Xilinx XC3SD1800A-4CSG484C FPGA features 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. It operates at a max clock frequency of 250 MHz and is suitable for applications requiring high-speed processing and programmable ICs in commercial extended temperature environments.

FPGA

37440

309

249

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD1800A-4FGG676C by Xilinx

XC3SD1800A-4FGG676C

Xilinx

Xilinx XC3SD1800A-4FGG676C is a FPGA with 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. It operates at max frequency of 250 MHz and supports up to 519 inputs and 409 outputs. Ideal for applications requiring high-speed processing in commercial extended temperature environments.

FPGA

37440

519

409

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3SD1800A-5CSG484C by Xilinx

XC3SD1800A-5CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

37440

309

249

4160

1800000

280 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD1800A-5FGG676C by Xilinx

XC3SD1800A-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

37440

519

409

4160

1800000

280 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3SD3400A-4CS484C by Xilinx

XC3SD3400A-4CS484C

Xilinx

Xilinx XC3SD3400A-4CS484C FPGA features 53712 logic cells, 5968 CLBs, and 3400000 gates. Operating at a max frequency of 250 MHz, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a package style of grid array and dimensions of 19mm x 19mm, this device is suitable for surface mount designs in commercial extended temperature environments.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Lead

.8 mm

484

S-PBGA-B484

e0

No

XC3SD3400A-4CSG484C by Xilinx

XC3SD3400A-4CSG484C

Xilinx

XC3SD3400A-4CSG484C by Xilinx is a FPGA with 53712 logic cells, 5968 CLBs, and 3400000 gates. It operates at max frequency of 250 MHz and supports up to 309 inputs and 249 outputs. Ideal for applications requiring high-speed processing such as telecommunications and industrial automation.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD3400A-4FG676C by Xilinx

XC3SD3400A-4FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

53712

469

409

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3SD3400A-4FGG676C by Xilinx

XC3SD3400A-4FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

53712

469

409

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3SD3400A-5CSG484C by Xilinx

XC3SD3400A-5CSG484C

Xilinx

XC3SD3400A-5CSG484C by Xilinx is a Field Programmable Gate Array (FPGA) with 53,712 logic cells and 3,400,000 equivalent gates. It operates at a max clock frequency of 280 MHz and is commonly used in applications requiring high-speed data processing and programmable logic control.

FPGA

53712

309

249

5968

3400000

280 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD3400A-5FGG676C by Xilinx

XC3SD3400A-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

53712

469

409

5968

3400000

280 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VSX95T-3FF1136C by Xilinx

XC5VSX95T-3FF1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

94208

640

640

7360

550 MHz

CMOS

Field Programmable Gate Arrays

7360 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VSX95T-3FFG1136C by Xilinx

XC5VSX95T-3FFG1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

94208

640

640

7360

1205 MHz

CMOS

Field Programmable Gate Arrays

7360 CLBS

1

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC2S100E-6FT256C by Xilinx

XC2S100E-6FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

202

202

600

37000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 37000 Gates

Maximum usable gates = 100000

1.8

1.71 V

1.89 V

1.5/3.3,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2S100E-6PQ208C by Xilinx

XC2S100E-6PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

2700

202

202

600

37000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 37000 Gates

Maximum usable gates = 100000

1.8

1.71 V

1.89 V

1.5/3.3,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

208

S-PQFP-G208

e0

No

XC2S100E-6TQ144C by Xilinx

XC2S100E-6TQ144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

2700

202

202

600

37000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 37000 Gates

Maximum usable gates = 100000

1.8

1.71 V

1.89 V

1.5/3.3,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

144

S-PQFP-G144

e0

No

XC2S200E-6FG456C by Xilinx

XC2S200E-6FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

289

289

864

52000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 52000 Gates

Maximum usable gates = 150000

1.8

1.71 V

1.89 V

1.5/3.3,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2S200E-6PQ208C by Xilinx

XC2S200E-6PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

5292

289

289

864

52000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 52000 Gates

Maximum usable gates = 150000

1.8

1.71 V

1.89 V

1.5/3.3,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

208

S-PQFP-G208

e0

No

XC2S300E-6PQ208C by Xilinx

XC2S300E-6PQ208C

Xilinx

Xilinx XC2S300E-6PQ208C FPGA features 6912 logic cells, 1536 CLBs, and 93000 equivalent gates. Operating at a max frequency of 357 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a package style of flatpack fine pitch and GULL WING terminals, this CMOS technology-based FPGA offers versatile programmability in a compact form factor.

FPGA

6912

329

329

1536

93000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 93000 Gates

Maximum usable gates = 300000

1.8

1.71 V

1.89 V

1.5/3.3,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

208

S-PQFP-G208

e0

No

XC2S50E-6PQ208C by Xilinx

XC2S50E-6PQ208C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

1728

182

182

384

23000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 23000 Gates

Maximum usable gates = 50000

1.8

1.71 V

1.89 V

1.5/3.3,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

208

S-PQFP-G208

e0

No

XC2S50E-6TQ144C by Xilinx

XC2S50E-6TQ144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

1728

182

182

384

23000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 23000 Gates

Maximum usable gates = 50000

1.8

1.71 V

1.89 V

1.5/3.3,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

144

S-PQFP-G144

e0

No

XC2S200E-6FGG456C by Xilinx

XC2S200E-6FGG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

289

289

864

52000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 52000 Gates

Maximum usable gates = 150000

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

456

S-PBGA-B456

e1

No

10M02SCU324C8G by Intel

10M02SCU324C8G

Intel

The Intel 10M02SCU324C8G is a FPGA with 2000 logic cells, 125 CLBs, and 246 inputs/outputs. It operates at supply voltages b/w 2.85V to 3.15V and temperatures from 0°C to 85°C. This versatile chip is ideal for applications requiring programmable ICs in commercial extended temperature environments.

FPGA

2000

246

246

125

125 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M04SCU324C8G by Intel

10M04SCU324C8G

Intel

Intel's 10M04SCU324C8G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a package style of grid array and low profile, it is suitable for commercial extended temperature applications requiring high-performance programmable ICs.

FPGA

4000

246

246

250

250 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M08SAU324C8G by Intel

10M08SAU324C8G

Intel

Intel's 10M08SAU324C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a package style of grid array and low profile, it is ideal for applications requiring high-speed processing in commercial extended temperature environments.

FPGA

8000

250

250

500

500 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M08SCU324C8G by Intel

10M08SCU324C8G

Intel

Intel's 10M08SCU324C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. Ideal for applications requiring high-speed data processing in commercial extended temperature environments.

FPGA

8000

250

250

500

500 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M16SAU324C8G by Intel

10M16SAU324C8G

Intel

Intel's 10M16SAU324C8G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a package style of grid array and low profile, it is ideal for applications requiring high-speed processing in commercial extended temperature environments.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

10M16SCU324C8G by Intel

10M16SCU324C8G

Intel

Intel's 10M16SCU324C8G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-performance computing in commercial extended temperature environments. The package style is grid array with low profile and fine pitch terminals, making it suitable for compact designs.

FPGA

16000

320

320

1000

1000 CLBS

Also Operates at 3.3 V nominal supply

3

2.85 V

3.15 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324