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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC3S200A-5FTG256C by Xilinx

XC3S200A-5FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S400A-4FG320I by Xilinx

XC3S400A-4FG320I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

251

192

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Lead

1 mm

320

S-PBGA-B320

e0

No

XC3S400A-4FG400C by Xilinx

XC3S400A-4FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S400A-4FG400I by Xilinx

XC3S400A-4FG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S400A-4FGG320I by Xilinx

XC3S400A-4FGG320I

Xilinx

Xilinx XC3S400A-4FGG320I is a FPGA with 8064 logic cells, 896 CLBs, and 400000 gates. It operates at max frequency of 667 MHz and supports industrial temperature range. Ideal for applications requiring high-speed processing in compact form factors.

FPGA

8064

251

192

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

320

S-PBGA-B320

e1

No

XC3S400A-4FGG400C by Xilinx

XC3S400A-4FGG400C

Xilinx

Xilinx XC3S400A-4FGG400C FPGA features 8064 logic cells, 896 CLBs, and 400000 equivalent gates. With a max clock frequency of 667 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. The package style is grid array with a square shape and plastic/epoxy material.

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S400A-4FGG400I by Xilinx

XC3S400A-4FGG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S400A-4FT256C by Xilinx

XC3S400A-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

195

160

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S400A-4FT256I by Xilinx

XC3S400A-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

195

160

896

400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S400A-5FGG320C by Xilinx

XC3S400A-5FGG320C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 320; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

251

192

896

400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

2 mm

BGA320,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

320

S-PBGA-B320

e1

No

XC3S400A-5FGG400C by Xilinx

XC3S400A-5FGG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

8064

311

248

896

400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S400A-5FTG256C by Xilinx

XC3S400A-5FTG256C

Xilinx

Xilinx XC3S400A-5FTG256C FPGA features 8064 logic cells, 896 CLBs, and 400000 gates. With a max clock frequency of 770 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

8064

195

160

896

400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S50A-4FT256C by Xilinx

XC3S50A-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1584

144

112

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S50A-4FT256I by Xilinx

XC3S50A-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1584

144

112

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S50A-4FTG256I by Xilinx

XC3S50A-4FTG256I

Xilinx

Xilinx XC3S50A-4FTG256I is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at max frequency of 667 MHz and supports industrial temperature range. Ideal for applications requiring high-speed processing in compact form factors.

FPGA

1584

144

112

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S50A-4TQ144C by Xilinx

XC3S50A-4TQ144C

Xilinx

The Xilinx XC3S50A-4TQ144C is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at a max frequency of 667 MHz and has 108 inputs and 101 outputs. Ideal for applications requiring high-speed processing in compact designs.

FPGA

1584

108

101

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC3S50A-4TQ144I by Xilinx

XC3S50A-4TQ144I

Xilinx

Xilinx XC3S50A-4TQ144I FPGA features 1584 logic cells, 176 CLBs, and 50000 equivalent gates. With a max clock frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package.

FPGA

1584

108

101

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Nickel Palladium Gold

.5 mm

144

S-PQFP-G144

e4

No

XC3S50A-4TQG144I by Xilinx

XC3S50A-4TQG144I

Xilinx

Xilinx XC3S50A-4TQG144I FPGA features 1584 logic cells, 176 CLBs, and 50000 equivalent gates. With a max clock frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact package with low power consumption.

FPGA

1584

108

101

176

50000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC3S50A-5FTG256C by Xilinx

XC3S50A-5FTG256C

Xilinx

The Xilinx XC3S50A-5FTG256C is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at a max clock frequency of 770 MHz and has a max operating temperature of 85°C. This FPGA is commonly used in applications requiring high-speed processing and programmable logic capabilities.

FPGA

1584

144

112

176

50000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S50A-5TQG144C by Xilinx

XC3S50A-5TQG144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FPGA

1584

108

101

176

50000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

176 CLBS, 50000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Flatpack, Low Profile, Fine Pitch

LFQFP

Square

20 mm

20 mm

1.6 mm

QFP144,.87SQ,20

Quad

Gull Wing

Matte Tin

.5 mm

144

S-PQFP-G144

e3

No

XC3S700A-4FG400C by Xilinx

XC3S700A-4FG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

311

248

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S700A-4FG400I by Xilinx

XC3S700A-4FG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

311

248

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Lead

1 mm

400

S-PBGA-B400

e0

No

XC3S700A-4FG484C by Xilinx

XC3S700A-4FG484C

Xilinx

The Xilinx XC3S700A-4FG484C is a FPGA with 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. It operates at a max frequency of 667 MHz and has 372 inputs and 288 outputs. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S700A-4FG484I by Xilinx

XC3S700A-4FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S700A-4FGG400I by Xilinx

XC3S700A-4FGG400I

Xilinx

Xilinx XC3S700A-4FGG400I FPGA features 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. It operates at a max clock frequency of 667 MHz with a combinatorial delay of 0.71 ns per CLB. Ideal for industrial applications requiring high-speed processing and programmable IC solutions.

FPGA

13248

311

248

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S700A-4FGG484C by Xilinx

XC3S700A-4FGG484C

Xilinx

Xilinx XC3S700A-4FGG484C FPGA features 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. With a max clock frequency of 667 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S700A-4FGG484I by Xilinx

XC3S700A-4FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S700A-5FGG400C by Xilinx

XC3S700A-5FGG400C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

311

248

1472

700000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

XC3S700A-5FGG484C by Xilinx

XC3S700A-5FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3SD1800A-4CSG484C by Xilinx

XC3SD1800A-4CSG484C

Xilinx

The Xilinx XC3SD1800A-4CSG484C FPGA features 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. It operates at a max clock frequency of 250 MHz and is suitable for applications requiring high-speed processing and programmable ICs in commercial extended temperature environments.

FPGA

37440

309

249

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD1800A-4CSG484I by Xilinx

XC3SD1800A-4CSG484I

Xilinx

Xilinx XC3SD1800A-4CSG484I FPGA features 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. With a max clock frequency of 250 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

37440

309

249

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD1800A-4FG676I by Xilinx

XC3SD1800A-4FG676I

Xilinx

Xilinx XC3SD1800A-4FG676I FPGA features 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. With a max clock frequency of 250 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

37440

519

409

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3SD1800A-4FGG676C by Xilinx

XC3SD1800A-4FGG676C

Xilinx

Xilinx XC3SD1800A-4FGG676C is a FPGA with 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. It operates at max frequency of 250 MHz and supports up to 519 inputs and 409 outputs. Ideal for applications requiring high-speed processing in commercial extended temperature environments.

FPGA

37440

519

409

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3SD1800A-4FGG676I by Xilinx

XC3SD1800A-4FGG676I

Xilinx

Xilinx XC3SD1800A-4FGG676I FPGA offers 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. Ideal for applications requiring high-speed processing with a max clock frequency of 250 MHz. Package style: Grid Array, technology: CMOS, suitable for various electronic designs.

FPGA

37440

519

409

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3SD1800A-5CSG484C by Xilinx

XC3SD1800A-5CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

37440

309

249

4160

1800000

280 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD1800A-5FGG676C by Xilinx

XC3SD1800A-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

37440

519

409

4160

1800000

280 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3SD3400A-4CS484C by Xilinx

XC3SD3400A-4CS484C

Xilinx

Xilinx XC3SD3400A-4CS484C FPGA features 53712 logic cells, 5968 CLBs, and 3400000 gates. Operating at a max frequency of 250 MHz, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a package style of grid array and dimensions of 19mm x 19mm, this device is suitable for surface mount designs in commercial extended temperature environments.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Lead

.8 mm

484

S-PBGA-B484

e0

No

XC3SD3400A-4CS484I by Xilinx

XC3SD3400A-4CS484I

Xilinx

Xilinx XC3SD3400A-4CS484I FPGA features 53712 logic cells, 5968 CLBs, and 3400000 gates. With a max clock frequency of 250 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. The device operates at temperatures ranging from -40 to 100°C and supports supply voltages of 1.14V to 1.26V.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Lead

.8 mm

484

S-PBGA-B484

e0

No

XC3SD3400A-4CSG484C by Xilinx

XC3SD3400A-4CSG484C

Xilinx

XC3SD3400A-4CSG484C by Xilinx is a FPGA with 53712 logic cells, 5968 CLBs, and 3400000 gates. It operates at max frequency of 250 MHz and supports up to 309 inputs and 249 outputs. Ideal for applications requiring high-speed processing such as telecommunications and industrial automation.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD3400A-4CSG484I by Xilinx

XC3SD3400A-4CSG484I

Xilinx

XC3SD3400A-4CSG484I by Xilinx is a Field Programmable Gate Array (FPGA) with 53712 logic cells and 3400000 equivalent gates. It operates at a max clock frequency of 250 MHz and is commonly used in applications requiring high-performance programmable logic solutions.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD3400A-4FG676C by Xilinx

XC3SD3400A-4FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

53712

469

409

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3SD3400A-4FG676I by Xilinx

XC3SD3400A-4FG676I

Xilinx

Xilinx XC3SD3400A-4FG676I FPGA offers 53712 logic cells, 5968 CLBs, and 3400000 gates. With a max clock frequency of 250 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

53712

469

409

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3SD3400A-4FGG676C by Xilinx

XC3SD3400A-4FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

53712

469

409

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3SD3400A-4FGG676I by Xilinx

XC3SD3400A-4FGG676I

Xilinx

Xilinx XC3SD3400A-4FGG676I FPGA features 53712 logic cells, 5968 CLBs, and 3400000 gates. With a max clock frequency of 250 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. The package style is grid array with a square shape and PLASTIC/EPOXY material.

FPGA

53712

469

409

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3SD3400A-5CSG484C by Xilinx

XC3SD3400A-5CSG484C

Xilinx

XC3SD3400A-5CSG484C by Xilinx is a Field Programmable Gate Array (FPGA) with 53,712 logic cells and 3,400,000 equivalent gates. It operates at a max clock frequency of 280 MHz and is commonly used in applications requiring high-speed data processing and programmable logic control.

FPGA

53712

309

249

5968

3400000

280 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD3400A-5FGG676C by Xilinx

XC3SD3400A-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

53712

469

409

5968

3400000

280 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC6VSX315T-3FFG1156C by Xilinx

XC6VSX315T-3FFG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

600

600

1412 MHz

CMOS

Field Programmable Gate Arrays

1

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B

e1

No

XC6VSX315T-3FFG1759C by Xilinx

XC6VSX315T-3FFG1759C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

314880

720

720

1412 MHz

CMOS

Field Programmable Gate Arrays

1

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

1759

S-PBGA-B

e1

No