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XC2S200-5FG256I

Xilinx

XC2S200-5FG256I by Xilinx

The Xilinx XC2S200-5FG256I is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. It operates at max frequency of 263 MHz, suitable for industrial applications requiring high-speed processing. With a package style of grid array and moisture sensitivity level of 3, it offers reliable performance in various environments.

Median Price

$132.600

Lifecycle Status

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VNN

France . 79 parts In-Stock

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NAC Semi

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AZTECH Wire

Italy . 589 parts In-Stock

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Ampacity Inc.

Singapore . 1,577 parts In-Stock

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Modulus Dynamics

Lithuania . 1,415 parts In-Stock

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One Stop Electronics

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Semicontronic

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MARBEL Systems

Belgium . 300 parts In-Stock

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Texas Native Microelectronics

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Corohmni

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Kenton Components

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Microchip USA

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A-Z Elektronik GmbH

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Qasali Group International

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Overview

Unlock the potential of your electronic designs with the Xilinx XC2S200-5FG256I Field Programmable Gate Array. Manufactured by the industry-leading Xilinx, this FPGA offers unparalleled quality and reliability. With 1176 CLBs and 200000 equivalent gates, this compact device delivers exceptional performance for a wide range of applications. Whether you're designing embedded systems, digital signal processing, or telecommunications equipment, the XC2S200-5FG256I provides the flexibility and versatility you need to bring your ideas to life. Experience the value and benefits of Xilinx technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FPGA, ensuring reliable performance over time.

No. of Logic Cells: 5292

With a high number of logic cells, this FPGA offers ample resources for complex digital designs and processing tasks.

Maximum Supply Voltage: 2.625 V

The maximum supply voltage allows for stable operation without risking damage to the FPGA's internal components.

No. of Inputs: 180

Having a large number of inputs enables the FPGA to interface with a wide range of external devices and sensors, increasing its versatility.

Maximum Clock Frequency: 263 MHz

The high maximum clock frequency ensures fast processing speeds, making this FPGA suitable for time-critical applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC2S200-5FG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

5292

No. of Inputs:

180

No. of Outputs:

176

No. of CLBs:

1176

No. of Equivalent Gates:

200000

Maximum Clock Frequency:

263 MHz

CLB Maximum Delay:

0.7 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

1176 CLBS, 200000 Gates

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies:

1.5/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC2S200-5FG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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