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LFE2-70E-5FN900C

Lattice Semiconductor

LFE2-70E-5FN900C by Lattice Semiconductor

Lattice Semiconductor's LFE2-70E-5FN900C FPGA boasts 70000 logic cells, 8500 CLBs, and a max clock frequency of 311 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with ball terminals.

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Overview

Unlock limitless possibilities with the LFE2-70E-5FN900C Field Programmable Gate Array by Lattice Semiconductor. Seamlessly blending quality and innovation, this FPGA offers unparalleled performance for a wide range of applications. From telecommunications to automotive electronics, this versatile product delivers unmatched value and benefits, empowering customers to bring their ideas to life with ease. Experience the next level of technology with the LFE2-70E-5FN900C and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, ideal for portable and budget-friendly applications.

No. of Logic Cells: 70000

With a large number of logic cells, this FPGA can handle complex digital designs efficiently, making it suitable for high-performance applications.

Surface Mount: YES

Surface mount compatibility allows for easy and secure mounting on PCBs, simplifying the manufacturing and assembly process.

Maximum Supply Voltage: 1.26 V

Operating within a maximum supply voltage of 1.26V ensures power efficiency and reliability in various operating conditions.

No. of CLBs: 8500

The high number of Configurable Logic Blocks (CLBs) offers flexibility in implementing different logic functions, enhancing the versatility of the FPGA.

No. of Inputs: 583

A large number of inputs provide ample connectivity options, allowing for versatile input configurations in digital circuits.

Nominal Supply Voltage (V): 1.2

Operating at a nominal supply voltage of 1.2V ensures stable performance and compatibility with standard power sources.

Power Supplies (V): 1.2

Consistent power supply voltage of 1.2V supports reliable operation and facilitates compatibility with other components in the system.

No. of Terminals: 900

The abundance of terminals allows for versatile connectivity options and facilitates integration with various system architectures.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) enables reconfigurability, making it ideal for prototyping, testing, and adapting to changing design requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient routing and connectivity layout, optimizing signal integrity and overall performance.

Minimum Supply Voltage: 1.14 V

Operating at a minimum supply voltage of 1.14V ensures compatibility with lower voltage systems while maintaining stable operation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can withstand extended operation in demanding thermal conditions.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for compact packaging and efficient PCB layout, saving space and reducing signal interference.

Maximum Combinatorial Delay of a CLB: 0.358 ns

The low combinatorial delay of 0.358ns in a Configurable Logic Block (CLB) ensures fast signal processing and high-speed operation in digital logic circuits.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can operate in a wide range of environmental conditions without compromising performance.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals ensures reliable connections, corrosion resistance, and efficient signal transmission.

Position Of Terminal: BOTTOM

Bottom terminal positioning simplifies PCB assembly and enhances thermal management by enabling efficient heat dissipation.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring standard handling practices during storage and assembly.

Maximum Seated Height: 2.6 mm

The maximum seated height of 2.6mm allows for compact and low-profile system designs, optimizing space utilization in electronic devices.

Width: 31 mm

A width of 31mm provides a balance between compactness and usability, making the FPGA suitable for various form factors and applications.

Maximum Clock Frequency: 311 MHz

With a maximum clock frequency of 311MHz, this FPGA can handle high-speed data processing and complex computations in real-time applications.

No. of Outputs: 583

A large number of outputs offer flexibility in routing signals and handling multiple data streams, enhancing the functionality of digital circuits.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time of 40 seconds at peak reflow temperature ensures proper soldering and mounting of the FPGA during PCB assembly.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250°C enables reliable and robust soldering connections, ensuring the durability and longevity of the FPGA in operation.

Length: 31 mm

A length of 31mm provides a balanced form factor for ease of integration and compatibility with standard PCB designs, facilitating seamless installation.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFE2-70E-5FN900C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

70000

No. of Inputs:

583

No. of Outputs:

583

No. of CLBs:

8500

Maximum Clock Frequency:

311 MHz

CLB Maximum Delay:

0.358 ns

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

40 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LFE2-70E-5FN900C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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