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XC7K325T-1FFG900C

Xilinx

XC7K325T-1FFG900C by Xilinx

Xilinx XC7K325T-1FFG900C is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1098 MHz. It operates at 0-85°C, uses CMOS technology, and has 500 inputs/outputs. Ideal for high-performance computing applications requiring fast processing speeds in compact designs.

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$2,130.110

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Overview

Unlock the power of innovation with the XC7K325T-1FFG900C by Xilinx, a leading manufacturer of Field Programmable Gate Arrays (FPGA). This cutting-edge device offers 326080 logic cells and 25475 CLBs, providing unparalleled performance and flexibility for a wide range of applications. With a maximum clock frequency of 1098 MHz and a multitude of power supplies, this FPGA is ideal for demanding projects that require speed and efficiency. Trust Xilinx to deliver quality and reliability, while you experience the value and benefits of this exceptional product in your next design venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the FPGA lightweight and cost-effective.

No. of Logic Cells: 326080

With a large number of logic cells, this FPGA allows for complex digital designs and high-performance computing.

Surface Mount: YES

The surface mount capability makes it easy to integrate this FPGA onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

Technology Used: CMOS

The CMOS technology ensures high speed, low power consumption, and compatibility with a wide range of applications.

No. of Inputs: 500

With 500 inputs, this FPGA can handle a large amount of data and input signals, making it suitable for complex applications.

Package Shape: SQUARE

The square package shape provides a symmetrical layout for easier PCB design and integration.

Power Supplies (V): 1, 1.8, 3.3

The availability of multiple power supply options allows for flexibility in designing and operating the FPGA in different scenarios.

No. of Terminals: 900

With 900 terminals, this FPGA offers plenty of connectivity options for interfacing with other components and systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field programmable device, this FPGA can be reconfigured and optimized for specific tasks or applications, providing versatility and adaptability.

Package Style (Meter): GRID ARRAY

The grid array package style ensures secure and reliable connections between the FPGA and the circuit board, enhancing durability and performance.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage allows for operation in low-power environments and extends the range of applications for this FPGA.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand demanding thermal conditions without losing performance or reliability.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals enables precise and compact layout design, facilitating efficient use of space on the PCB.

Maximum Combinatorial Delay of a CLB: 0.74 ns

The low maximum combinatorial delay ensures fast signal processing and minimal delay in logic operations, contributing to high performance.

Organization: 25475 CLBS

With 25475 Configurable Logic Blocks (CLBs), this FPGA offers ample resources for implementing complex logic functions and algorithms.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this FPGA suitable for use in a wide range of environments and conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing ensures good conductivity, corrosion resistance, and durability of connections.

Position Of Terminal: BOTTOM

Placing the terminals at the bottom of the package simplifies the PCB layout and routing, improving signal integrity and ease of assembly.

Moisture Sensitivity Level (MSL): 4

The MSL rating of 4 indicates that this FPGA has a moderate sensitivity to moisture, requiring proper handling and storage to prevent damage.

Maximum Seated Height: 3.35 mm

The low maximum seated height of 3.35 mm allows for compact and slim designs, ideal for space-constrained applications.

Width: 31 mm

The 31mm width offers a good balance between space efficiency and ease of handling during assembly and installation.

Maximum Clock Frequency: 1098 MHz

With a high maximum clock frequency, this FPGA can operate at high speeds, enabling rapid data processing and real-time performance.

No. of Outputs: 500

The presence of 500 outputs allows this FPGA to drive multiple devices and interfaces, supporting complex output configurations and signal routing.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 245°C is 30 seconds, ensuring proper soldering and assembly of the FPGA.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C ensures reliable solder joints and secure connections during the assembly process.

Length: 31 mm

The 31mm length provides a compact form factor for the FPGA, making it suitable for applications where space is limited.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7K325T-1FFG900C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

326080

No. of Inputs:

500

No. of Outputs:

500

No. of CLBs:

25475

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

0.74 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

25475 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

3.35 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7K325T-1FFG900C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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