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XC7A75T-1FTG256I

Xilinx

XC7A75T-1FTG256I by Xilinx

Xilinx XC7A75T-1FTG256I FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption in a compact form factor.

Median Price

$138.040

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 849 parts In-Stock

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Semicontronic

India . 1,447 parts In-Stock

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One Stop Electronics

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MARBEL Systems

Belgium . 2,992 parts In-Stock

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Ampacity Inc.

Singapore . 1,239 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Modulus Dynamics

Lithuania . 1,878 parts In-Stock

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Vigor

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Corohmni

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Microchip USA

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Continental Prestige Electronics

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Netroflash

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Supply Digital

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Overview

Unleash the power of cutting-edge technology with the XC7A75T-1FTG256I by Xilinx. As a leading manufacturer in the field programmable gate arrays (FPGA) industry, Xilinx delivers top-quality products that cater to a wide range of applications. From enhancing communication networks to optimizing industrial processes, this FPGA is designed to provide unmatched performance and flexibility. With its advanced features and reliable construction, the XC7A75T-1FTG256I offers customers unparalleled value, making it the ideal choice for those seeking innovative solutions in today's fast-paced digital landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good insulation, making the FPGA reliable and long-lasting.

No. of Logic Cells: 75520

Large number of logic cells allow for complex designs and high-performance capabilities in the FPGA.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and ensuring efficient assembly.

Maximum Supply Voltage: 1.05 V

Low supply voltage helps in reducing power consumption and heat dissipation, making the FPGA energy-efficient.

No. of CLBs: 5900

The high number of Configurable Logic Blocks (CLBs) offer flexibility in design and implementation of various functions.

No. of Inputs: 300

A large number of input pins allow for connecting to multiple external signals and devices, enhancing the versatility of the FPGA.

Package Shape: SQUARE

Square shape provides uniformity in layout and makes it easier to integrate the FPGA into standard electronic designs.

Form Of Terminal: BALL

Ball terminals offer reliable connections and support high-speed data transfer in the FPGA.

No. of Terminals: 256

Having a sufficient number of terminals enables connectivity to various external components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being programmable allows for customization and reconfiguration of the FPGA, making it adaptable to different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style provides high-density mounting, precise alignment, and efficient heat dissipation in the FPGA.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage allows for operation in low-power environments, extending the application range of the FPGA.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliability and stability of the FPGA in various environmental conditions.

Pitch Of Terminal: 1 mm

Narrow pitch of terminals enables high-density mounting and reduces signal interference in the FPGA.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low combinatorial delay ensures fast processing and response times in the FPGA, enhancing overall performance.

Organization: 5900 CLBS

Well-organized CLBs facilitate efficient design and implementation of logic functions, enabling optimal utilization of the FPGA.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation in harsh environments, increasing the reliability of the FPGA.

Finishing Of Terminal Used: TIN SILVER COPPER

This finishing provides good conductivity and corrosion resistance to ensure long-term reliability of the connections in the FPGA.

Position Of Terminal: BOTTOM

Bottom terminal position allows for easier soldering and assembly on PCBs, simplifying the manufacturing process of electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, making the FPGA suitable for a wide range of storage and operating conditions.

Maximum Seated Height: 1.55 mm

Low seated height enables compact designs and ensures proper clearance in tight spaces for the FPGA.

Width: 17 mm

Compact width allows for easy integration and placement of the FPGA on PCBs, saving valuable space in electronic devices.

Maximum Clock Frequency: 1098 MHz

High maximum clock frequency allows for fast processing and execution of logic functions, enhancing the performance of the FPGA.

No. of Outputs: 300

Having multiple output pins enables the FPGA to drive multiple devices and interfaces, increasing its functionality and usability.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature ensures proper soldering and reliability of connections during manufacturing of electronic devices.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and bonding of the FPGA to the PCB, ensuring long-term reliability.

Length: 17 mm

Compact length allows for efficient placement and routing of connections on PCBs, optimizing the layout and design of electronic devices.

Grading Of Temperature: INDUSTRIAL

Industrial temperature grading ensures reliable operation of the FPGA in extreme temperature conditions, making it suitable for industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A75T-1FTG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

75520

No. of Inputs:

300

No. of Outputs:

300

No. of CLBs:

5900

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

5900 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A75T-1FTG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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