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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCV2000E-8FG680C by Xilinx

XCV2000E-8FG680C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: BGA; Package Shape: SQUARE;

FPGA

43200

512

512

9600

518400

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

1.9 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV200E-8FG256C by Xilinx

XCV200E-8FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

176

176

1176

63504

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200E-8FG456C by Xilinx

XCV200E-8FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

284

284

1176

63504

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XCV2600E-8FG1156C by Xilinx

XCV2600E-8FG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

57132

804

804

12696

685584

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

12696 CLBS, 685584 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

1

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1156,34X34,40

Bottom

Ball

1 mm

1156

S-PBGA-B1156

No

XCV300E-8FG256C by Xilinx

XCV300E-8FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

6912

176

176

1536

82944

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 82944 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV300E-8FG456C by Xilinx

XCV300E-8FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

6912

312

312

1536

82944

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

1536 CLBS, 82944 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XCV400E-8FG676C by Xilinx

XCV400E-8FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV50E-8FG256C by Xilinx

XCV50E-8FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

176

176

384

20736

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 20736 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV600E-8FG676C by Xilinx

XCV600E-8FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

15552

444

444

3456

186624

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2S100-5FG256C by Xilinx

XC2S100-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

176

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S100-5FG456C by Xilinx

XC2S100-5FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

600

100000

263 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2S100-6FG456C by Xilinx

XC2S100-6FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

600

100000

263 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2S150-5FG256C by Xilinx

XC2S150-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

180

176

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

Maximum usable gates 150000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S150-5FG456C by Xilinx

XC2S150-5FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

264

260

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

Maximum usable gates 150000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC2S150-6FG256C by Xilinx

XC2S150-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

180

176

864

150000

263 MHz

0.6 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

Maximum usable gates 150000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S150-6FG456C by Xilinx

XC2S150-6FG456C

Xilinx

The Xilinx XC2S150-6FG456C is a FPGA with 3888 logic cells, 864 CLBs, and 150000 equivalent gates. It operates at a max frequency of 263 MHz and has 264 inputs and 260 outputs. Ideal for applications requiring high-speed processing in telecommunications, industrial control systems, and automotive electronics.

FPGA

3888

264

260

864

150000

263 MHz

0.6 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

Maximum usable gates 150000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC2S50-5FG256C by Xilinx

XC2S50-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

180

176

384

50000

263 MHz

0.7 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

Maximum usable gates 50000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S50-6FG256C by Xilinx

XC2S50-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

180

176

384

50000

263 MHz

0.6 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

Maximum usable gates 50000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XCV405E-6FG676C by Xilinx

XCV405E-6FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV405E-6FG676I by Xilinx

XCV405E-6FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV405E-7FG676C by Xilinx

XCV405E-7FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV405E-8FG676C by Xilinx

XCV405E-8FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

404

404

2400

129600

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 129600 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2S200-5FG256C by Xilinx

XC2S200-5FG256C

Xilinx

XC2S200-5FG256C by Xilinx is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 gates. It operates at max frequency of 263 MHz and has 180 inputs/176 outputs. Ideal for applications requiring high-speed processing in electronics design.

FPGA

5292

180

176

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S200-5FG456C by Xilinx

XC2S200-5FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

288

284

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC2S200-6FG256C by Xilinx

XC2S200-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

180

176

1176

200000

263 MHz

0.6 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S200-6FG456C by Xilinx

XC2S200-6FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

288

284

1176

200000

263 MHz

0.6 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

Maximum usable gates 200000

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XCV3200E-6CG1156C by Xilinx

XCV3200E-6CG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

73008

804

804

16224

876096

357.2 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

16224 CLBS, 876096 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.11 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-CBGA-B1156

e0

No

XCV3200E-7CG1156C by Xilinx

XCV3200E-7CG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

73008

804

804

16224

876096

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

16224 CLBS, 876096 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Ceramic, Metal-Sealed Cofired

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.11 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-CBGA-B1156

e0

No

XC2S100-5FG256I by Xilinx

XC2S100-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

176

600

100000

263 MHz

0.7 ns

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S100-5FG456I by Xilinx

XC2S100-5FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

600

100000

263 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 100000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2S150-5FG256I by Xilinx

XC2S150-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 150000;

FPGA

3888

180

176

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S150-5FG456I by Xilinx

XC2S150-5FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

264

260

864

150000

263 MHz

0.7 ns

Field Programmable Gate Arrays

864 CLBS, 150000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC2S200-5FG256I by Xilinx

XC2S200-5FG256I

Xilinx

The Xilinx XC2S200-5FG256I is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. It operates at max frequency of 263 MHz, suitable for industrial applications requiring high-speed processing. With a package style of grid array and moisture sensitivity level of 3, it offers reliable performance in various environments.

FPGA

5292

180

176

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC2S200-5FG456I by Xilinx

XC2S200-5FG456I

Xilinx

The Xilinx XC2S200-5FG456I is a FPGA with 5292 logic cells, 1176 CLBs, and 200000 equivalent gates. It operates at max frequency of 263 MHz and has 288 inputs and 284 outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.

FPGA

5292

288

284

1176

200000

263 MHz

0.7 ns

Field Programmable Gate Arrays

1176 CLBS, 200000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC2S50-5FG256I by Xilinx

XC2S50-5FG256I

Xilinx

Xilinx XC2S50-5FG256I FPGA features 1728 logic cells, 384 CLBs, and 50000 equivalent gates. With a max clock frequency of 263 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

1728

180

176

384

50000

263 MHz

0.7 ns

Field Programmable Gate Arrays

384 CLBS, 50000 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

LFE2-12E-5FN256C by Lattice Semiconductor

LFE2-12E-5FN256C

Lattice Semiconductor

Lattice Semiconductor's LFE2-12E-5FN256C FPGA offers 12000 logic cells, 1500 CLBs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with surface mount capability.

FPGA

12000

193

193

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-12E-5FN256I by Lattice Semiconductor

LFE2-12E-5FN256I

Lattice Semiconductor

LFE2-12E-5FN256I by Lattice Semiconductor is a 12000 logic cell FPGA with 1500 CLBs, 193 inputs/outputs, and max clock frequency of 311 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a max operating temp of 85°C.

FPGA

12000

193

193

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-12E-5FN484C by Lattice Semiconductor

LFE2-12E-5FN484C

Lattice Semiconductor

Lattice Semiconductor's LFE2-12E-5FN484C FPGA features 12000 logic cells, 1500 CLBs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with ball terminals.

FPGA

12000

297

297

1500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFE2-12E-6F484C by Lattice Semiconductor

LFE2-12E-6F484C

Lattice Semiconductor

LFE2-12E-6F484C by Lattice Semiconductor is a 12000 logic cell FPGA with a max clock frequency of 357 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities.

FPGA

12000

297

297

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

LFE2-12E-6FN256C by Lattice Semiconductor

LFE2-12E-6FN256C

Lattice Semiconductor

Lattice Semiconductor's LFE2-12E-6FN256C FPGA offers 12000 logic cells, 1500 CLBs, and a max clock frequency of 357 MHz. Ideal for applications requiring high-speed processing and complex logic functions in a compact form factor.

FPGA

12000

193

193

1500

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-12E-6FN256I by Lattice Semiconductor

LFE2-12E-6FN256I

Lattice Semiconductor

LFE2-12E-6FN256I by Lattice Semiconductor is a 12000 logic cell FPGA with 1500 CLBs and 193 inputs/outputs. Operating at max clock frequency of 357 MHz, it's ideal for industrial applications requiring high-speed processing in a compact package (17x17 mm) with low power consumption (1.2V).

FPGA

12000

193

193

1500

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-12E-7FN256C by Lattice Semiconductor

LFE2-12E-7FN256C

Lattice Semiconductor

LFE2-12E-7FN256C by Lattice Semiconductor is a 12000 logic cell FPGA with a max clock frequency of 420 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities.

FPGA

12000

193

193

1500

420 MHz

0.304 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFE2-50E-5FN484I by Lattice Semiconductor

LFE2-50E-5FN484I

Lattice Semiconductor

LFE2-50E-5FN484I by Lattice Semiconductor is a 50000 logic cell FPGA with 6000 CLBs, 339 inputs/outputs, and max clock frequency of 311 MHz. It operates at -40 to 85°C, has a supply voltage range of 1.14-1.26V, and is ideal for industrial applications requiring high-speed processing in a compact form factor.

FPGA

50000

339

339

6000

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFE2-50E-6FN484I by Lattice Semiconductor

LFE2-50E-6FN484I

Lattice Semiconductor

LFE2-50E-6FN484I by Lattice Semiconductor is a 50000 logic cell FPGA with 6000 CLBs and 339 inputs/outputs. Operating at max clock frequency of 357 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and moisture sensitivity level of 3, it offers reliable performance in harsh environments.

FPGA

50000

339

339

6000

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFXP15C-4FN256I by Lattice Semiconductor

LFXP15C-4FN256I

Lattice Semiconductor

LFXP15C-4FN256I by Lattice Semiconductor is a 1932 CLB FPGA with 188 inputs/outputs, operating at up to 375 MHz. It features a max supply voltage of 3.465 V and can withstand industrial temperatures from -40 to 100°C. Ideal for applications requiring high-speed processing in compact designs.

FPGA

1932

188

188

1932

375 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

1932 CLBS

1.8

1.71 V

3.465 V

1.8/2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

LFXP6E-3FN256I by Lattice Semiconductor

LFXP6E-3FN256I

Lattice Semiconductor

LFXP6E-3FN256I by Lattice Semiconductor is a 720 CLB FPGA with 188 inputs/outputs, operating at max 375 MHz. It has a supply voltage range of 1.14V to 1.26V and can withstand industrial temperatures (-40°C to 100°C). Ideal for applications requiring high-speed processing in compact designs.

FPGA

720

188

188

720

375 MHz

0.63 ns

CMOS

Field Programmable Gate Arrays

720 CLBS

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper

1 mm

256

S-PBGA-B256

e1

No

XC5VLX110-1FF1153C by Xilinx

XC5VLX110-1FF1153C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Lead

1 mm

1153

S-PBGA-B1153

e0

No

XC5VLX110-1FF1153I by Xilinx

XC5VLX110-1FF1153I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1153,34X34,40

Bottom

Ball

Tin Lead

1 mm

1153

S-PBGA-B1153

e0

No