Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XC7K325T-2FBG900C FPGA features 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a wide range of power supplies and operating temperatures. Package style is grid array with square shape and ball terminals for easy surface mounting.
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The use of plastic/epoxy material makes the FPGA lightweight and durable, making it suitable for a wide range of applications.
With a large number of logic cells, this FPGA can handle complex and high-performance tasks efficiently.
The surface mount capability allows for easy and secure mounting on a PCB, saving space and simplifying the assembly process.
The low maximum supply voltage requirement helps in reducing power consumption and heat generation.
CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the FPGA.
Having a large number of inputs allows for more flexibility and connectivity in designing complex digital circuits.
The square package shape helps in optimizing PCB layout and component placement for efficient utilization of space.
Ball terminals provide reliable connections for signal routing and ensure good electrical contact with other components on the PCB.
Support for multiple power supply voltages offers compatibility with various voltage requirements, making the FPGA versatile in different applications.
Having a high number of terminals enables efficient connectivity and signal routing, making the FPGA suitable for complex circuit designs.
Being a field programmable device, this FPGA allows for customization and reconfiguration of logic functions, offering flexibility in system design.
The grid array package style facilitates easy mounting and soldering on a PCB, ensuring reliable connections and robust mechanical support.
The low minimum supply voltage requirement allows for operation in low-power environments and contributes to energy efficiency.
The high maximum operating temperature range ensures reliable performance in harsh environments and under varying temperature conditions.
The 1mm pitch of terminals provides a suitable spacing for connections, allowing for efficient routing and signal integrity.
The low maximum combinatorial delay of a Configurable Logic Block (CLB) ensures fast signal processing and reduces overall system latency.
With a large number of Configurable Logic Blocks (CLBs), this FPGA offers high flexibility and scalability in implementing complex logic functions and algorithms.
The low minimum operating temperature range allows for reliable performance in cold environments, making the FPGA suitable for a wide range of applications.
The use of Tin, Silver, and Copper finishing on terminals ensures good conductivity, corrosion resistance, and reliable connections for long-term performance.
Having terminals positioned at the bottom of the package simplifies PCB layout and assembly, making it easier to integrate the FPGA into a system.
The MSL 4 rating indicates that the FPGA can withstand exposure to high humidity levels during storage and handling, ensuring product reliability.
The low maximum seated height allows for compact PCB designs and efficient use of vertical space in electronic systems.
The moderate width of the FPGA package enables easy integration into PCB layouts and ensures compatibility with standard board sizes.
The high maximum clock frequency capability allows for fast signal processing and high-speed operation, making the FPGA suitable for demanding applications.
Having a large number of outputs provides flexibility in routing signals and connecting to external components, enhancing the versatility of the FPGA.
The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and thermal management during assembly, leading to reliable connections.
The high peak reflow temperature capability of 245°C allows for effective soldering and thermal bonding during PCB assembly, ensuring robust mechanical connections.
The moderate length of the FPGA package offers compatibility with standard PCB sizes and facilitates easy integration into electronic systems.
Field Programmable Gate Arrays (FPGA) XC7K325T-2FBG900C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC7K325T-2FBG900C Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Dev Material Chg 16/Dec/2019 Product Marking Chg 31/Oct/2016
PCN Packaging - Mult Devices 26/Jun/2017
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
LM358N
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM78L05ACMX/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
2N2222A
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
1N4148WT
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Itt Cannon
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Filter Feature: NO;
1N4148
Won-top Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32F103C8T6
STMicroelectronics
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
Sangdest Microelectronics (Nanjing)
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
International Semiconductor
STM32H743ZIT6
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
10CX150YF672E6G
Intel
Intel's 10CX150YF672E6G FPGA boasts 150,000 logic cells and 54,770 CLBs. Operating b/w 0-100°C with a supply voltage range of 0.87-0.93V, it offers 236 inputs/outputs for various applications requiring high-performance programmable ICs in a square grid array package.
10CL016YF484C8G
Intel's 10CL016YF484C8G is a FPGA with 963 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. It features a grid array package style, square shape, and ball terminals. Ideal for applications requiring high flexibility and customization in electronic circuit design.
10M02SCM153C8G
Intel 10M02SCM153C8G FPGA features 2000 logic cells, 125 CLBs, and 246 inputs/outputs. With a supply voltage range of 2.85V to 3.15V, it is ideal for applications requiring high-performance programmable ICs in a compact square package with ball terminals.
EP2C8T144C8N
Altera
EP2C8T144C8N is a Field Programmable Gate Array (FPGA) by Altera. It has 8256 logic cells, 516 CLBs, and operates at a maximum clock frequency of 402.5 MHz. It is commonly used in applications requiring programmable ICs for digital logic design.
LFE5U-25F-7BG256I
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
XC7A50T-1FGG484I
Xilinx
The Xilinx XC7A50T-1FGG484I is a FPGA with 52160 logic cells, 4075 CLBs, and operates at a max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC6SLX25-2CSG324C
Xilinx XC6SLX25-2CSG324C FPGA features 24051 logic cells, 1879 CLBs, and 226 inputs/outputs. Utilized in applications requiring high-speed processing such as telecommunications, networking, and industrial automation due to its max clock frequency of 667 MHz and low profile grid array package style.
XC6SLX4-2CSG225C
Xilinx XC6SLX4-2CSG225C FPGA features 3840 logic cells, 300 CLBs, and 120 inputs/outputs. Utilized in applications requiring high clock frequencies up to 667 MHz, such as telecommunications and networking equipment due to its low profile grid array package style. Operating temperature ranges from 0°C to 85°C with a max supply voltage of 1.26 V.
10M08DCF256C8G
The Intel 10M08DCF256C8G is a Field Programmable Gate Array (FPGA) with 8000 logic cells and 500 configurable logic blocks (CLBs). It operates at a max supply voltage of 1.25V and is suitable for applications requiring programmable ICs in various industries.
XC6SLX75-2FGG484I
Xilinx XC6SLX75-2FGG484I FPGA offers 74637 logic cells, 5831 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
XC7S15-1CSGA225I
Xilinx XC7S15-1CSGA225I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a low profile grid array package style.
LFE5UM-25F-6BG381I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
M2GL060-FCSG325I
Microchip Technology
M2GL060-FCSG325I by Microchip Technology is a FPGA with 56520 logic cells, 200 inputs/outputs, and operates at -40 to 100°C. It features a grid array package style, 0.5mm terminal pitch, and plastic/epoxy body material. Ideal for applications requiring high-speed data processing and programmable logic functions in various industries.
XC7S50-1CSGA324C
Xilinx XC7S50-1CSGA324C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.
10CL025YU256C8G
Intel's 10CL025YU256C8G FPGA features 1539 CLBs, operates at 1.2V, and has a max supply voltage of 1.25V. Ideal for applications requiring high-performance computing in a compact form factor with a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.
LFXP2-8E-5QN208C
LFXP2-8E-5QN208C by Lattice Semiconductor is a 1.2V FPGA with 8000 logic cells, 1000 CLBs, and 146 inputs/outputs. It operates at up to 435MHz clock frequency and has a max operating temperature of 85°C. Ideal for applications requiring high-speed processing in compact designs.
10M16DAF256A7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC7K325T-2FFG900I
The Xilinx XC7K325T-2FFG900I is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex designs. With a package style of grid array and CMOS technology, it offers versatile solutions for various electronic systems.
XC7S25-2FTGB196I
Xilinx XC7S25-2FTGB196I FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption.
XCAU20P-L1FFVB676I
FIELD PROGRAMMABLE GATE ARRAY;
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XC7K160T-2FFG676I
Xilinx XC7K160T-2FFG676I FPGA features 162240 logic cells, 12675 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
XC7K160T-1FBG676C
The Xilinx XC7K160T-1FBG676C is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1098 MHz. It operates at supply voltages of 1V to 3.3V and is used in applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
XC7K160T-2FFG676C
The Xilinx XC7K160T-2FFG676C is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1818 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC7K410T-1FBG676I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;
XC7K325T-2FFG900C
Xilinx XC7K325T-2FFG900C FPGA features 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
XC7K160T-1FFG676C
XC7K160T-1FFG676C by Xilinx is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1098 MHz. It operates at supply voltages ranging from 0.97V to 3.3V and is used in applications requiring high-speed processing and programmable ICs.
XC7K325T-1FB676I
XC7K325T-1FB676I by Xilinx is a CMOS-based FPGA with 326080 logic cells and a max clock frequency of 1818 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities.
XC7K160T-1FFG676I
The Xilinx XC7K160T-1FFG676I is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
XC7K325T-2FFG676I
Xilinx XC7K325T-2FFG676I is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. It's used in industrial applications requiring high-speed processing and programmable ICs for versatile functionality.
XC7K410T-2FFG900I
Xilinx XC7K410T-2FFG900I FPGA features 406720 logic cells, 31775 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a grid array package style.
XC7K325T-3FFG900E
Xilinx XC7K325T-3FFG900E is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1412 MHz. It uses CMOS technology and has 500 inputs/outputs. Ideal for high-performance computing applications requiring fast processing speeds.
XC7K160T-3FBG676E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .58 ns;
XC7K325T-L2FFG900I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .97 V;
XC7K160T-1FBG676I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XC7K325T-2FF900I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
XC7K325T-3FFG676E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1;
XC7K160T-2FBG676I
The Xilinx XC7K160T-2FBG676I is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1286 MHz. It uses CMOS technology and has 400 inputs/outputs. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
XC7K70T-1FBG484C
Xilinx XC7K70T-1FBG484C FPGA features 65600 logic cells, 5125 CLBs, and max clock frequency of 1098 MHz. Ideal for high-performance applications requiring advanced programmable ICs with low power consumption and fast combinatorial delay.
XC7K325T-1FFG900I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Width: 31 mm;
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