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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7A50T-L2CSG325E by Xilinx

XC7A50T-L2CSG325E

Xilinx

Xilinx XC7A50T-L2CSG325E FPGA features 52160 logic cells, 4075 CLBs, and operates at a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

52160

250

250

4075

1098 MHz

1.51 ns

Field Programmable Gate Arrays

4075 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

No

XC7A50T-L2FGG484E by Xilinx

XC7A50T-L2FGG484E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

52160

250

250

4075

1098 MHz

1.51 ns

CMOS

Field Programmable Gate Arrays

4075 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-1CSG324C by Xilinx

XC7A75T-1CSG324C

Xilinx

The Xilinx XC7A75T-1CSG324C is a FPGA with 75520 logic cells, 5900 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data processing units.

FPGA

75520

300

300

5900

1098 MHz

1.27 ns

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC7A75T-1CSG324I by Xilinx

XC7A75T-1CSG324I

Xilinx

Xilinx XC7A75T-1CSG324I FPGA features 75520 logic cells, 5900 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

75520

300

300

5900

1098 MHz

1.27 ns

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC7A75T-1FGG484C by Xilinx

XC7A75T-1FGG484C

Xilinx

Xilinx XC7A75T-1FGG484C FPGA features 75520 logic cells, 5900 CLBs, and max clock frequency of 1098 MHz. Ideal for high-performance applications requiring fast processing speeds in a compact form factor.

FPGA

75520

285

285

5900

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-1FGG484I by Xilinx

XC7A75T-1FGG484I

Xilinx

Xilinx XC7A75T-1FGG484I FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with a low supply voltage range from 0.95V to 1.05V.

FPGA

75520

285

285

5900

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-1FGG676C by Xilinx

XC7A75T-1FGG676C

Xilinx

The Xilinx XC7A75T-1FGG676C is a FPGA with 75520 logic cells, 5900 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

75520

300

300

5900

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A75T-1FGG676I by Xilinx

XC7A75T-1FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.44 mm;

FPGA

75520

300

300

5900

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A75T-1FTG256C by Xilinx

XC7A75T-1FTG256C

Xilinx

Xilinx XC7A75T-1FTG256C is a FPGA with 75520 logic cells, 5900 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications, networking, and industrial automation due to its low profile grid array package style.

FPGA

75520

300

300

5900

1098 MHz

1.27 ns

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC7A75T-1FTG256I by Xilinx

XC7A75T-1FTG256I

Xilinx

Xilinx XC7A75T-1FTG256I FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption in a compact form factor.

FPGA

75520

300

300

5900

1098 MHz

1.27 ns

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC7A75T-2CSG324C by Xilinx

XC7A75T-2CSG324C

Xilinx

The Xilinx XC7A75T-2CSG324C is a FPGA with 75520 logic cells, 5900 CLBs, and max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data processing units.

FPGA

75520

300

300

5900

1286 MHz

1.05 ns

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

No

XC7A75T-2CSG324I by Xilinx

XC7A75T-2CSG324I

Xilinx

The Xilinx XC7A75T-2CSG324I is a FPGA with 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex designs. With a package style of grid array and low profile, it offers versatile solutions for various electronic systems.

FPGA

75520

300

300

5900

1286 MHz

1.05 ns

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

No

XC7A75T-2FGG484C by Xilinx

XC7A75T-2FGG484C

Xilinx

XC7A75T-2FGG484C by Xilinx is a CMOS-based FPGA with 75520 logic cells and 5900 CLBs. It operates at a max clock frequency of 1286 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.

FPGA

75520

285

285

5900

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-2FGG484I by Xilinx

XC7A75T-2FGG484I

Xilinx

The Xilinx XC7A75T-2FGG484I is a FPGA with 75520 logic cells, 5900 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

75520

285

285

5900

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-2FGG676C by Xilinx

XC7A75T-2FGG676C

Xilinx

Xilinx XC7A75T-2FGG676C FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

75520

300

300

5900

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A75T-2FGG676I by Xilinx

XC7A75T-2FGG676I

Xilinx

XC7A75T-2FGG676I by Xilinx is a CMOS-based FPGA with 75520 logic cells and 5900 CLBs. It operates at a max clock frequency of 1286 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.

FPGA

75520

300

300

5900

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A75T-2FTG256C by Xilinx

XC7A75T-2FTG256C

Xilinx

Xilinx XC7A75T-2FTG256C FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

75520

300

300

5900

1286 MHz

1.05 ns

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC7A75T-2FTG256I by Xilinx

XC7A75T-2FTG256I

Xilinx

Xilinx XC7A75T-2FTG256I FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

75520

300

300

5900

1286 MHz

1.05 ns

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC7A75T-3CSG324E by Xilinx

XC7A75T-3CSG324E

Xilinx

Xilinx XC7A75T-3CSG324E FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1412 MHz. Ideal for high-performance applications requiring fast processing speeds and extensive logic capabilities in a compact form factor.

FPGA

75520

300

300

5900

1412 MHz

0.94 ns

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

No

XC7A75T-3FGG484E by Xilinx

XC7A75T-3FGG484E

Xilinx

Xilinx XC7A75T-3FGG484E FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1412 MHz. Ideal for high-performance applications requiring advanced programmable ICs in a compact grid array package with a low combinatorial delay of 0.94 ns.

FPGA

75520

285

285

5900

1412 MHz

0.94 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-3FGG676E by Xilinx

XC7A75T-3FGG676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Length: 27 mm;

FPGA

75520

300

300

5900

1412 MHz

0.94 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A75T-L2CSG324E by Xilinx

XC7A75T-L2CSG324E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

75520

300

300

5900

1098 MHz

1.51 ns

Field Programmable Gate Arrays

5900 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

No

XC7A75T-L2FGG484E by Xilinx

XC7A75T-L2FGG484E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Additional Features: ALSO OPERATES AT 1V SUPPLY;

FPGA

75520

285

285

5900

1098 MHz

1.51 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-L2FGG676E by Xilinx

XC7A75T-L2FGG676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

75520

300

300

5900

1098 MHz

1.51 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7VH580T-1FLG1155C by Xilinx

XC7VH580T-1FLG1155C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE;

FPGA

45350

0.74 ns

45350 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1155

S-PBGA-B1155

e1

XC7VH580T-2FLG1155C by Xilinx

XC7VH580T-2FLG1155C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE;

FPGA

45350

0.61 ns

45350 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1155

S-PBGA-B1155

e1

XC7VH580T-2FLG1931C by Xilinx

XC7VH580T-2FLG1931C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1931; Package Code: BGA; Package Shape: SQUARE;

FPGA

45350

0.61 ns

45350 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1931

S-PBGA-B1931

e1

XC7VH580T-G2FLG1155E by Xilinx

XC7VH580T-G2FLG1155E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

45350

0.61 ns

45350 CLBS

1

.97 V

1.03 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1155

S-PBGA-B1155

e1

XC7VH870T-2FLG1932C by Xilinx

XC7VH870T-2FLG1932C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE;

FPGA

68450

0.61 ns

68450 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1932

S-PBGA-B1932

e1

XC7VX1140T-L2FLG1928E by Xilinx

XC7VX1140T-L2FLG1928E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1928; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

1139200

480

480

89000

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

89000 CLBS

1

.97 V

1.03 V

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1928

S-PBGA-B1928

e1

No

XC7VX485T-L2FFG1157E by Xilinx

XC7VX485T-L2FFG1157E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

485760

600

600

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX485T-L2FFG1158E by Xilinx

XC7VX485T-L2FFG1158E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Organization: 37950 CLBS;

FPGA

485760

350

350

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX690T-L2FFG1158E by Xilinx

XC7VX690T-L2FFG1158E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

693120

350

350

54150

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX690T-L2FFG1761E by Xilinx

XC7VX690T-L2FFG1761E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1761; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 54150;

FPGA

693120

850

850

54150

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1761

S-PBGA-B1761

e1

No

XC7VX690T-L2FFG1926E by Xilinx

XC7VX690T-L2FFG1926E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1926; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 54150;

FPGA

693120

720

720

54150

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin/Silver/Copper

1 mm

1926

S-PBGA-B1926

e1

No

XC7VX980T-L2FFG1930E by Xilinx

XC7VX980T-L2FFG1930E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1930; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 900;

FPGA

979200

900

900

76500

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

76500 CLBS

1

.97 V

1.03 V

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1930

S-PBGA-B1930

e1

No

LFE5U-25F-8MG285C by Lattice Semiconductor

LFE5U-25F-8MG285C

Lattice Semiconductor

Lattice Semiconductor's LFE5U-25F-8MG285C is a PLASTIC/EPOXY FPGA with 3000 CLBs, 1.155V max supply voltage, and 0.5mm terminal pitch. Ideal for applications requiring low profile, fine pitch GRID ARRAY ICs operating b/w 0-85°C.

FPGA

3000

3000 CLBS

1.1

1.045 V

1.155 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5U-25F-8MG285I by Lattice Semiconductor

LFE5U-25F-8MG285I

Lattice Semiconductor

Lattice Semiconductor's LFE5U-25F-8MG285I FPGA features 3000 CLBs, operates at -40 to 100 °C, with a supply voltage range of 1.045V to 1.155V. Ideal for industrial applications requiring high-performance and low-profile grid array packaging with fine pitch terminals.

FPGA

3000

3000 CLBS

1.1

1.045 V

1.155 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5U-45F-8MG285C by Lattice Semiconductor

LFE5U-45F-8MG285C

Lattice Semiconductor

LFE5U-45F-8MG285C by Lattice Semiconductor is a 44000 logic cell FPGA with 5500 CLBs and 118 inputs/outputs. Operating at 1.045V to 1.155V, it's ideal for applications requiring high-density programmable ICs in a compact grid array package with low profile and fine pitch terminals.

FPGA

44000

118

118

5500

5500 CLBS

1.1

1.045 V

1.155 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

BGA285,18X18,20

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5U-85F-8MG285C by Lattice Semiconductor

LFE5U-85F-8MG285C

Lattice Semiconductor

Lattice Semiconductor's LFE5U-85F-8MG285C FPGA features 10500 CLBs, 1.155V max supply voltage, and 0.5mm terminal pitch. Ideal for applications requiring high performance in a compact form factor, such as telecommunications equipment and industrial automation systems.

FPGA

10500

10500 CLBS

1.1

1.045 V

1.155 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5U-85F-8MG285I by Lattice Semiconductor

LFE5U-85F-8MG285I

Lattice Semiconductor

Lattice Semiconductor's LFE5U-85F-8MG285I FPGA features 10500 CLBs, 1.155V max supply voltage, and 0.5mm terminal pitch. Ideal for industrial applications requiring high performance and low power consumption in a compact form factor.

FPGA

10500

10500 CLBS

1.1

1.045 V

1.155 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5UM-85F-8MG285I by Lattice Semiconductor

LFE5UM-85F-8MG285I

Lattice Semiconductor

LFE5UM-85F-8MG285I by Lattice Semiconductor is a 10500 CLB FPGA with max supply voltage of 1.155V, operating temp up to 100°C, and 0.5mm terminal pitch. Ideal for industrial applications requiring high performance in compact spaces.

FPGA

10500

10500 CLBS

1.1

1.045 V

1.155 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

XCV1000E-8FG1156C by Xilinx

XCV1000E-8FG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

27648

660

660

6144

331776

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XCV1000E-8FG680C by Xilinx

XCV1000E-8FG680C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: BGA; Package Shape: SQUARE;

FPGA

27648

512

512

6144

331776

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

1.9 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV100E-8FG256C by Xilinx

XCV100E-8FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

176

176

600

32400

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV100E-8PQ240C by Xilinx

XCV100E-8PQ240C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;

FPGA

2700

158

158

600

32400

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

32 mm

32 mm

4.1 mm

QFP240,1.3SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

240

S-PQFP-G240

e0

No

XCV1600E-8BG560C by Xilinx

XCV1600E-8BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

34992

404

404

7776

419904

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

7776 CLBS, 419904 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV2000E-8BG560C by Xilinx

XCV2000E-8BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

43200

404

404

9600

518400

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No