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XC7K325T-2FBG900C

Xilinx

XC7K325T-2FBG900C by Xilinx

Xilinx XC7K325T-2FBG900C FPGA features 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a wide range of power supplies and operating temperatures. Package style is grid array with square shape and ball terminals for easy surface mounting.

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Overview

Unlock limitless possibilities with the Xilinx XC7K325T-2FBG900C Field Programmable Gate Array (FPGA). Manufactured by Xilinx, a renowned leader in cutting-edge technology, this FPGA offers unparalleled quality and reliability. With over 326,000 logic cells and 25,475 CLBs, this versatile device is perfect for a wide range of applications. Whether you're designing high-performance computing systems, telecommunications equipment, or industrial automation solutions, the XC7K325T-2FBG900C provides unmatched flexibility and efficiency. Embrace innovation and elevate your projects to new heights with Xilinx's top-of-the-line FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and durable, making it suitable for a wide range of applications.

No. of Logic Cells: 326080

With a large number of logic cells, this FPGA can handle complex and high-performance tasks efficiently.

Surface Mount: YES

The surface mount capability allows for easy and secure mounting on a PCB, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage requirement helps in reducing power consumption and heat generation.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the FPGA.

No. of Inputs: 500

Having a large number of inputs allows for more flexibility and connectivity in designing complex digital circuits.

Package Shape: SQUARE

The square package shape helps in optimizing PCB layout and component placement for efficient utilization of space.

Form Of Terminal: BALL

Ball terminals provide reliable connections for signal routing and ensure good electrical contact with other components on the PCB.

Power Supplies (V): 1, 1.8, 3.3

Support for multiple power supply voltages offers compatibility with various voltage requirements, making the FPGA versatile in different applications.

No. of Terminals: 900

Having a high number of terminals enables efficient connectivity and signal routing, making the FPGA suitable for complex circuit designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, this FPGA allows for customization and reconfiguration of logic functions, offering flexibility in system design.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates easy mounting and soldering on a PCB, ensuring reliable connections and robust mechanical support.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage requirement allows for operation in low-power environments and contributes to energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in harsh environments and under varying temperature conditions.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals provides a suitable spacing for connections, allowing for efficient routing and signal integrity.

Maximum Combinatorial Delay of a CLB: 0.61 ns

The low maximum combinatorial delay of a Configurable Logic Block (CLB) ensures fast signal processing and reduces overall system latency.

Organization: 25475 CLBS

With a large number of Configurable Logic Blocks (CLBs), this FPGA offers high flexibility and scalability in implementing complex logic functions and algorithms.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range allows for reliable performance in cold environments, making the FPGA suitable for a wide range of applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of Tin, Silver, and Copper finishing on terminals ensures good conductivity, corrosion resistance, and reliable connections for long-term performance.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom of the package simplifies PCB layout and assembly, making it easier to integrate the FPGA into a system.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that the FPGA can withstand exposure to high humidity levels during storage and handling, ensuring product reliability.

Maximum Seated Height: 2.54 mm

The low maximum seated height allows for compact PCB designs and efficient use of vertical space in electronic systems.

Width: 31 mm

The moderate width of the FPGA package enables easy integration into PCB layouts and ensures compatibility with standard board sizes.

Maximum Clock Frequency: 1818 MHz

The high maximum clock frequency capability allows for fast signal processing and high-speed operation, making the FPGA suitable for demanding applications.

No. of Outputs: 500

Having a large number of outputs provides flexibility in routing signals and connecting to external components, enhancing the versatility of the FPGA.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and thermal management during assembly, leading to reliable connections.

Peak Reflow Temperature °C: 245

The high peak reflow temperature capability of 245°C allows for effective soldering and thermal bonding during PCB assembly, ensuring robust mechanical connections.

Length: 31 mm

The moderate length of the FPGA package offers compatibility with standard PCB sizes and facilitates easy integration into electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7K325T-2FBG900C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

326080

No. of Inputs:

500

No. of Outputs:

500

No. of CLBs:

25475

Maximum Clock Frequency:

1818 MHz

CLB Maximum Delay:

0.61 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

25475 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2.54 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7K325T-2FBG900C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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