Loading...
Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCV600E-6FG676C by Xilinx

XCV600E-6FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

15552

444

444

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV600E-6FG676I by Xilinx

XCV600E-6FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.71 V;

FPGA

15552

444

444

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV600E-6FG680C by Xilinx

XCV600E-6FG680C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: BGA; Package Shape: SQUARE;

FPGA

15552

512

512

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

1.9 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV600E-6FG900I by Xilinx

XCV600E-6FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .47 ns;

FPGA

15552

512

512

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

900

S-PBGA-B900

e0

No

XCV600E-7FG676C by Xilinx

XCV600E-7FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

15552

444

444

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV600E-7FG676I by Xilinx

XCV600E-7FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 15552;

FPGA

15552

444

444

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XCV600E-7FG900I by Xilinx

XCV600E-7FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

15552

512

512

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

900

S-PBGA-B900

e0

No

XC7A100T-L2FGG484E by Xilinx

XC7A100T-L2FGG484E

Xilinx

The Xilinx XC7A100T-L2FGG484E is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1286 MHz. It operates at 0.9V nominal voltage and is used in applications requiring high-speed processing such as telecommunications and data processing.

FPGA

101440

285

285

7925

1286 MHz

1.51 ns

CMOS

Field Programmable Gate Arrays

7925 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A100T-L2FGG676E by Xilinx

XC7A100T-L2FGG676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

101440

300

300

7925

1286 MHz

1.51 ns

CMOS

Field Programmable Gate Arrays

7925 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A200T-L2FBG484E by Xilinx

XC7A200T-L2FBG484E

Xilinx

The Xilinx XC7A200T-L2FBG484E is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

215360

285

285

16825

1286 MHz

1.51 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A200T-L2FBG676E by Xilinx

XC7A200T-L2FBG676E

Xilinx

Xilinx XC7A200T-L2FBG676E FPGA features 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a grid array package style.

FPGA

215360

400

400

16825

1286 MHz

1.51 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A200T-L2FFG1156E by Xilinx

XC7A200T-L2FFG1156E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

215360

500

500

16825

1098 MHz

1.51 ns

Field Programmable Gate Arrays

16825 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.1 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC7A35T-1FGG484C by Xilinx

XC7A35T-1FGG484C

Xilinx

Xilinx XC7A35T-1FGG484C is a CMOS FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications, networking, and industrial automation. Package style: Grid Array, terminals: Ball grid array (BGA), operating temp range: 0-85°C.

FPGA

33280

250

250

2600

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A35T-1FGG484I by Xilinx

XC7A35T-1FGG484I

Xilinx

Xilinx XC7A35T-1FGG484I FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1098 MHz. Ideal for high-performance applications requiring fast processing speeds in compact designs. Package style: grid array, with a square shape and ball terminals for efficient mounting.

FPGA

33280

250

250

2600

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A35T-3FGG484E by Xilinx

XC7A35T-3FGG484E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

33280

250

250

2600

1412 MHz

0.94 ns

CMOS

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A35T-L2FGG484E by Xilinx

XC7A35T-L2FGG484E

Xilinx

Xilinx XC7A35T-L2FGG484E FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

33280

250

250

2600

1098 MHz

1.51 ns

CMOS

Field Programmable Gate Arrays

2600 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A50T-1FGG484I by Xilinx

XC7A50T-1FGG484I

Xilinx

The Xilinx XC7A50T-1FGG484I is a FPGA with 52160 logic cells, 4075 CLBs, and operates at a max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A50T-2FGG484I by Xilinx

XC7A50T-2FGG484I

Xilinx

Xilinx XC7A50T-2FGG484I FPGA features 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A50T-3FGG484E by Xilinx

XC7A50T-3FGG484E

Xilinx

Xilinx XC7A50T-3FGG484E FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1412 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

52160

250

250

4075

1412 MHz

0.94 ns

CMOS

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A50T-L2FGG484E by Xilinx

XC7A50T-L2FGG484E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

52160

250

250

4075

1098 MHz

1.51 ns

CMOS

Field Programmable Gate Arrays

4075 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-1FGG484C by Xilinx

XC7A75T-1FGG484C

Xilinx

Xilinx XC7A75T-1FGG484C FPGA features 75520 logic cells, 5900 CLBs, and max clock frequency of 1098 MHz. Ideal for high-performance applications requiring fast processing speeds in a compact form factor.

FPGA

75520

285

285

5900

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-1FGG484I by Xilinx

XC7A75T-1FGG484I

Xilinx

Xilinx XC7A75T-1FGG484I FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with a low supply voltage range from 0.95V to 1.05V.

FPGA

75520

285

285

5900

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-1FGG676C by Xilinx

XC7A75T-1FGG676C

Xilinx

The Xilinx XC7A75T-1FGG676C is a FPGA with 75520 logic cells, 5900 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

75520

300

300

5900

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A75T-1FGG676I by Xilinx

XC7A75T-1FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.44 mm;

FPGA

75520

300

300

5900

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A75T-2FGG484C by Xilinx

XC7A75T-2FGG484C

Xilinx

XC7A75T-2FGG484C by Xilinx is a CMOS-based FPGA with 75520 logic cells and 5900 CLBs. It operates at a max clock frequency of 1286 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.

FPGA

75520

285

285

5900

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-2FGG484I by Xilinx

XC7A75T-2FGG484I

Xilinx

The Xilinx XC7A75T-2FGG484I is a FPGA with 75520 logic cells, 5900 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

75520

285

285

5900

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-2FGG676C by Xilinx

XC7A75T-2FGG676C

Xilinx

Xilinx XC7A75T-2FGG676C FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

75520

300

300

5900

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A75T-2FGG676I by Xilinx

XC7A75T-2FGG676I

Xilinx

XC7A75T-2FGG676I by Xilinx is a CMOS-based FPGA with 75520 logic cells and 5900 CLBs. It operates at a max clock frequency of 1286 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.

FPGA

75520

300

300

5900

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A75T-3FGG484E by Xilinx

XC7A75T-3FGG484E

Xilinx

Xilinx XC7A75T-3FGG484E FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1412 MHz. Ideal for high-performance applications requiring advanced programmable ICs in a compact grid array package with a low combinatorial delay of 0.94 ns.

FPGA

75520

285

285

5900

1412 MHz

0.94 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-3FGG676E by Xilinx

XC7A75T-3FGG676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Length: 27 mm;

FPGA

75520

300

300

5900

1412 MHz

0.94 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7A75T-L2FGG484E by Xilinx

XC7A75T-L2FGG484E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Additional Features: ALSO OPERATES AT 1V SUPPLY;

FPGA

75520

285

285

5900

1098 MHz

1.51 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A75T-L2FGG676E by Xilinx

XC7A75T-L2FGG676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

75520

300

300

5900

1098 MHz

1.51 ns

CMOS

Field Programmable Gate Arrays

5900 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC7VH580T-1FLG1155C by Xilinx

XC7VH580T-1FLG1155C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE;

FPGA

45350

0.74 ns

45350 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1155

S-PBGA-B1155

e1

XC7VH580T-2FLG1155C by Xilinx

XC7VH580T-2FLG1155C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE;

FPGA

45350

0.61 ns

45350 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1155

S-PBGA-B1155

e1

XC7VH580T-2FLG1931C by Xilinx

XC7VH580T-2FLG1931C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1931; Package Code: BGA; Package Shape: SQUARE;

FPGA

45350

0.61 ns

45350 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1931

S-PBGA-B1931

e1

XC7VH580T-G2FLG1155E by Xilinx

XC7VH580T-G2FLG1155E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1155; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

45350

0.61 ns

45350 CLBS

1

.97 V

1.03 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1155

S-PBGA-B1155

e1

XC7VH870T-2FLG1932C by Xilinx

XC7VH870T-2FLG1932C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE;

FPGA

68450

0.61 ns

68450 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

Tin Silver Copper

1932

S-PBGA-B1932

e1

XC7VX1140T-L2FLG1928E by Xilinx

XC7VX1140T-L2FLG1928E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1928; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

1139200

480

480

89000

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

89000 CLBS

1

.97 V

1.03 V

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1928

S-PBGA-B1928

e1

No

XC7VX485T-L2FFG1157E by Xilinx

XC7VX485T-L2FFG1157E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1157; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

485760

600

600

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1157

S-PBGA-B1157

e1

No

XC7VX485T-L2FFG1158E by Xilinx

XC7VX485T-L2FFG1158E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Organization: 37950 CLBS;

FPGA

485760

350

350

37950

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

37950 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX690T-L2FFG1158E by Xilinx

XC7VX690T-L2FFG1158E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1158; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

693120

350

350

54150

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.35 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1158

S-PBGA-B1158

e1

No

XC7VX690T-L2FFG1761E by Xilinx

XC7VX690T-L2FFG1761E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1761; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 54150;

FPGA

693120

850

850

54150

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1761

S-PBGA-B1761

e1

No

XC7VX690T-L2FFG1926E by Xilinx

XC7VX690T-L2FFG1926E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1926; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 54150;

FPGA

693120

720

720

54150

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

54150 CLBS

1

.97 V

1.03 V

1,1.8 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin/Silver/Copper

1 mm

1926

S-PBGA-B1926

e1

No

XC7VX980T-L2FFG1930E by Xilinx

XC7VX980T-L2FFG1930E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1930; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 900;

FPGA

979200

900

900

76500

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

76500 CLBS

1

.97 V

1.03 V

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.65 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1930

S-PBGA-B1930

e1

No

XCV1000E-8FG1156C by Xilinx

XCV1000E-8FG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

27648

660

660

6144

331776

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XCV1000E-8FG680C by Xilinx

XCV1000E-8FG680C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: BGA; Package Shape: SQUARE;

FPGA

27648

512

512

6144

331776

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

1.9 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV100E-8FG256C by Xilinx

XCV100E-8FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

176

176

600

32400

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV2000E-8FG1156C by Xilinx

XCV2000E-8FG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

43200

804

804

9600

518400

416 MHz

0.4 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No