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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7K325T-1FF900C by Xilinx

XC7K325T-1FF900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

326080

500

500

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC7K355T-1FF901I by Xilinx

XC7K355T-1FF901I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

356160

300

300

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC7K410T-1FF900I by Xilinx

XC7K410T-1FF900I

Xilinx

The Xilinx XC7K410T-1FF900I is a CMOS FPGA with 406720 logic cells, 500 inputs/outputs, and a max clock frequency of 1818 MHz. It features a grid array package style and is ideal for high-performance computing applications requiring fast processing speeds and extensive input/output capabilities.

FPGA

406720

500

500

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC7K410T-2FB900I by Xilinx

XC7K410T-2FB900I

Xilinx

Xilinx XC7K410T-2FB900I FPGA features 406720 logic cells, 500 inputs/outputs, and max clock frequency of 1818 MHz. Ideal for high-performance applications requiring fast processing speeds and extensive input/output capabilities in fields like telecommunications and data processing.

FPGA

406720

500

500

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC7K325T-1FBG900C by Xilinx

XC7K325T-1FBG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

326080

500

500

25475

1098 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K325T-1FBG900I by Xilinx

XC7K325T-1FBG900I

Xilinx

Xilinx XC7K325T-1FBG900I FPGA features 326080 logic cells, 25475 CLBs, and a max clock frequency of 1098 MHz. Ideal for high-performance applications requiring advanced programmable ICs with low combinatorial delay and multiple power supply options.

FPGA

326080

500

500

25475

1098 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K325T-1FFG900C by Xilinx

XC7K325T-1FFG900C

Xilinx

Xilinx XC7K325T-1FFG900C is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1098 MHz. It operates at 0-85°C, uses CMOS technology, and has 500 inputs/outputs. Ideal for high-performance computing applications requiring fast processing speeds in compact designs.

FPGA

326080

500

500

25475

1098 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K325T-1FFG900I by Xilinx

XC7K325T-1FFG900I

Xilinx

The Xilinx XC7K325T-1FFG900I is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data center infrastructure.

FPGA

326080

500

500

25475

1098 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K325T-2FBG900C by Xilinx

XC7K325T-2FBG900C

Xilinx

Xilinx XC7K325T-2FBG900C FPGA features 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a wide range of power supplies and operating temperatures. Package style is grid array with square shape and ball terminals for easy surface mounting.

FPGA

326080

500

500

25475

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K325T-2FBG900I by Xilinx

XC7K325T-2FBG900I

Xilinx

Xilinx XC7K325T-2FBG900I FPGA offers 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact 31mm grid array package.

FPGA

326080

500

500

25475

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K325T-2FFG900C by Xilinx

XC7K325T-2FFG900C

Xilinx

Xilinx XC7K325T-2FFG900C FPGA features 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

326080

500

500

25475

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K325T-2FFG900I by Xilinx

XC7K325T-2FFG900I

Xilinx

The Xilinx XC7K325T-2FFG900I is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex designs. With a package style of grid array and CMOS technology, it offers versatile solutions for various electronic systems.

FPGA

326080

500

500

25475

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K325T-3FFG900E by Xilinx

XC7K325T-3FFG900E

Xilinx

Xilinx XC7K325T-3FFG900E is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1412 MHz. It uses CMOS technology and has 500 inputs/outputs. Ideal for high-performance computing applications requiring fast processing speeds.

FPGA

326080

500

500

25475

1412 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K410T-1FBG900C by Xilinx

XC7K410T-1FBG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

406720

500

500

31775

1098 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K410T-1FBG900I by Xilinx

XC7K410T-1FBG900I

Xilinx

Xilinx XC7K410T-1FBG900I FPGA features 406720 logic cells, 31775 CLBs, and a max clock frequency of 1098 MHz. Ideal for high-performance applications requiring advanced programmable ICs with low combinatorial delay and multiple power supply options.

FPGA

406720

500

500

31775

1098 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K410T-1FFG900C by Xilinx

XC7K410T-1FFG900C

Xilinx

Xilinx XC7K410T-1FFG900C FPGA features 406720 logic cells, 31775 CLBs, and a max clock frequency of 1098 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a grid array package style.

FPGA

406720

500

500

31775

1098 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K410T-1FFG900I by Xilinx

XC7K410T-1FFG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1;

FPGA

406720

500

500

31775

1098 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K410T-2FBG900C by Xilinx

XC7K410T-2FBG900C

Xilinx

Xilinx XC7K410T-2FBG900C is a FPGA with 406720 logic cells, 31775 CLBs, and max clock frequency of 1286 MHz. It operates at 1.03V, suitable for high-performance applications like signal processing and data acceleration.

FPGA

406720

500

500

31775

1286 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K410T-2FBG900I by Xilinx

XC7K410T-2FBG900I

Xilinx

Xilinx XC7K410T-2FBG900I FPGA features 406720 logic cells, 31775 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring fast processing speeds and extensive logic capabilities.

FPGA

406720

500

500

31775

1286 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K410T-2FFG900C by Xilinx

XC7K410T-2FFG900C

Xilinx

Xilinx XC7K410T-2FFG900C FPGA features 406720 logic cells, 31775 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a wide range of power supplies and operating temperatures.

FPGA

406720

500

500

31775

1286 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K410T-2FFG900I by Xilinx

XC7K410T-2FFG900I

Xilinx

Xilinx XC7K410T-2FFG900I FPGA features 406720 logic cells, 31775 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a grid array package style.

FPGA

406720

500

500

31775

1286 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K410T-3FBG900E by Xilinx

XC7K410T-3FBG900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

406720

500

500

31775

1412 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K410T-3FFG900E by Xilinx

XC7K410T-3FFG900E

Xilinx

The Xilinx XC7K410T-3FFG900E is a FPGA with 406720 logic cells, 31775 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

406720

500

500

31775

1412 MHz

0.58 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K325T-L2FBG900E by Xilinx

XC7K325T-L2FBG900E

Xilinx

The Xilinx XC7K325T-L2FBG900E is a FPGA with 326080 logic cells, 25475 CLBs, and 500 inputs/outputs. It operates at 0.9V nominal voltage and uses CMOS technology. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package.

FPGA

326080

500

500

25475

0.91 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K325T-L2FFG900E by Xilinx

XC7K325T-L2FFG900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

326080

500

500

25475

0.91 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K410T-L2FFG900E by Xilinx

XC7K410T-L2FFG900E

Xilinx

The Xilinx XC7K410T-L2FFG900E is a FPGA with 406720 logic cells, 31775 CLBs, and 500 inputs/outputs. It operates at 0.9V nominal voltage and supports multiple power supplies (0.9V, 1.8V, 3.3V). Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package style.

FPGA

406720

500

500

31775

0.91 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC7K325T-1FF900I by Xilinx

XC7K325T-1FF900I

Xilinx

The Xilinx XC7K325T-1FF900I is a FPGA with 326080 logic cells, 500 inputs/outputs, and max clock frequency of 1818 MHz. It uses CMOS technology and has supply voltages of 1V, 1.8V, and 3.3V. Ideal for high-performance applications requiring fast processing speeds in compact electronic designs.

FPGA

326080

500

500

326080

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

326080 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC7K410T-2FF900I by Xilinx

XC7K410T-2FF900I

Xilinx

The Xilinx XC7K410T-2FF900I FPGA features 406720 logic cells, 31775 CLBs, and a max clock frequency of 1818 MHz. Ideal for high-performance applications requiring fast processing speeds and extensive programmability in fields like telecommunications, aerospace, and data centers.

FPGA

406720

500

500

31775

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC7K325T-1FB900I by Xilinx

XC7K325T-1FB900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

25475

0.74 ns

25475 CLBS

1

.97 V

1.03 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

XCV1000E-6FG900C by Xilinx

XCV1000E-6FG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

27648

660

660

6144

331776

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

900

S-PBGA-B900

e0

No

XCV1000E-6FG900I by Xilinx

XCV1000E-6FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 331776;

FPGA

27648

660

660

6144

331776

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

900

S-PBGA-B900

e0

No

XCV1600E-6FG900C by Xilinx

XCV1600E-6FG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

34992

700

700

7776

419904

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

7776 CLBS, 419904 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

900

S-PBGA-B900

e0

No

XCV1600E-6FG900I by Xilinx

XCV1600E-6FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

34992

700

700

7776

419904

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

7776 CLBS, 419904 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

900

S-PBGA-B900

e0

No

XCV600E-6FG900I by Xilinx

XCV600E-6FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .47 ns;

FPGA

15552

512

512

3456

186624

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

900

S-PBGA-B900

e0

No

XCV600E-7FG900I by Xilinx

XCV600E-7FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

15552

512

512

3456

186624

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 186624 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

900

S-PBGA-B900

e0

No

LFE2-70E-5FN900C by Lattice Semiconductor

LFE2-70E-5FN900C

Lattice Semiconductor

Lattice Semiconductor's LFE2-70E-5FN900C FPGA boasts 70000 logic cells, 8500 CLBs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with ball terminals.

FPGA

70000

583

583

8500

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

LFE2M100E-5FN900C by Lattice Semiconductor

LFE2M100E-5FN900C

Lattice Semiconductor

Lattice Semiconductor's LFE2M100E-5FN900C FPGA features 100000 logic cells, 416 inputs/outputs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

100000

416

416

311 MHz

0.358 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

LFE2M100E-6FN900I by Lattice Semiconductor

LFE2M100E-6FN900I

Lattice Semiconductor

LFE2M100E-6FN900I by Lattice Semiconductor is a 100000 logic cell FPGA with 416 inputs/outputs, operating at up to 357 MHz. Ideal for industrial applications requiring high-speed processing in a compact 31mm square package with a max supply voltage of 1.26V.

FPGA

100000

416

416

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

LFE2M70E-6FN900C by Lattice Semiconductor

LFE2M70E-6FN900C

Lattice Semiconductor

LFE2M70E-6FN900C by Lattice Semiconductor is a 70000 logic cell FPGA with 8375 CLBs and 416 inputs/outputs. Operating at max clock frequency of 357 MHz, it's ideal for high-speed applications requiring low power consumption. With a package style of grid array and moisture sensitivity level of 3, it suits various industrial needs.

FPGA

70000

416

416

8375

357 MHz

0.331 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX100T-2FG900C by Xilinx

XC6SLX100T-2FG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

498

498

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX100T-2FG900I by Xilinx

XC6SLX100T-2FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

498

498

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX100T-2FGG900C by Xilinx

XC6SLX100T-2FGG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

498

498

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX100T-2FGG900I by Xilinx

XC6SLX100T-2FGG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

498

498

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX100T-3FG900I by Xilinx

XC6SLX100T-3FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

498

498

7911

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

XC6SLX100T-3FGG900C by Xilinx

XC6SLX100T-3FGG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

490

490

7911

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX100T-3FGG900I by Xilinx

XC6SLX100T-3FGG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

498

498

7911

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

No

XC6SLX100T-4FGG900C by Xilinx

XC6SLX100T-4FGG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

498

498

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

900

S-PBGA-B900

e1

No

XC6SLX150-2FG900I by Xilinx

XC6SLX150-2FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

570

570

11519

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No