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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC5VLX220-2FF1760I by Xilinx

XC5VLX220-2FF1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

800

800

17280

0.77 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX220-2FFG1760C by Xilinx

XC5VLX220-2FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

800

800

17280

0.77 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX220T-1FF1738I by Xilinx

XC5VLX220T-1FF1738I

Xilinx

XC5VLX220T-1FF1738I by Xilinx is a FPGA with 221184 logic cells, 17280 CLBs, and 680 inputs/outputs. Operating at 1.05V, it has a max combinatorial delay of 0.9ns and can withstand temperatures from -40 to 100°C. Ideal for industrial applications requiring high-speed processing and customization in a compact form factor.

FPGA

221184

680

680

17280

0.9 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VLX220T-1FFG1738C by Xilinx

XC5VLX220T-1FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

680

680

17280

0.9 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VLX220T-1FFG1738I by Xilinx

XC5VLX220T-1FFG1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

680

680

17280

0.9 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VLX220T-2FF1738I by Xilinx

XC5VLX220T-2FF1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

680

680

17280

0.77 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VLX220T-2FFG1738C by Xilinx

XC5VLX220T-2FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

680

680

17280

0.77 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VLX30-1FF324I by Xilinx

XC5VLX30-1FF324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

220

220

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Lead

1 mm

324

S-PBGA-B324

e0

No

XC5VLX30-1FF676C by Xilinx

XC5VLX30-1FF676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

400

400

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX30-1FF676I by Xilinx

XC5VLX30-1FF676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

400

400

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX30-1FFG324C by Xilinx

XC5VLX30-1FFG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

220

220

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

XC5VLX30-1FFG324I by Xilinx

XC5VLX30-1FFG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

220

220

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

XC5VLX30-1FFG676C by Xilinx

XC5VLX30-1FFG676C

Xilinx

The Xilinx XC5VLX30-1FFG676C is a FPGA with 30720 logic cells, 2400 CLBs, and 400 inputs/outputs. Operating at 1.05V, it has a max combinatorial delay of 0.9ns and can withstand temperatures up to 85°C. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.

FPGA

30720

400

400

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX30-1FFG676I by Xilinx

XC5VLX30-1FFG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

400

400

2400

0.9 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX30-2FF324I by Xilinx

XC5VLX30-2FF324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

220

220

2400

0.77 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Lead

1 mm

324

S-PBGA-B324

e0

No

XC5VLX30-2FF676C by Xilinx

XC5VLX30-2FF676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

400

400

2400

0.77 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX30-2FF676I by Xilinx

XC5VLX30-2FF676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

400

400

2400

0.77 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX30-2FFG676C by Xilinx

XC5VLX30-2FFG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

400

400

2400

0.77 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX30-2FFG676I by Xilinx

XC5VLX30-2FFG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

400

400

2400

0.77 ns

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX30T-1FF665C by Xilinx

XC5VLX30T-1FF665C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

30720

360

360

2400

1098 MHz

CMOS

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Lead

1 mm

665

S-PBGA-B665

e0

No

XC5VLX30T-1FF665I by Xilinx

XC5VLX30T-1FF665I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

30720

360

360

2400

1098 MHz

CMOS

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Lead

1 mm

665

S-PBGA-B665

e0

No

XC5VLX30T-1FFG665C by Xilinx

XC5VLX30T-1FFG665C

Xilinx

Xilinx XC5VLX30T-1FFG665C FPGA features 30720 logic cells, 2400 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data processing units.

FPGA

30720

360

360

2400

1098 MHz

CMOS

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VLX30T-1FFG665I by Xilinx

XC5VLX30T-1FFG665I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.9 mm;

FPGA

30720

360

360

2400

1098 MHz

CMOS

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VLX30T-2FF665I by Xilinx

XC5VLX30T-2FF665I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

30720

360

360

2400

1265 MHz

CMOS

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Lead

1 mm

665

S-PBGA-B665

e0

No

XC5VLX30T-2FFG665C by Xilinx

XC5VLX30T-2FFG665C

Xilinx

Xilinx XC5VLX30T-2FFG665C FPGA features 30720 logic cells, 2400 CLBs, and a max clock frequency of 1265 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

30720

360

360

2400

1265 MHz

CMOS

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VLX30T-2FFG665I by Xilinx

XC5VLX30T-2FFG665I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE; Organization: 2400 CLBS;

FPGA

30720

360

360

2400

1265 MHz

CMOS

Field Programmable Gate Arrays

2400 CLBS

1

.95 V

1.05 V

1,2.5 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VLX330-1FF1760I by Xilinx

XC5VLX330-1FF1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

1200

1200

25920

0.9 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX330-1FFG1760C by Xilinx

XC5VLX330-1FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

1200

1200

25920

0.9 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX330-1FFG1760I by Xilinx

XC5VLX330-1FFG1760I

Xilinx

Xilinx XC5VLX330-1FFG1760I is a FPGA with 331776 logic cells, 25920 CLBs, and 1200 inputs/outputs. Operating at 1.05V, it has a max combinatorial delay of 0.9ns. Ideal for industrial applications requiring high-speed processing in compact form factors.

FPGA

331776

1200

1200

25920

0.9 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX330-2FF1760C by Xilinx

XC5VLX330-2FF1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

1200

1200

25920

0.77 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX330T-1FF1738I by Xilinx

XC5VLX330T-1FF1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

960

960

25920

0.9 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VLX330T-1FFG1738C by Xilinx

XC5VLX330T-1FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

960

960

25920

0.9 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VLX330T-1FFG1738I by Xilinx

XC5VLX330T-1FFG1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

960

960

25920

0.9 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VLX330T-2FFG1738C by Xilinx

XC5VLX330T-2FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

960

960

25920

0.77 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VLX50-1FF1153C by Xilinx

XC5VLX50-1FF1153C

Xilinx

Xilinx XC5VLX50-1FF1153C FPGA features 46080 logic cells, 3600 CLBs, and 560 inputs/outputs. With a max supply voltage of 1.05V, it is ideal for applications requiring high-speed processing in industrial automation and telecommunications sectors. The package style is a grid array with a square shape and ball terminals for surface mount assembly.

FPGA

46080

560

560

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Lead

1 mm

1153

S-PBGA-B1153

e0

No

XC5VLX50-1FF1153I by Xilinx

XC5VLX50-1FF1153I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

560

560

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Lead

1 mm

1153

S-PBGA-B1153

e0

No

XC5VLX50-1FF324C by Xilinx

XC5VLX50-1FF324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

220

220

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Lead

1 mm

324

S-PBGA-B324

e0

No

XC5VLX50-1FF324I by Xilinx

XC5VLX50-1FF324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

220

220

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Lead

1 mm

324

S-PBGA-B324

e0

No

XC5VLX50-1FF676C by Xilinx

XC5VLX50-1FF676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

440

440

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX50-1FF676I by Xilinx

XC5VLX50-1FF676I

Xilinx

The Xilinx XC5VLX50-1FF676I is a FPGA with 46080 logic cells, 3600 CLBs, and 440 inputs/outputs. It operates at 1.05V with a max combinatorial delay of 0.9ns. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

46080

440

440

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX50-1FFG1153C by Xilinx

XC5VLX50-1FFG1153C

Xilinx

The Xilinx XC5VLX50-1FFG1153C is a FPGA with 46080 logic cells, 3600 CLBs, and 560 inputs/outputs. Operating at 1.05V, it offers 0.9ns combinatorial delay per CLB. Ideal for applications requiring high-speed processing in compact form factors like telecommunications and industrial automation.

FPGA

46080

560

560

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1153

S-PBGA-B1153

e1

No

XC5VLX50-1FFG1153I by Xilinx

XC5VLX50-1FFG1153I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

560

560

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1153

S-PBGA-B1153

e1

No

XC5VLX50-1FFG324C by Xilinx

XC5VLX50-1FFG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

220

220

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

XC5VLX50-1FFG324I by Xilinx

XC5VLX50-1FFG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

220

220

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2.85 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

XC5VLX50-1FFG676C by Xilinx

XC5VLX50-1FFG676C

Xilinx

The Xilinx XC5VLX50-1FFG676C is a FPGA with 46080 logic cells, 3600 CLBs, and 440 inputs/outputs. It operates at 1.05V with a max combinatorial delay of 0.9ns. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial control systems.

FPGA

46080

440

440

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX50-1FFG676I by Xilinx

XC5VLX50-1FFG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

440

440

3600

0.9 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC5VLX50-2FF1153I by Xilinx

XC5VLX50-2FF1153I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

560

560

3600

0.77 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Lead

1 mm

1153

S-PBGA-B1153

e0

No

XC5VLX50-2FF676I by Xilinx

XC5VLX50-2FF676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

440

440

3600

0.77 ns

Field Programmable Gate Arrays

3600 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No