Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Xilinx XC2S150-6FG456C is a FPGA with 3888 logic cells, 864 CLBs, and 150000 equivalent gates. It operates at a max frequency of 263 MHz and has 264 inputs and 260 outputs. Ideal for applications requiring high-speed processing in telecommunications, industrial control systems, and automotive electronics.
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Resion (Excess)
Plastic/epoxy material makes the package lightweight and durable, suitable for a wide range of applications.
Large number of logic cells provides flexibility and capability to handle complex designs.
Surface mount capability allows for easy integration onto circuit boards.
Moderate maximum supply voltage for efficient power consumption and operation.
Generous number of Configurable Logic Blocks (CLBs) enables versatile logic implementation.
Large number of inputs allows for extensive connectivity and input options.
Square package shape is space-efficient and facilitates easy placement on circuit boards.
Ball terminal design simplifies the connection and soldering process for effective assembly.
High number of equivalent gates provides ample resources for complex logic functions.
Stable nominal supply voltage ensures consistent performance.
Multiple power supply options allow for compatibility with different voltage requirements.
Abundance of terminals enables versatile connectivity and ease of integration.
Field programmable gate array allows for customization and flexibility in logic design.
Grid array package style facilitates systematic placement and connection on circuit boards.
Moderate minimum supply voltage for reliable operation across varying input voltages.
High maximum operating temperature tolerance for robust performance in demanding environments.
Optimal terminal pitch allows for efficient routing and connection in the assembly process.
Low combinatorial delay ensures fast logic processing and response times.
Organized structure with specific number of CLBs and gates enables efficient design implementation.
Low minimum operating temperature ensures reliable performance even in cold conditions.
Tin lead finishing on terminals enhances conductivity and durability for long-lasting performance.
Bottom terminal position simplifies routing and connection of the FPGA on circuit boards.
Moisture sensitivity level 3 indicates moderate resistance to moisture and humidity-related issues.
Low seated height profile allows for compact and space-efficient PCB designs.
Moderate width dimension for easy integration and placement within circuit board layouts.
High maximum clock frequency enables rapid data processing and operation speed.
Abundance of outputs offers versatile output options and connectivity in the logic design.
Extended time at peak reflow temperature ensures proper soldering and connection integrity during assembly.
High peak reflow temperature tolerance ensures reliable solder joints and connections during assembly.
Moderate length dimension for easy integration and placement within circuit board layouts.
Field Programmable Gate Arrays (FPGA) XC2S150-6FG456C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC2S150-6FG456C Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult DEV EOL 01/Jan/2024
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
2N2222A
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
1N4148
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Telcom Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
EU2B-YS3203F
Idec
ROTARY SWITCH;
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
LFCPNX-100-7BFG484I
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;
10CX150YF780I5G
Intel
Intel's 10CX150YF780I5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at -40 to 100 °C, it has 284 inputs/outputs for industrial applications. Utilizes TSMC tech with 0.87-0.93 V supply voltage range in a grid array package.
10M08SAU169I7G
Intel 10M08SAU169I7G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a package style of GRID ARRAY and PLASTIC/EPOXY material, it is ideal for industrial applications requiring high-performance programmable ICs. Operating b/w -40 to 100 °C, this FPGA offers versatility in various electronic designs.
LCMXO2-7000HC-4FTG256C
LCMXO2-7000HC-4FTG256C by Lattice Semiconductor is a FPGA with 6864 logic cells, 206 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring high-speed processing in compact designs with a max operating temperature of 85°C.
A3P1000-PQG208I
Microchip Technology
A3P1000-PQG208I by Microchip Technology is a CMOS FPGA with 24576 CLBs and 1000000 gates. It operates at a max clock frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a package style of flatpack, fine pitch, it offers versatility in design while maintaining reliability in harsh environments.
XC6SLX150T-3FGG484I
Xilinx
Xilinx XC6SLX150T-3FGG484I FPGA features 147443 logic cells, 11519 CLBs, and 296 inputs/outputs. Utilized in industrial applications, it operates at a max clock frequency of 862 MHz with a combinatorial delay of 0.21 ns per CLB.
EP1C4F324C8N
EP1C4F324C8N by Intel is a 4000 logic cell FPGA with 400 CLBs and 249 inputs/outputs. Operating at a max frequency of 275 MHz, it's ideal for applications requiring high-speed processing such as signal processing, networking, and industrial automation. With a compact square package style and low power consumption at 1.5V, it offers versatile programmability for various electronic designs.
M1A3P1000-FG256I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC3S250E-4VQG100I
Xilinx XC3S250E-4VQG100I FPGA offers 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for industrial applications requiring high-speed processing in compact designs. The package style includes flatpack, thin profile, and fine pitch options for versatile integration.
XC7A35T-1FTG256I
Xilinx XC7A35T-1FTG256I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact form factor. Operates b/w -40 to 100 °C with low profile grid array package style.
EP3C120F780I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: RECTANGULAR;
EP1C12Q240C8N
EP1C12Q240C8N by Altera is a field programmable gate array (FPGA) with 12060 logic cells, 173 inputs/outputs, and maximum clock frequency of 275 MHz. It operates at a nominal supply voltage of 1.5V and is suitable for various applications requiring programmable ICs.
10M08SAM153I7G
The Altera 10M08SAM153I7G is a field programmable gate array (FPGA) with a plastic/epoxy package and surface mount capability. It has a square package shape with ball terminals and a package code of BGA. With 153 terminals, it is a versatile programmable IC. It features a grid array package style and bottom terminal position. The JESD-30 code for this FPGA is S-PBGA-B153. Unfortunately, detailed information regarding its maximum time at peak reflow temperature and peak reflow temperature are not specified.
EP4CE15F17C8N
EP4CE15F17C8N by Altera is a Field Programmable Gate Array (FPGA) with 15408 logic cells, 963 CLBs, 165 inputs/outputs, and a maximum clock frequency of 472.5 MHz. It is suited for various applications that require programmable ICs and high-performance processing.
EP4CE15F17I7N
EP4CE15F17I7N by Intel is a FPGA with 15408 logic cells, 963 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC7S50-2FGGA484I
The Xilinx XC7S50-2FGGA484I is a Field Programmable Gate Array with 52160 logic cells and 4075 CLBs. It operates at a max clock frequency of 1286 MHz, making it ideal for industrial applications requiring high-speed processing. With a package style of grid array and surface mount capability, this FPGA offers versatile programmability in various electronic systems.
5CEFA9F23I7N
Intel's 5CEFA9F23I7N FPGA features 301K logic cells, 230 inputs/outputs, and CMOS technology. Ideal for applications requiring high-speed data processing and complex algorithm implementations in fields like telecommunications, aerospace, and industrial automation.
EP4CE40F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
EP3C40F484I7N
EP3C40F484I7N by Intel is a FPGA with 39600 logic cells, 331 inputs/outputs, and max clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its CMOS technology and grid array package style.
M7A3P1000-PQG208I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
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XC2S600E-6FGG456I
Xilinx XC2S600E-6FGG456I FPGA features 15552 logic cells, 864 CLBs, and 52000 equivalent gates. With a max clock frequency of 357 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
XC2S50-5PQG208C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC2S30-6VQ100C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC2S30-6VQG100C
XC2S30-5VQG100I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC2S200-5FG456I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
XC2S200-6PQG208C
XC2S30-6CSG144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;
XC2S200-5PQG208C
XC2S200-5PQG208C by Xilinx is a Field Programmable Gate Array (FPGA) with 5292 logic cells and 1176 configurable logic blocks (CLBs). It operates at a max clock frequency of 263 MHz and is commonly used in applications requiring high-speed data processing.
XC2S300E-6PQ208C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC2S50-5PQ208I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Maximum Supply Voltage: 2.625 V;
XC2S15-5CS144I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA144,13X13,32;
XC2S200-6PQ208C
XC2S30-5VQG100C
XC2S50-5TQ144Q
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC2S30-5TQ144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC2S30-5VQ100C
XC2S150-5PQG208I
XC2S100-6PQG208C
XC2S100-5PQG208C
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