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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC4010E-1BG225C by Xilinx

XC4010E-1BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

166 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-3BG225C by Xilinx

XC4010E-3BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-3BG225I by Xilinx

XC4010E-3BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 160;

FPGA

400

160

160

400

7000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-4BG225C by Xilinx

XC4010E-4BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-4BG225I by Xilinx

XC4010E-4BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 400;

FPGA

400

160

160

400

7000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-1BG225C by Xilinx

XC4013E-1BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

166 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-2BG225C by Xilinx

XC4013E-2BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-2BG225I by Xilinx

XC4013E-2BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 10000;

FPGA

1368

192

192

576

10000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-3BG225C by Xilinx

XC4013E-3BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-3BG225I by Xilinx

XC4013E-3BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 4.5 V;

FPGA

1368

192

192

576

10000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-4BG225C by Xilinx

XC4013E-4BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-4BG225I by Xilinx

XC4013E-4BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 5;

FPGA

1368

192

192

576

10000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XCV100-4BG256C by Xilinx

XCV100-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

180

600

108904

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV100-4BG256I by Xilinx

XCV100-4BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;

FPGA

2700

180

180

600

108904

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV100-4FG256C by Xilinx

XCV100-4FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

176

176

600

108904

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV100-4FG256I by Xilinx

XCV100-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B256;

FPGA

2700

176

176

600

108904

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV100-5BG256C by Xilinx

XCV100-5BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

180

600

108904

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV100-5BG256I by Xilinx

XCV100-5BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.5/3.3,2.5;

FPGA

2700

180

180

600

108904

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV100-5FG256C by Xilinx

XCV100-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

176

176

600

108904

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV100-5FG256I by Xilinx

XCV100-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Width: 17 mm;

FPGA

2700

176

176

600

108904

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV100-6BG256C by Xilinx

XCV100-6BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

180

180

600

108904

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV100-6FG256C by Xilinx

XCV100-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

176

176

600

108904

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 108904 Gates

2.5

2.375 V

2.625 V

1.5/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV150-4BG256C by Xilinx

XCV150-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

180

180

864

164674

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV150-4FG256C by Xilinx

XCV150-4FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

176

176

864

164674

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV150-4FG256I by Xilinx

XCV150-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

3888

176

176

864

164674

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV150-5BG256I by Xilinx

XCV150-5BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 164674;

FPGA

3888

180

180

864

164674

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV150-5FG256C by Xilinx

XCV150-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

176

176

864

164674

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV150-5FG256I by Xilinx

XCV150-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 3888;

FPGA

3888

176

176

864

164674

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV150-6BG256C by Xilinx

XCV150-6BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

180

180

864

164674

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV150-6FG256C by Xilinx

XCV150-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3888

176

176

864

164674

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 164674 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200-4BG256C by Xilinx

XCV200-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

180

180

1176

236666

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV200-4FG256C by Xilinx

XCV200-4FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

176

176

1176

236666

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200-4FG256I by Xilinx

XCV200-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Width: 17 mm;

FPGA

5292

176

176

1176

236666

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200-5BG256I by Xilinx

XCV200-5BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 180;

FPGA

5292

180

180

1176

236666

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV200-5FG256C by Xilinx

XCV200-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

176

176

1176

236666

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200-5FG256I by Xilinx

XCV200-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn63Pb37);

FPGA

5292

176

176

1176

236666

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200-6FG256C by Xilinx

XCV200-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

176

176

1176

236666

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 236666 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV50-4BG256C by Xilinx

XCV50-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

180

180

384

57906

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV50-4BG256I by Xilinx

XCV50-4BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

1728

180

180

384

57906

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV50-4FG256C by Xilinx

XCV50-4FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

176

176

384

57906

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV50-4FG256I by Xilinx

XCV50-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 2.5;

FPGA

1728

176

176

384

57906

250 MHz

0.8 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV50-5BG256C by Xilinx

XCV50-5BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

180

180

384

57906

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV50-5BG256I by Xilinx

XCV50-5BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

1728

180

180

384

57906

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV50-5FG256C by Xilinx

XCV50-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

176

176

384

57906

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV50-5FG256I by Xilinx

XCV50-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Organization: 384 CLBS, 57906 GATES;

FPGA

1728

176

176

384

57906

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV50-6BG256C by Xilinx

XCV50-6BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

180

180

384

57906

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCV50-6FG256C by Xilinx

XCV50-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

1728

176

176

384

57906

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 57906 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC4010XL-09BG256C by Xilinx

XC4010XL-09BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

217 MHz

1.2 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Typical gates = 7000-20000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No