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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
LCMXO3L-6900C-5BG400I by Lattice Semiconductor

LCMXO3L-6900C-5BG400I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

6900

335

335

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LFE5U-45F-6BG554I by Lattice Semiconductor

LFE5U-45F-6BG554I

Lattice Semiconductor

Lattice Semiconductor's LFE5U-45F-6BG554I FPGA features 44000 logic cells, 5500 CLBs, and 245 inputs/outputs. With a max supply voltage of 1.155V, it is ideal for applications requiring high-performance computing in industrial automation, telecommunications, and automotive systems.

FPGA

44000

245

245

5500

5500 CLBS

1.1

1.045 V

1.155 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

1.76 mm

BGA554,26X26,32

Bottom

Ball

Tin Silver Copper

.8 mm

554

S-PBGA-B554

e1

XCV400E-6BG560C by Xilinx

XCV400E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV400E-6BG560I by Xilinx

XCV400E-6BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; No. of Logic Cells: 10800;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV400E-7BG560C by Xilinx

XCV400E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV400E-7BG560I by Xilinx

XCV400E-7BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.89 V;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-6BG560C by Xilinx

XCV600E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

404

404

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-6BG560I by Xilinx

XCV600E-6BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.89 V;

FPGA

15552

404

404

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-7BG560C by Xilinx

XCV600E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

404

404

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV600E-7BG560I by Xilinx

XCV600E-7BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.71 V;

FPGA

15552

404

404

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XC2S100-5FG256I by Xilinx

XC2S100-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

176

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S100-5FG456I by Xilinx

XC2S100-5FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

600

100000

263 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2S100-5PQ208I by Xilinx

XC2S100-5PQ208I

Xilinx

Xilinx XC2S100-5PQ208I FPGA offers 2700 logic cells, 600 CLBs, and 100000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for industrial applications requiring high-speed processing and programmable IC solutions. The package style is flatpack with fine pitch terminals, making it suitable for compact designs in various electronic systems.

FPGA

2700

144

140

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XC2S100-5TQ144I by Xilinx

XC2S100-5TQ144I

Xilinx

Xilinx XC2S100-5TQ144I FPGA offers 2700 logic cells, 600 CLBs, and 100000 gates. Ideal for industrial applications with a max clock frequency of 263 MHz. Package style: flatpack, low profile, fine pitch.

FPGA

2700

96

92

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC2S15-5CS144I by Xilinx

XC2S15-5CS144I

Xilinx

Xilinx XC2S15-5CS144I FPGA features 432 logic cells, 96 CLBs, and 15000 equivalent gates. Operating at a max clock frequency of 263 MHz, it is ideal for applications requiring high-speed processing in compact designs. With a package style of grid array and thin profile, it offers versatility in various electronic systems.

FPGA

432

96

92

96

15000

263 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

96 CLBS, 15000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XC2S15-5TQ144I by Xilinx

XC2S15-5TQ144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Length: 20 mm;

FPGA

432

90

86

96

15000

263 MHz

0.7 ns

Field Programmable Gate Arrays

96 CLBS, 15000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC2S15-5VQ100I by Xilinx

XC2S15-5VQ100I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; No. of Inputs: 64;

FPGA

432

64

60

96

15000

263 MHz

0.7 ns

Field Programmable Gate Arrays

96 CLBS, 15000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

100

S-PQFP-G100

e4

No

XC2S150-5FG256I by Xilinx

XC2S150-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 150000;

FPGA

3888

180

176

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S150-5FG456I by Xilinx

XC2S150-5FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

264

260

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC2S150-5PQ208I by Xilinx

XC2S150-5PQ208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; No. of Inputs: 144;

FPGA

3888

144

140

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XC2S200-5FG256I by Xilinx

XC2S200-5FG256I

Xilinx

The Xilinx XC2S200-5FG256I is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. It operates at max frequency of 263 MHz, suitable for industrial applications requiring high-speed processing. With a package style of grid array and moisture sensitivity level of 3, it offers reliable performance in various environments.

FPGA

5292

180

176

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S200-5FG456I by Xilinx

XC2S200-5FG456I

Xilinx

The Xilinx XC2S200-5FG456I is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. It operates at max frequency of 263 MHz and has 288 inputs and 284 outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.

FPGA

5292

288

284

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC2S200-5PQ208I by Xilinx

XC2S200-5PQ208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FPGA

5292

144

140

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XC2S30-5CS144I by Xilinx

XC2S30-5CS144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; No. of Inputs: 96;

FPGA

972

96

92

216

30000

263 MHz

0.7 ns

Field Programmable Gate Arrays

216 CLBS, 30000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin Lead

.8 mm

144

S-PBGA-B144

e0

No

XC2S30-5PQ208I by Xilinx

XC2S30-5PQ208I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Width: 28 mm;

FPGA

972

136

132

216

30000

263 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

216 CLBS, 30000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Tin/Lead (Sn85Pb15)

.5 mm

208

S-PQFP-G208

e0

No

XC2S30-5TQ144I by Xilinx

XC2S30-5TQ144I

Xilinx

Xilinx XC2S30-5TQ144I FPGA offers 972 logic cells, 216 CLBs, and 30000 gates. With a max clock frequency of 263 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

972

96

92

216

30000

263 MHz

0.7 ns

Field Programmable Gate Arrays

216 CLBS, 30000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC2S30-5VQ100I by Xilinx

XC2S30-5VQ100I

Xilinx

Xilinx XC2S30-5VQ100I FPGA features 972 logic cells, 216 CLBs, and 30,000 gates. With a max clock frequency of 263 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. The package style includes flatpack, thin profile, and fine pitch options for versatile integration.

FPGA

972

64

60

216

30000

263 MHz

0.7 ns

Field Programmable Gate Arrays

216 CLBS, 30000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

100

S-PQFP-G100

e4

No

XC2S50-5FG256I by Xilinx

XC2S50-5FG256I

Xilinx

Xilinx XC2S50-5FG256I FPGA features 1728 logic cells, 384 CLBs, and 50000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

1728

180

176

384

50000

263 MHz

0.7 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S50-5PQ208I by Xilinx

XC2S50-5PQ208I

Xilinx

XC2S50-5PQ208I by Xilinx is a FPGA with 1728 logic cells, 384 CLBs, and 50000 equivalent gates. It operates at max frequency of 263 MHz and has applications in various fields like telecommunications, automotive, and industrial automation due to its high performance and versatility.

FPGA

1728

144

140

384

50000

263 MHz

0.7 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

208

S-PQFP-G208

e4

No

XC2S50-5TQ144I by Xilinx

XC2S50-5TQ144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Width: 20 mm;

FPGA

1728

96

92

384

50000

263 MHz

0.7 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC3S500E-4VQG100C by Xilinx

XC3S500E-4VQG100C

Xilinx

The Xilinx XC3S500E-4VQG100C is a FPGA with 10476 logic cells, 1164 CLBs, and 500000 equivalent gates. It operates at a max frequency of 572 MHz and has a combinatorial delay of 0.76 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in electronics design.

FPGA

10476

66

59

1164

500000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

XC3S500E-4VQG100I by Xilinx

XC3S500E-4VQG100I

Xilinx

Xilinx XC3S500E-4VQG100I FPGA offers 10476 logic cells, 1164 CLBs, and 500000 gates. Ideal for industrial applications with a max clock frequency of 572 MHz. Features CMOS technology, operates at -40 to 100 °C, and has a package style of flatpack/thin profile/fine pitch.

FPGA

10476

66

59

1164

500000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Thin Profile, Fine Pitch

TFQFP

Square

14 mm

14 mm

1.2 mm

TQFP100,.63SQ

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

LCMXO2280C-3FTN324C by Lattice Semiconductor

LCMXO2280C-3FTN324C

Lattice Semiconductor

LCMXO2280C-3FTN324C by Lattice Semiconductor is a FPGA with 2280 logic cells, 285 CLBs, and 271 inputs/outputs. It operates at 1.8V nominal voltage and supports a max of 3.465V. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

2280

271

271

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

19 mm

19 mm

1.7 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

LCMXO2280C-5FTN324C by Lattice Semiconductor

LCMXO2280C-5FTN324C

Lattice Semiconductor

LCMXO2280C-5FTN324C by Lattice Semiconductor is a FPGA with 2280 logic cells, 285 CLBs, and 271 inputs/outputs. It operates at a max voltage of 3.465V and nominal voltage of 1.8V. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

2280

271

271

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

19 mm

19 mm

1.7 mm

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

LAMXO2280E-3FTN324E by Lattice Semiconductor

LAMXO2280E-3FTN324E

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

2280

271

271

285

Field Programmable Gate Arrays

285 CLBS

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

19 mm

19 mm

1.7 mm

Tray

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

AEC-Q100

LAMXO256C-3TN100E by Lattice Semiconductor

LAMXO256C-3TN100E

Lattice Semiconductor

LAMXO256C-3TN100E by Lattice Semiconductor is a 256 Logic Cells FPGA with 32 CLBs, 78 Inputs/Outputs. Operating at 1.71V to 3.465V, it's ideal for automotive applications due to AEC-Q100 screening and -40°C to 125°C temperature range. Package: PLASTIC/EPOXY, GULL WING terminals, 0.5mm pitch, suitable for space-constrained designs.

FPGA

256

78

78

32

Field Programmable Gate Arrays

32 CLBS

Also Operates at 2.5 V and 3.3 V nominal supply

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

14 mm

14 mm

1.6 mm

QFP100,.63SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

AEC-Q100

LAMXO256E-3TN100E by Lattice Semiconductor

LAMXO256E-3TN100E

Lattice Semiconductor

LAMXO256E-3TN100E by Lattice Semiconductor is a 256 Logic Cells FPGA with 32 CLBs, 78 Inputs/Outputs. Operating at -40 to 125°C, it's AEC-Q100 compliant for automotive applications. With a low profile flatpack package and 0.5mm terminal pitch, it's ideal for compact designs in automotive electronics.

FPGA

256

78

78

32

Field Programmable Gate Arrays

32 CLBS

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

14 mm

14 mm

1.6 mm

QFP100,.63SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

AEC-Q100

LAMXO640C-3FTN256E by Lattice Semiconductor

LAMXO640C-3FTN256E

Lattice Semiconductor

Lattice Semiconductor's LAMXO640C-3FTN256E is a 640 Logic Cells FPGA with 80 CLBs, 159 Inputs/Outputs. Operating at -40 to 125 °C, it has a supply voltage range of 1.71-3.465 V and is AEC-Q100 graded for automotive applications.

FPGA

640

159

159

80

Field Programmable Gate Arrays

80 CLBS

Also Operates at 2.5 V and 3.3 V nominal supply

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

LAMXO640C-3TN100E by Lattice Semiconductor

LAMXO640C-3TN100E

Lattice Semiconductor

LAMXO640C-3TN100E by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs, operating at -40 to 125 °C. Suitable for automotive applications, it has 74 Inputs/Outputs and supports supply voltages of 1.71V to 3.465V in a low-profile package style.

FPGA

640

74

74

80

Field Programmable Gate Arrays

80 CLBS

Also Operates at 2.5 V and 3.3 V nominal supply

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

14 mm

14 mm

1.6 mm

Tray

QFP100,.63SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

100

S-PQFP-G100

e3

No

AEC-Q100

LAMXO640C-3TN144E by Lattice Semiconductor

LAMXO640C-3TN144E

Lattice Semiconductor

LAMXO640C-3TN144E by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs, 113 Inputs/Outputs. It operates at -40 to 125°C, suitable for automotive applications due to AEC-Q100 screening level and low profile package style.

FPGA

640

113

113

80

Field Programmable Gate Arrays

80 CLBS

Also Operates at 2.5 V and 3.3 V nominal supply

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

Tray

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

AEC-Q100

LAMXO640E-3TN144E by Lattice Semiconductor

LAMXO640E-3TN144E

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

640

113

113

80

Field Programmable Gate Arrays

80 CLBS

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

AEC-Q100

LFE2-12E-5FN256C by Lattice Semiconductor

LFE2-12E-5FN256C

Lattice Semiconductor

Lattice Semiconductor's LFE2-12E-5FN256C FPGA offers 12000 logic cells, 1500 CLBs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with surface mount capability.

FPGA

12000

193

193

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-12E-5FN256I by Lattice Semiconductor

LFE2-12E-5FN256I

Lattice Semiconductor

LFE2-12E-5FN256I by Lattice Semiconductor is a 12000 logic cell FPGA with 1500 CLBs, 193 inputs/outputs, and max clock frequency of 311 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a max operating temp of 85°C.

FPGA

12000

193

193

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-12E-5FN484C by Lattice Semiconductor

LFE2-12E-5FN484C

Lattice Semiconductor

Lattice Semiconductor's LFE2-12E-5FN484C FPGA features 12000 logic cells, 1500 CLBs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with ball terminals.

FPGA

12000

297

297

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFE2-12E-5QN208C by Lattice Semiconductor

LFE2-12E-5QN208C

Lattice Semiconductor

Lattice Semiconductor's LFE2-12E-5QN208C FPGA features 12000 logic cells, 1500 CLBs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor with a square package shape.

FPGA

12000

131

131

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Fine Pitch

FQFP

Square

28 mm

28 mm

4.1 mm

QFP208,1.2SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

208

S-PQFP-G208

e3

No

LFE2-12E-5TN144C by Lattice Semiconductor

LFE2-12E-5TN144C

Lattice Semiconductor

LFE2-12E-5TN144C by Lattice Semiconductor is a 12000 logic cell FPGA with 1500 CLBs and 93 inputs/outputs. Operating at 1.2V, it offers a max clock frequency of 311MHz, making it ideal for high-speed applications in electronics and telecommunications. With a low profile package style and fine pitch terminals, this FPGA is suitable for compact designs requiring fast processing capabilities.

FPGA

12000

93

93

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

LFE2-12E-6F484C by Lattice Semiconductor

LFE2-12E-6F484C

Lattice Semiconductor

LFE2-12E-6F484C by Lattice Semiconductor is a 12000 logic cell FPGA with a max clock frequency of 357 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities.

FPGA

12000

297

297

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

LFE2-12E-6FN256C by Lattice Semiconductor

LFE2-12E-6FN256C

Lattice Semiconductor

Lattice Semiconductor's LFE2-12E-6FN256C FPGA offers 12000 logic cells, 1500 CLBs, and a max clock frequency of 357 MHz. Ideal for applications requiring high-speed processing and complex logic functions in a compact form factor.

FPGA

12000

193

193

1500

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No