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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6SLX150-2FGG900C by Xilinx

XC6SLX150-2FGG900C

Xilinx

Xilinx XC6SLX150-2FGG900C is a FPGA with 147443 logic cells, 11519 CLBs, and 570 inputs/outputs. Operating at max frequency of 667 MHz, it's ideal for high-performance applications requiring fast combinatorial delays (0.26 ns) in a compact package (31mm x 31mm).

FPGA

147443

570

570

11519

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX150-2FGG900I by Xilinx

XC6SLX150-2FGG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

570

570

11519

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX150-3FG900C by Xilinx

XC6SLX150-3FG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

570

570

11519

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX150-3FG900I by Xilinx

XC6SLX150-3FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

576

576

11519

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX150-3FGG900C by Xilinx

XC6SLX150-3FGG900C

Xilinx

Xilinx XC6SLX150-3FGG900C FPGA features 147443 logic cells, 11519 CLBs, and 570 inputs/outputs. Utilized in applications requiring high-speed processing up to 862 MHz with a max operating temperature of 85°C. Ideal for projects demanding versatile programmable ICs in a compact grid array package.

FPGA

147443

570

570

11519

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX150-3FGG900I by Xilinx

XC6SLX150-3FGG900I

Xilinx

Xilinx XC6SLX150-3FGG900I is a FPGA with 147443 logic cells, 11519 CLBs, and max clock frequency of 862 MHz. It operates at industrial temperatures, suitable for high-performance applications like telecommunications and networking due to its advanced CMOS technology.

FPGA

147443

576

576

11519

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX150T-2FG900I by Xilinx

XC6SLX150T-2FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

530

530

11519

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX150T-2FGG900C by Xilinx

XC6SLX150T-2FGG900C

Xilinx

Xilinx XC6SLX150T-2FGG900C is a FPGA with 147443 logic cells, 11519 CLBs, and 530 inputs/outputs. It operates at max frequency of 667 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for applications requiring high-speed processing in industrial automation and telecommunications sectors.

FPGA

147443

530

530

11519

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX150T-2FGG900I by Xilinx

XC6SLX150T-2FGG900I

Xilinx

Xilinx XC6SLX150T-2FGG900I FPGA features 147443 logic cells, 11519 CLBs, and 530 inputs/outputs. It operates at a max frequency of 667 MHz and is ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and CMOS technology, it offers versatile programmable IC solutions.

FPGA

147443

530

530

11519

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX150T-3FG900C by Xilinx

XC6SLX150T-3FG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

530

530

11519

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX150T-3FG900I by Xilinx

XC6SLX150T-3FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

540

540

11519

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX150T-3FGG900C by Xilinx

XC6SLX150T-3FGG900C

Xilinx

Xilinx XC6SLX150T-3FGG900C is a FPGA with 147443 logic cells, 11519 CLBs, and 530 inputs/outputs. It operates at max clock frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for applications requiring high-speed processing in industrial automation and telecommunications sectors.

FPGA

147443

530

530

11519

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX150T-3FGG900I by Xilinx

XC6SLX150T-3FGG900I

Xilinx

Xilinx XC6SLX150T-3FGG900I FPGA features 147443 logic cells, 11519 CLBs, and 540 inputs/outputs. Utilized in industrial applications for high-speed processing with a max clock frequency of 862 MHz. Operates at temperatures ranging from -40 to 100°C, making it suitable for various electronic systems.

FPGA

147443

540

540

11519

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX150T-4FGG900C by Xilinx

XC6SLX150T-4FGG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

540

540

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

900

S-PBGA-B900

e1

No

XC3S2000-4FG900I by Xilinx

XC3S2000-4FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B900;

FPGA

46080

565

565

5120

2000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

5120 CLBS, 2000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC3S4000-4FG900C by Xilinx

XC3S4000-4FG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

62208

633

633

6912

4000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

6912 CLBS, 4000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC3S4000-4FG900I by Xilinx

XC3S4000-4FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 630 MHz;

FPGA

62208

633

633

6912

4000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

6912 CLBS, 4000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC3S5000-4FG900C by Xilinx

XC3S5000-4FG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

74880

633

633

8320

5000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

8320 CLBS, 5000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC3S5000-4FG900I by Xilinx

XC3S5000-4FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 633;

FPGA

74880

633

633

8320

5000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

8320 CLBS, 5000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC3S5000-5FG900C by Xilinx

XC3S5000-5FG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

74880

633

633

8320

5000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

8320 CLBS, 5000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC3S2000-4FGG900C by Xilinx

XC3S2000-4FGG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

565

565

5120

2000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

5120 CLBS, 2000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC3S2000-5FGG900C by Xilinx

XC3S2000-5FGG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

565

565

5120

2000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

5120 CLBS, 2000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC3S4000-4FGG900C by Xilinx

XC3S4000-4FGG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

62208

633

633

6912

4000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

6912 CLBS, 4000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC3S4000-4FGG900I by Xilinx

XC3S4000-4FGG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

62208

633

633

6912

4000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

6912 CLBS, 4000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC3S4000-5FGG900C by Xilinx

XC3S4000-5FGG900C

Xilinx

The Xilinx XC3S4000-5FGG900C is a FPGA with 62208 logic cells, 6912 CLBs, and 4000000 equivalent gates. It operates at a max frequency of 725 MHz and has 633 inputs/outputs. Ideal for applications requiring high-speed processing in fields like telecommunications and industrial automation.

FPGA

62208

633

633

6912

4000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

6912 CLBS, 4000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC3S5000-4FGG900C by Xilinx

XC3S5000-4FGG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

74880

633

633

8320

5000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

8320 CLBS, 5000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC3S5000-4FGG900I by Xilinx

XC3S5000-4FGG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B900;

FPGA

74880

633

633

8320

5000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

8320 CLBS, 5000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC3S5000-5FGG900C by Xilinx

XC3S5000-5FGG900C

Xilinx

Xilinx XC3S5000-5FGG900C FPGA features 74880 logic cells, 8320 CLBs, and 5000000 equivalent gates. With a max clock frequency of 725 MHz, it is ideal for high-performance applications requiring fast processing speeds. The package style is grid array with a square shape, making it suitable for compact electronic designs.

FPGA

74880

633

633

8320

5000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

8320 CLBS, 5000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC3S4000L-4FGG900C by Xilinx

XC3S4000L-4FGG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

62208

633

633

6912

4000000

CMOS

Field Programmable Gate Arrays

6912 CLBS, 4000000 Gates

1.2

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX100T-N3FG900I by Xilinx

XC6SLX100T-N3FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

498

498

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX100T-N3FGG900I by Xilinx

XC6SLX100T-N3FGG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

498

498

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX150-N3FG900C by Xilinx

XC6SLX150-N3FG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

576

576

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX150-N3FG900I by Xilinx

XC6SLX150-N3FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

576

576

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX150T-N3FG900C by Xilinx

XC6SLX150T-N3FG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

540

540

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX150T-N3FG900I by Xilinx

XC6SLX150T-N3FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

540

540

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX150T-N3FGG900C by Xilinx

XC6SLX150T-N3FGG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

540

540

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX150T-N3FGG900I by Xilinx

XC6SLX150T-N3FGG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

540

540

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU035-1FBVA900C by Xilinx

XCKU035-1FBVA900C

Xilinx

Xilinx XCKU035-1FBVA900C FPGA offers 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at a max supply voltage of 0.979 V with a package style of grid array.

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU035-1FBVA900I by Xilinx

XCKU035-1FBVA900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU035-2FBVA900E by Xilinx

XCKU035-2FBVA900E

Xilinx

Xilinx XCKU035-2FBVA900E FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at supply voltages ranging from 0.922V to 0.979V with a max temperature of 100°C.

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU035-2FBVA900I by Xilinx

XCKU035-2FBVA900I

Xilinx

Xilinx XCKU035-2FBVA900I FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. The package style is a grid array with a square shape and ball terminals for surface mount assembly.

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU035-3FBVA900E by Xilinx

XCKU035-3FBVA900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU035-L1FBVA900I by Xilinx

XCKU035-L1FBVA900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

444343

520

520

1700

Field Programmable Gate Arrays

1700 CLBS

Also Operates at 0.95 V nominal supply

.9

.873 V

.927 V

0.9 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU040-1FBVA900C by Xilinx

XCKU040-1FBVA900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU040-1FBVA900I by Xilinx

XCKU040-1FBVA900I

Xilinx

Xilinx XCKU040-1FBVA900I FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100 °C with a max supply voltage of 0.979 V.

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU040-2FBVA900E by Xilinx

XCKU040-2FBVA900E

Xilinx

Xilinx XCKU040-2FBVA900E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operating temperature range from 0 to 100°C makes it versatile for various environments.

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU040-2FBVA900I by Xilinx

XCKU040-2FBVA900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XCKU040-3FBVA900E by Xilinx

XCKU040-3FBVA900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

530250

520

520

1920

Field Programmable Gate Arrays

1920 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.8 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No